JP2017505385A - 銅箔、これを含む電気部品及び電池 - Google Patents

銅箔、これを含む電気部品及び電池 Download PDF

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Publication number
JP2017505385A
JP2017505385A JP2016561982A JP2016561982A JP2017505385A JP 2017505385 A JP2017505385 A JP 2017505385A JP 2016561982 A JP2016561982 A JP 2016561982A JP 2016561982 A JP2016561982 A JP 2016561982A JP 2017505385 A JP2017505385 A JP 2017505385A
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JP
Japan
Prior art keywords
copper foil
surface treatment
layer
metal oxide
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016561982A
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English (en)
Japanese (ja)
Other versions
JP2017505385A5 (enrdf_load_stackoverflow
Inventor
ボム，ウォン−ジン
チェー，ウン−シル
ソン，キ−ドク
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Iljin Materials Co Ltd
Original Assignee
Iljin Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iljin Materials Co Ltd filed Critical Iljin Materials Co Ltd
Publication of JP2017505385A publication Critical patent/JP2017505385A/ja
Publication of JP2017505385A5 publication Critical patent/JP2017505385A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2016561982A 2013-12-30 2014-12-26 銅箔、これを含む電気部品及び電池 Pending JP2017505385A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2013-0166914 2013-12-30
KR1020130166914A KR20150077943A (ko) 2013-12-30 2013-12-30 동박, 이를 포함하는 전기부품 및 전지
PCT/KR2014/012941 WO2015102322A1 (ko) 2013-12-30 2014-12-26 동박, 이를 포함하는 전기부품 및 전지

Publications (2)

Publication Number Publication Date
JP2017505385A true JP2017505385A (ja) 2017-02-16
JP2017505385A5 JP2017505385A5 (enrdf_load_stackoverflow) 2017-09-07

Family

ID=53493612

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016561982A Pending JP2017505385A (ja) 2013-12-30 2014-12-26 銅箔、これを含む電気部品及び電池

Country Status (4)

Country Link
JP (1) JP2017505385A (enrdf_load_stackoverflow)
KR (1) KR20150077943A (enrdf_load_stackoverflow)
CN (1) CN105873759A (enrdf_load_stackoverflow)
WO (1) WO2015102322A1 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105002530A (zh) * 2015-08-10 2015-10-28 灵宝华鑫铜箔有限责任公司 一种提高铜箔高温防氧化性能的表面处理工艺

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0641761A (ja) * 1992-07-28 1994-02-15 Matsushita Electric Works Ltd 銅箔の表面処理法
JP2002368365A (ja) * 2001-06-04 2002-12-20 Nikko Materials Co Ltd 銅又は銅合金の支持体を備えた複合銅箔及び該複合銅箔を使用したプリント基板
WO2004049476A1 (ja) * 2002-11-27 2004-06-10 Mitsui Mining & Smelting Co., Ltd. 非水電解液二次電池用負極集電体およびその製造方法
JP2005344207A (ja) * 2004-06-02 2005-12-15 Iljin Copper Foil Co Ltd 電磁波遮蔽用黒化表面処理銅箔の製造方法
WO2006004299A1 (en) * 2004-04-02 2006-01-12 Iljin Copper Foil Co., Ltd. Method for manufacturing black surface-treated copper foil for emi shield
JP2009117706A (ja) * 2007-11-08 2009-05-28 Hitachi Cable Ltd フレキシブルプリント配線板用銅箔及びその製造方法、並びにフレキシブルプリント配線板
JP2012033475A (ja) * 2010-06-28 2012-02-16 Furukawa Electric Co Ltd:The 電解銅箔、リチウムイオン二次電池用電解銅箔、該電解銅箔を用いたリチウムイオン二次電池用電極、該電極を使用したリチウムイオン二次電池
WO2013002279A1 (ja) * 2011-06-30 2013-01-03 古河電気工業株式会社 電解銅箔、該電解銅箔の製造方法及び該電解銅箔を集電体とするリチウムイオン二次電池

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7026059B2 (en) * 2000-09-22 2006-04-11 Circuit Foil Japan Co., Ltd. Copper foil for high-density ultrafine printed wiring boad
JP3973197B2 (ja) * 2001-12-20 2007-09-12 三井金属鉱業株式会社 キャリア箔付電解銅箔及びその製造方法
US6852427B1 (en) * 2003-09-02 2005-02-08 Olin Corporation Chromium-free antitarnish adhesion promoting treatment composition
KR100603428B1 (ko) * 2004-04-01 2006-07-20 일진소재산업주식회사 전자파 차폐용 흑화표면처리 동박의 제조방법
JP4994634B2 (ja) * 2004-11-11 2012-08-08 パナソニック株式会社 リチウムイオン二次電池用負極、その製造方法、およびそれを用いたリチウムイオン二次電池
MY151361A (en) * 2008-06-17 2014-05-15 Jx Nippon Mining & Metals Corp Copper foil for printed circuit board and copper clad laminate for printed circuit board
KR101168613B1 (ko) * 2009-12-21 2012-07-30 엘에스엠트론 주식회사 표면처리층의 구조가 개선된 전해동박 및 그 제조방법과, 동장적층판 및 인쇄회로기판

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0641761A (ja) * 1992-07-28 1994-02-15 Matsushita Electric Works Ltd 銅箔の表面処理法
JP2002368365A (ja) * 2001-06-04 2002-12-20 Nikko Materials Co Ltd 銅又は銅合金の支持体を備えた複合銅箔及び該複合銅箔を使用したプリント基板
WO2004049476A1 (ja) * 2002-11-27 2004-06-10 Mitsui Mining & Smelting Co., Ltd. 非水電解液二次電池用負極集電体およびその製造方法
WO2006004299A1 (en) * 2004-04-02 2006-01-12 Iljin Copper Foil Co., Ltd. Method for manufacturing black surface-treated copper foil for emi shield
JP2007531820A (ja) * 2004-04-02 2007-11-08 イルジン コッパー ホイル カンパニー リミテッド 電磁波遮蔽用黒化表面処理銅箔の製造方法
JP2005344207A (ja) * 2004-06-02 2005-12-15 Iljin Copper Foil Co Ltd 電磁波遮蔽用黒化表面処理銅箔の製造方法
JP2009117706A (ja) * 2007-11-08 2009-05-28 Hitachi Cable Ltd フレキシブルプリント配線板用銅箔及びその製造方法、並びにフレキシブルプリント配線板
JP2012033475A (ja) * 2010-06-28 2012-02-16 Furukawa Electric Co Ltd:The 電解銅箔、リチウムイオン二次電池用電解銅箔、該電解銅箔を用いたリチウムイオン二次電池用電極、該電極を使用したリチウムイオン二次電池
WO2013002279A1 (ja) * 2011-06-30 2013-01-03 古河電気工業株式会社 電解銅箔、該電解銅箔の製造方法及び該電解銅箔を集電体とするリチウムイオン二次電池

Also Published As

Publication number Publication date
CN105873759A (zh) 2016-08-17
KR20150077943A (ko) 2015-07-08
WO2015102322A1 (ko) 2015-07-09

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