JP2017216325A5 - - Google Patents

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Publication number
JP2017216325A5
JP2017216325A5 JP2016108367A JP2016108367A JP2017216325A5 JP 2017216325 A5 JP2017216325 A5 JP 2017216325A5 JP 2016108367 A JP2016108367 A JP 2016108367A JP 2016108367 A JP2016108367 A JP 2016108367A JP 2017216325 A5 JP2017216325 A5 JP 2017216325A5
Authority
JP
Japan
Prior art keywords
wiring
diode
semiconductor device
input circuit
pad electrically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016108367A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017216325A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2016108367A priority Critical patent/JP2017216325A/ja
Priority claimed from JP2016108367A external-priority patent/JP2017216325A/ja
Priority to US15/480,000 priority patent/US10361557B2/en
Priority to CN201710330480.1A priority patent/CN107452734A/zh
Publication of JP2017216325A publication Critical patent/JP2017216325A/ja
Publication of JP2017216325A5 publication Critical patent/JP2017216325A5/ja
Pending legal-status Critical Current

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JP2016108367A 2016-05-31 2016-05-31 半導体装置 Pending JP2017216325A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2016108367A JP2017216325A (ja) 2016-05-31 2016-05-31 半導体装置
US15/480,000 US10361557B2 (en) 2016-05-31 2017-04-05 Semiconductor device
CN201710330480.1A CN107452734A (zh) 2016-05-31 2017-05-11 半导体器件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016108367A JP2017216325A (ja) 2016-05-31 2016-05-31 半導体装置

Publications (2)

Publication Number Publication Date
JP2017216325A JP2017216325A (ja) 2017-12-07
JP2017216325A5 true JP2017216325A5 (enExample) 2019-01-10

Family

ID=60420677

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016108367A Pending JP2017216325A (ja) 2016-05-31 2016-05-31 半導体装置

Country Status (3)

Country Link
US (1) US10361557B2 (enExample)
JP (1) JP2017216325A (enExample)
CN (1) CN107452734A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106449634B (zh) * 2016-09-23 2019-06-14 矽力杰半导体技术(杭州)有限公司 瞬态电压抑制器及其制造方法
KR20190140216A (ko) * 2018-06-11 2019-12-19 에스케이하이닉스 주식회사 Esd 보호 회로를 포함하는 반도체 집적 회로 장치

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4736271A (en) * 1987-06-23 1988-04-05 Signetics Corporation Protection device utilizing one or more subsurface diodes and associated method of manufacture
JP2792417B2 (ja) * 1993-12-17 1998-09-03 日本電気株式会社 半導体回路の入力保護回路
GB2334633B (en) * 1998-02-21 2002-09-25 Mitel Corp Low leakage electrostatic discharge protection system
JP2001298157A (ja) * 2000-04-14 2001-10-26 Nec Corp 保護回路及びこれを搭載した半導体集積回路
JP2003023084A (ja) 2001-07-05 2003-01-24 Matsushita Electric Ind Co Ltd Ｅｓｄ保護回路
JP4942007B2 (ja) * 2004-10-25 2012-05-30 ルネサスエレクトロニクス株式会社 半導体集積回路
JP5232444B2 (ja) * 2007-11-12 2013-07-10 ルネサスエレクトロニクス株式会社 半導体集積回路
KR101036208B1 (ko) * 2008-12-24 2011-05-20 매그나칩 반도체 유한회사 정전기 방전 보호회로
KR101145785B1 (ko) * 2008-12-26 2012-05-16 에스케이하이닉스 주식회사 집적회로
US20130003242A1 (en) * 2010-07-15 2013-01-03 Kun-Hsien Lin Transient voltage suppressor for multiple pin assignments
JP2013201164A (ja) * 2012-03-23 2013-10-03 Toshiba Corp 半導体装置
JP6308925B2 (ja) * 2014-09-29 2018-04-11 ルネサスエレクトロニクス株式会社 半導体装置

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