JP2017506828A5 - - Google Patents

Download PDF

Info

Publication number
JP2017506828A5
JP2017506828A5 JP2016551295A JP2016551295A JP2017506828A5 JP 2017506828 A5 JP2017506828 A5 JP 2017506828A5 JP 2016551295 A JP2016551295 A JP 2016551295A JP 2016551295 A JP2016551295 A JP 2016551295A JP 2017506828 A5 JP2017506828 A5 JP 2017506828A5
Authority
JP
Japan
Prior art keywords
fluid
electrostatic
fluids
electrostatic chuck
flushing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016551295A
Other languages
English (en)
Japanese (ja)
Other versions
JP6590820B2 (ja
JP2017506828A (ja
Filing date
Publication date
Priority claimed from US14/178,681 external-priority patent/US20150228514A1/en
Application filed filed Critical
Publication of JP2017506828A publication Critical patent/JP2017506828A/ja
Publication of JP2017506828A5 publication Critical patent/JP2017506828A5/ja
Application granted granted Critical
Publication of JP6590820B2 publication Critical patent/JP6590820B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2016551295A 2014-02-12 2015-02-06 広温度範囲チャックに対する複数流体冷却システム Expired - Fee Related JP6590820B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/178,681 US20150228514A1 (en) 2014-02-12 2014-02-12 Multi Fluid Cooling System for Large Temperature Range Chuck
US14/178,681 2014-02-12
PCT/US2015/014793 WO2015123105A1 (en) 2014-02-12 2015-02-06 Multi fluid cooling system for large temperaure range chuck

Publications (3)

Publication Number Publication Date
JP2017506828A JP2017506828A (ja) 2017-03-09
JP2017506828A5 true JP2017506828A5 (enExample) 2019-08-08
JP6590820B2 JP6590820B2 (ja) 2019-10-16

Family

ID=52474123

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016551295A Expired - Fee Related JP6590820B2 (ja) 2014-02-12 2015-02-06 広温度範囲チャックに対する複数流体冷却システム

Country Status (6)

Country Link
US (1) US20150228514A1 (enExample)
JP (1) JP6590820B2 (enExample)
KR (1) KR102341279B1 (enExample)
CN (1) CN105981152B (enExample)
TW (1) TWI743020B (enExample)
WO (1) WO2015123105A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102756397B1 (ko) 2015-10-06 2025-01-16 에이에스엠엘 홀딩 엔.브이. 리소그래피 장치의 물체를 유지하는 척과 클램프 및 리소그래피 장치의 클램프에 의해 유지되는 물체의 온도를 제어하는 방법
WO2017210178A1 (en) * 2016-06-02 2017-12-07 Axcelis Technologies, Inc. Apparatus and method for heating or cooling a wafer
US10509321B2 (en) * 2018-01-30 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Temperature controlling apparatus and method for forming coating layer
CN111785674B (zh) * 2020-07-15 2023-09-08 北京北方华创微电子装备有限公司 一种半导体工艺设备
CN115116887B (zh) * 2021-03-17 2025-08-19 芝浦机械电子装置株式会社 有机膜形成装置、及有机膜形成装置的清洁方法
CN117337482A (zh) * 2021-05-10 2024-01-02 应用材料公司 具有金属基质复合材料的高温基座

