JP2017503670A - 構造化表面を有する研磨材料 - Google Patents
構造化表面を有する研磨材料 Download PDFInfo
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- JP2017503670A JP2017503670A JP2016548074A JP2016548074A JP2017503670A JP 2017503670 A JP2017503670 A JP 2017503670A JP 2016548074 A JP2016548074 A JP 2016548074A JP 2016548074 A JP2016548074 A JP 2016548074A JP 2017503670 A JP2017503670 A JP 2017503670A
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- abrasive
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- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920003226 polyurethane urea Polymers 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- WVIICGIFSIBFOG-UHFFFAOYSA-N pyrylium Chemical class C1=CC=[O+]C=C1 WVIICGIFSIBFOG-UHFFFAOYSA-N 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 229910052704 radon Inorganic materials 0.000 description 1
- SYUHGPGVQRZVTB-UHFFFAOYSA-N radon atom Chemical compound [Rn] SYUHGPGVQRZVTB-UHFFFAOYSA-N 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical class CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0605—Carbon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0635—Carbides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/32—Carbides
- C23C16/325—Silicon carbide
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Inorganic Chemistry (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201461931136P | 2014-01-24 | 2014-01-24 | |
| US61/931,136 | 2014-01-24 | ||
| PCT/US2015/012158 WO2015112540A1 (en) | 2014-01-24 | 2015-01-21 | Abrasive material having a structured surface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2017503670A true JP2017503670A (ja) | 2017-02-02 |
| JP2017503670A5 JP2017503670A5 (enrdf_load_stackoverflow) | 2018-03-01 |
Family
ID=53681879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016548074A Withdrawn JP2017503670A (ja) | 2014-01-24 | 2015-01-21 | 構造化表面を有する研磨材料 |
Country Status (6)
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020526407A (ja) * | 2017-07-11 | 2020-08-31 | スリーエム イノベイティブ プロパティズ カンパニー | 適合性コーティングを含む研磨物品及びそれらからのポリッシングシステム |
| JP2020526406A (ja) * | 2017-07-11 | 2020-08-31 | スリーエム イノベイティブ プロパティズ カンパニー | 適合性コーティングを含む研磨物品及びそれによる研磨システム |
| KR20210051264A (ko) * | 2019-10-30 | 2021-05-10 | 에스케이씨솔믹스 주식회사 | 연마패드, 이의 제조방법, 및 이를 이용한 반도체 소자의 제조방법 |
| KR20210054388A (ko) * | 2019-11-05 | 2021-05-13 | 에스케이씨솔믹스 주식회사 | 연마패드, 이의 제조방법 및 이를 이용한 반도체 소자의 제조방법 |
| US11400559B2 (en) | 2019-10-30 | 2022-08-02 | Skc Solmics Co., Ltd. | Polishing pad, process for preparing the same, and process for preparing a semiconductor device using the same |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5921790B1 (ja) * | 2014-07-07 | 2016-05-24 | バンドー化学株式会社 | 研磨フィルム |
| US10967399B2 (en) * | 2016-06-30 | 2021-04-06 | 3M Innovative Properties Company | Fluorocarbon release coating |
| JP6925699B2 (ja) * | 2016-10-04 | 2021-08-25 | 株式会社ディスコ | 平面研削砥石 |
| SG11202000259RA (en) * | 2017-07-11 | 2020-02-27 | 3M Innovative Properties Co | Abrasive articles including conformable coatings and polishing system therefrom |
| US12048980B2 (en) * | 2017-08-25 | 2024-07-30 | 3M Innovative Properties Company | Surface projection polishing pad |
| TWI649775B (zh) * | 2018-01-02 | 2019-02-01 | 台灣積體電路製造股份有限公司 | 離子佈植機及離子佈植機腔室的製造方法 |
| CN110065011A (zh) * | 2018-01-23 | 2019-07-30 | 项刚 | 金刚石砂轮及其制备方法 |
| US11331767B2 (en) | 2019-02-01 | 2022-05-17 | Micron Technology, Inc. | Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods |
| CN110530313B (zh) * | 2019-07-26 | 2021-05-28 | 西安交通大学 | 一种跨量级多尺度线宽标准器及其制备方法 |
