KR20150077943A - 동박, 이를 포함하는 전기부품 및 전지 - Google Patents

동박, 이를 포함하는 전기부품 및 전지 Download PDF

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Publication number
KR20150077943A
KR20150077943A KR1020130166914A KR20130166914A KR20150077943A KR 20150077943 A KR20150077943 A KR 20150077943A KR 1020130166914 A KR1020130166914 A KR 1020130166914A KR 20130166914 A KR20130166914 A KR 20130166914A KR 20150077943 A KR20150077943 A KR 20150077943A
Authority
KR
South Korea
Prior art keywords
copper foil
surface treatment
treatment layer
layer
metal oxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020130166914A
Other languages
English (en)
Korean (ko)
Inventor
범원진
최은실
송기덕
Original Assignee
일진머티리얼즈 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 일진머티리얼즈 주식회사 filed Critical 일진머티리얼즈 주식회사
Priority to KR1020130166914A priority Critical patent/KR20150077943A/ko
Priority to CN201480071796.8A priority patent/CN105873759A/zh
Priority to JP2016561982A priority patent/JP2017505385A/ja
Priority to PCT/KR2014/012941 priority patent/WO2015102322A1/ko
Publication of KR20150077943A publication Critical patent/KR20150077943A/ko
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
KR1020130166914A 2013-12-30 2013-12-30 동박, 이를 포함하는 전기부품 및 전지 Ceased KR20150077943A (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020130166914A KR20150077943A (ko) 2013-12-30 2013-12-30 동박, 이를 포함하는 전기부품 및 전지
CN201480071796.8A CN105873759A (zh) 2013-12-30 2014-12-26 铜箔、包含该铜箔的电气部件以及电池
JP2016561982A JP2017505385A (ja) 2013-12-30 2014-12-26 銅箔、これを含む電気部品及び電池
PCT/KR2014/012941 WO2015102322A1 (ko) 2013-12-30 2014-12-26 동박, 이를 포함하는 전기부품 및 전지

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130166914A KR20150077943A (ko) 2013-12-30 2013-12-30 동박, 이를 포함하는 전기부품 및 전지

Publications (1)

Publication Number Publication Date
KR20150077943A true KR20150077943A (ko) 2015-07-08

Family

ID=53493612

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130166914A Ceased KR20150077943A (ko) 2013-12-30 2013-12-30 동박, 이를 포함하는 전기부품 및 전지

Country Status (4)

Country Link
JP (1) JP2017505385A (enrdf_load_stackoverflow)
KR (1) KR20150077943A (enrdf_load_stackoverflow)
CN (1) CN105873759A (enrdf_load_stackoverflow)
WO (1) WO2015102322A1 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105002530A (zh) * 2015-08-10 2015-10-28 灵宝华鑫铜箔有限责任公司 一种提高铜箔高温防氧化性能的表面处理工艺

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0641761A (ja) * 1992-07-28 1994-02-15 Matsushita Electric Works Ltd 銅箔の表面処理法
US7026059B2 (en) * 2000-09-22 2006-04-11 Circuit Foil Japan Co., Ltd. Copper foil for high-density ultrafine printed wiring boad
JP4672907B2 (ja) * 2001-06-04 2011-04-20 Ｊｘ日鉱日石金属株式会社 銅又は銅合金の支持体を備えた複合銅箔及び該複合銅箔を使用したプリント基板
JP3973197B2 (ja) * 2001-12-20 2007-09-12 三井金属鉱業株式会社 キャリア箔付電解銅箔及びその製造方法
WO2004049476A1 (ja) * 2002-11-27 2004-06-10 Mitsui Mining & Smelting Co., Ltd. 非水電解液二次電池用負極集電体およびその製造方法
US6852427B1 (en) * 2003-09-02 2005-02-08 Olin Corporation Chromium-free antitarnish adhesion promoting treatment composition
KR100603428B1 (ko) * 2004-04-01 2006-07-20 일진소재산업주식회사 전자파 차폐용 흑화표면처리 동박의 제조방법
KR100604964B1 (ko) * 2004-04-02 2006-07-26 일진소재산업주식회사 전자파 차폐용 흑화표면처리 동박의 제조방법
KR100633790B1 (ko) * 2004-06-02 2006-10-16 일진소재산업주식회사 전자파 차폐용 흑화표면처리 동박의 제조방법과 그 동박및 이를 사용하여 제조된 복합재료
JP4994634B2 (ja) * 2004-11-11 2012-08-08 パナソニック株式会社 リチウムイオン二次電池用負極、その製造方法、およびそれを用いたリチウムイオン二次電池
JP2009117706A (ja) * 2007-11-08 2009-05-28 Hitachi Cable Ltd フレキシブルプリント配線板用銅箔及びその製造方法、並びにフレキシブルプリント配線板
MY151361A (en) * 2008-06-17 2014-05-15 Jx Nippon Mining & Metals Corp Copper foil for printed circuit board and copper clad laminate for printed circuit board
KR101168613B1 (ko) * 2009-12-21 2012-07-30 엘에스엠트론 주식회사 표면처리층의 구조가 개선된 전해동박 및 그 제조방법과, 동장적층판 및 인쇄회로기판
JP5128695B2 (ja) * 2010-06-28 2013-01-23 古河電気工業株式会社 電解銅箔、リチウムイオン二次電池用電解銅箔、該電解銅箔を用いたリチウムイオン二次電池用電極、該電極を使用したリチウムイオン二次電池
JP5379928B2 (ja) * 2011-06-30 2013-12-25 古河電気工業株式会社 電解銅箔、該電解銅箔の製造方法及び該電解銅箔を集電体とするリチウムイオン二次電池

Also Published As

Publication number Publication date
CN105873759A (zh) 2016-08-17
JP2017505385A (ja) 2017-02-16
WO2015102322A1 (ko) 2015-07-09

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