JP2017200315A5 - - Google Patents

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Publication number
JP2017200315A5
JP2017200315A5 JP2016089226A JP2016089226A JP2017200315A5 JP 2017200315 A5 JP2017200315 A5 JP 2017200315A5 JP 2016089226 A JP2016089226 A JP 2016089226A JP 2016089226 A JP2016089226 A JP 2016089226A JP 2017200315 A5 JP2017200315 A5 JP 2017200315A5
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JP
Japan
Prior art keywords
semiconductor device
resin mold
cooler
terminal
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016089226A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017200315A (ja
JP6639320B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2016089226A priority Critical patent/JP6639320B2/ja
Priority claimed from JP2016089226A external-priority patent/JP6639320B2/ja
Priority to US16/097,143 priority patent/US11348855B2/en
Priority to PCT/JP2017/016696 priority patent/WO2017188368A1/ja
Publication of JP2017200315A publication Critical patent/JP2017200315A/ja
Publication of JP2017200315A5 publication Critical patent/JP2017200315A5/ja
Application granted granted Critical
Publication of JP6639320B2 publication Critical patent/JP6639320B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2016089226A 2016-04-27 2016-04-27 半導体装置 Expired - Fee Related JP6639320B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2016089226A JP6639320B2 (ja) 2016-04-27 2016-04-27 半導体装置
US16/097,143 US11348855B2 (en) 2016-04-27 2017-04-27 Semiconductor component and power module
PCT/JP2017/016696 WO2017188368A1 (ja) 2016-04-27 2017-04-27 半導体装置及びパワーモジュール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016089226A JP6639320B2 (ja) 2016-04-27 2016-04-27 半導体装置

Publications (3)

Publication Number Publication Date
JP2017200315A JP2017200315A (ja) 2017-11-02
JP2017200315A5 true JP2017200315A5 (OSRAM) 2019-07-25
JP6639320B2 JP6639320B2 (ja) 2020-02-05

Family

ID=60159789

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016089226A Expired - Fee Related JP6639320B2 (ja) 2016-04-27 2016-04-27 半導体装置

Country Status (3)

Country Link
US (1) US11348855B2 (OSRAM)
JP (1) JP6639320B2 (OSRAM)
WO (1) WO2017188368A1 (OSRAM)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020053611A (ja) * 2018-09-28 2020-04-02 三菱電機株式会社 半導体モジュール、および、半導体モジュールの製造方法
WO2020071102A1 (ja) * 2018-10-05 2020-04-09 富士電機株式会社 半導体装置、半導体モジュールおよび車両
JP6760691B1 (ja) * 2019-05-10 2020-09-23 三菱電機株式会社 電力変換装置
JP6752381B1 (ja) * 2019-06-06 2020-09-09 三菱電機株式会社 半導体モジュールおよび電力変換装置
JP7694072B2 (ja) * 2021-03-11 2025-06-18 富士電機株式会社 半導体モジュール
JP7632011B2 (ja) * 2021-04-09 2025-02-19 株式会社デンソー パワーカード
JP7484817B2 (ja) * 2021-06-02 2024-05-16 株式会社デンソー 電気機器
JP7707676B2 (ja) * 2021-06-16 2025-07-15 富士電機株式会社 半導体モジュール
JP7166408B1 (ja) 2021-09-06 2022-11-07 三菱電機株式会社 回転電機
WO2023181412A1 (ja) * 2022-03-25 2023-09-28 日立Astemo株式会社 電力変換装置
JP7439158B2 (ja) * 2022-03-31 2024-02-27 本田技研工業株式会社 電力変換装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH077836B2 (ja) * 1986-10-31 1995-01-30 オムロン株式会社 固体継電器
JPH09129796A (ja) * 1995-10-27 1997-05-16 Rohm Co Ltd 半導体装置
JP3406753B2 (ja) 1995-11-30 2003-05-12 三菱電機株式会社 半導体装置および半導体モジュール
JP2004200264A (ja) * 2002-12-17 2004-07-15 Renesas Technology Corp 半導体装置およびその製造方法
KR101221805B1 (ko) * 2006-03-03 2013-01-14 페어차일드코리아반도체 주식회사 전력 소자용 패키지 및 패키지 어셈블리
JP4840165B2 (ja) * 2007-01-29 2011-12-21 株式会社デンソー 半導体装置
TW201011869A (en) * 2008-09-10 2010-03-16 Cyntec Co Ltd Chip package structure
US8513784B2 (en) 2010-03-18 2013-08-20 Alpha & Omega Semiconductor Incorporated Multi-layer lead frame package and method of fabrication
JP5581822B2 (ja) 2010-06-07 2014-09-03 日産自動車株式会社 半導体装置
JP5257817B2 (ja) * 2010-06-15 2013-08-07 三菱電機株式会社 半導体装置
JP5220245B2 (ja) 2010-12-28 2013-06-26 三菱電機株式会社 電力変換装置
JP5813963B2 (ja) 2011-02-28 2015-11-17 ローム株式会社 半導体装置、および、半導体装置の実装構造
JP5484429B2 (ja) * 2011-11-18 2014-05-07 三菱電機株式会社 電力変換装置
DE102013219192A1 (de) * 2013-09-24 2015-03-26 Conti Temic Microelectronic Gmbh Leistungsmodul, Stromrichter und Antriebsanordnung mit einem Leistungsmodul
JP6125984B2 (ja) 2013-12-11 2017-05-10 トヨタ自動車株式会社 半導体装置

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