| US20210040608A1 (en) * | 2019-08-05 | 2021-02-11 | GM Global Technology Operations LLC | Method for bonding a polymeric material to a substrate |
| US20210185793A1 (en) * | 2019-12-13 | 2021-06-17 | Applied Materials, Inc. | Adhesive material removal from photomask in ultraviolet lithography application |
| US20220178017A1 (en) * | 2020-12-03 | 2022-06-09 | Applied Materials, Inc. | Cfx layer to protect aluminum surface from over-oxidation |
| TWI779728B (zh) * | 2021-07-20 | 2022-10-01 | 大陸商廈門佳品金剛石工業有限公司 | 鑽石修整碟及其製造方法 |
| CN116652825B (zh) * | 2023-07-24 | 2023-11-10 | 北京寰宇晶科科技有限公司 | 一种金刚石cmp抛光垫修整器及其制备方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6015597A (en) * | 1997-11-26 | 2000-01-18 | 3M Innovative Properties Company | Method for coating diamond-like networks onto particles |
| US6458018B1 (en) | 1999-04-23 | 2002-10-01 | 3M Innovative Properties Company | Abrasive article suitable for abrading glass and glass ceramic workpieces |
| JP4519970B2 (ja) | 1999-12-21 | 2010-08-04 | スリーエム イノベイティブ プロパティズ カンパニー | 研磨層が立体構造を有する研磨材料 |
| US6821189B1 (en) * | 2000-10-13 | 2004-11-23 | 3M Innovative Properties Company | Abrasive article comprising a structured diamond-like carbon coating and method of using same to mechanically treat a substrate |
| US20050025973A1 (en) | 2003-07-25 | 2005-02-03 | Slutz David E. | CVD diamond-coated composite substrate containing a carbide-forming material and ceramic phases and method for making same |
| US8080073B2 (en) * | 2007-12-20 | 2011-12-20 | 3M Innovative Properties Company | Abrasive article having a plurality of precisely-shaped abrasive composites |
| EP2240298A4 (en) * | 2007-12-31 | 2014-04-30 | 3M Innovative Properties Co | PLASMA TREATED ABRASIVE ARTICLE AND PROCESS FOR PRODUCING THE SAME |
-
2015
- 2015-01-21 JP JP2016548074A patent/JP2017503670A/ja not_active Withdrawn
- 2015-01-21 KR KR1020167022667A patent/KR20160114627A/ko not_active Withdrawn
- 2015-01-21 CN CN201580005532.7A patent/CN106413986A/zh active Pending
- 2015-01-21 WO PCT/US2015/012158 patent/WO2015112540A1/en active Application Filing
- 2015-01-21 US US15/113,244 patent/US20170008143A1/en not_active Abandoned
- 2015-01-23 TW TW104102413A patent/TW201538272A/zh unknown
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020526407A (ja) * | 2017-07-11 | 2020-08-31 | スリーエム イノベイティブ プロパティズ カンパニー | 適合性コーティングを含む研磨物品及びそれらからのポリッシングシステム |
| JP2020526406A (ja) * | 2017-07-11 | 2020-08-31 | スリーエム イノベイティブ プロパティズ カンパニー | 適合性コーティングを含む研磨物品及びそれによる研磨システム |
| JP7198801B2 (ja) | 2017-07-11 | 2023-01-04 | スリーエム イノベイティブ プロパティズ カンパニー | 適合性コーティングを含む研磨物品及びそれによる研磨システム |
| JP7300441B2 (ja) | 2017-07-11 | 2023-06-29 | スリーエム イノベイティブ プロパティズ カンパニー | 適合性コーティングを含む研磨物品及びそれらからのポリッシングシステム |
| KR20210051264A (ko) * | 2019-10-30 | 2021-05-10 | 에스케이씨솔믹스 주식회사 | 연마패드, 이의 제조방법, 및 이를 이용한 반도체 소자의 제조방법 |
| KR102287923B1 (ko) * | 2019-10-30 | 2021-08-09 | 에스케이씨솔믹스 주식회사 | 연마패드, 이의 제조방법, 및 이를 이용한 반도체 소자의 제조방법 |
| US11400559B2 (en) | 2019-10-30 | 2022-08-02 | Skc Solmics Co., Ltd. | Polishing pad, process for preparing the same, and process for preparing a semiconductor device using the same |
| KR20210054388A (ko) * | 2019-11-05 | 2021-05-13 | 에스케이씨솔믹스 주식회사 | 연마패드, 이의 제조방법 및 이를 이용한 반도체 소자의 제조방법 |
| KR102298114B1 (ko) * | 2019-11-05 | 2021-09-03 | 에스케이씨솔믹스 주식회사 | 연마패드, 이의 제조방법 및 이를 이용한 반도체 소자의 제조방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106413986A (zh) | 2017-02-15 |
| KR20160114627A (ko) | 2016-10-05 |
| US20170008143A1 (en) | 2017-01-12 |
| TW201538272A (zh) | 2015-10-16 |
| WO2015112540A1 (en) | 2015-07-30 |
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