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2741906B2 (ja) * 1989-05-31 1998-04-22 株式会社日立製作所 真空処理方法及び装置
JPH03190125A (ja) * 1989-12-19 1991-08-20 Fujitsu Ltd ドライエッチング装置
JPH0737862A (ja) * 1991-07-08 1995-02-07 Fujitsu Ltd 低温処理装置
US5810933A (en) * 1996-02-16 1998-09-22 Novellus Systems, Inc. Wafer cooling device
WO1998005060A1 (en) * 1996-07-31 1998-02-05 The Board Of Trustees Of The Leland Stanford Junior University Multizone bake/chill thermal cycling module
JPH11231946A (ja) * 1998-02-10 1999-08-27 Komatsu Ltd 多段蓄熱タンクの温度制御装置
US6353210B1 (en) * 2000-04-11 2002-03-05 Applied Materials Inc. Correction of wafer temperature drift in a plasma reactor based upon continuous wafer temperature measurements using and in-situ wafer temperature optical probe
US6922324B1 (en) * 2000-07-10 2005-07-26 Christopher M. Horwitz Remote powering of electrostatic chucks
JP3973853B2 (ja) * 2001-03-28 2007-09-12 大日本スクリーン製造株式会社 熱処理装置
US20040187787A1 (en) * 2003-03-31 2004-09-30 Dawson Keith E. Substrate support having temperature controlled substrate support surface
US7993460B2 (en) * 2003-06-30 2011-08-09 Lam Research Corporation Substrate support having dynamic temperature control
JP2006261541A (ja) * 2005-03-18 2006-09-28 Tokyo Electron Ltd 基板載置台、基板処理装置および基板処理方法
US20070091541A1 (en) * 2005-10-20 2007-04-26 Applied Materials, Inc. Method of processing a workpiece in a plasma reactor using feed forward thermal control
JP5032269B2 (ja) * 2007-11-02 2012-09-26 東京エレクトロン株式会社 被処理基板の温度調節装置及び温度調節方法、並びにこれを備えたプラズマ処理装置
JP2009177070A (ja) * 2008-01-28 2009-08-06 Toshiba Corp 半導体製造装置
US20100116788A1 (en) * 2008-11-12 2010-05-13 Lam Research Corporation Substrate temperature control by using liquid controlled multizone substrate support
JP5519992B2 (ja) * 2009-10-14 2014-06-11 東京エレクトロン株式会社 基板載置台の温度制御システム及びその温度制御方法
KR101108337B1 (ko) * 2009-12-31 2012-01-25 주식회사 디엠에스 2단의 냉매 유로를 포함하는 정전척의 온도제어장치
US8410393B2 (en) * 2010-05-24 2013-04-02 Lam Research Corporation Apparatus and method for temperature control of a semiconductor substrate support
JP5912439B2 (ja) * 2011-11-15 2016-04-27 東京エレクトロン株式会社 温度制御システム、半導体製造装置及び温度制御方法
JP5957248B2 (ja) * 2012-03-07 2016-07-27 株式会社アルバック 基板保持装置の再生方法
JP5951384B2 (ja) * 2012-07-20 2016-07-13 東京エレクトロン株式会社 温度制御システムへの温調流体供給方法及び記憶媒体
KR101975007B1 (ko) * 2018-09-19 2019-05-07 (주)본씨앤아이 반도체 설비 냉각용 냉각 시스템

Similar Documents

Publication Publication Date Title
JP6590820B2 (ja) 広温度範囲チャックに対する複数流体冷却システム
JP2017506828A5 (enExample)
JP6313753B2 (ja) 不活性気圧の前冷却および後加熱
JP6574020B2 (ja) コンダクタンス制御を有する化学蒸着装置
KR102126367B1 (ko) 진공식 고속 예냉 스테이션 및 후열 스테이션
US20190326138A1 (en) Ceramic wafer heater with integrated pressurized helium cooling
TWI552255B (zh) 用於靜電夾具之匹配的熱膨脹係數
CN105655272B (zh) 反应腔室及半导体加工设备
KR20130023193A (ko) 챔버로 가스를 방사상으로 전달하기 위한 장치 및 그 이용 방법들
CN113363189B (zh) 用于减少基板处理夹盘冷凝的气流
JP2002217178A (ja) 処理装置及び処理方法
JP6267201B2 (ja) 真空下での高速前冷却および後加熱ステーション
TWI647785B (zh) 恒定質量流多層次冷卻劑路徑之靜電式夾具
KR102411194B1 (ko) 냉매의 양방향 흐름이 가능한 정전척 어셈블리 및 이를 구비한 반도체 제조장치
US9607803B2 (en) High throughput cooled ion implantation system and method
CN103299415B (zh) 静电钳与离子布植系统
CN106575619B (zh) 多基板热管理设备
US20250183085A1 (en) Large range heated electrostatic chuck
CN111566795B (zh) 通过腔室泵抽和吹扫降低释气对处理腔室的影响
TW202538804A (zh) 大範圍加熱靜電夾吸盤
KR102290913B1 (ko) 기판 처리 장치
JP2005167107A (ja) 半導体製造装置及び半導体装置の製造方法