JP2017181497A5 - - Google Patents

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JP2017181497A5
JP2017181497A5 JP2017042161A JP2017042161A JP2017181497A5 JP 2017181497 A5 JP2017181497 A5 JP 2017181497A5 JP 2017042161 A JP2017042161 A JP 2017042161A JP 2017042161 A JP2017042161 A JP 2017042161A JP 2017181497 A5 JP2017181497 A5 JP 2017181497A5
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Japan
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inspection
circuit board
information
setting
inspected
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JP2017042161A
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Japanese (ja)
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JP6877025B2 (ja
JP2017181497A (ja
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JP2017042161A 2016-03-23 2017-03-06 回路基板の検査方法、検査装置、及びプログラム Active JP6877025B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016058442 2016-03-23
JP2016058442 2016-03-23

Publications (3)

Publication Number Publication Date
JP2017181497A JP2017181497A (ja) 2017-10-05
JP2017181497A5 true JP2017181497A5 (enExample) 2020-04-09
JP6877025B2 JP6877025B2 (ja) 2021-05-26

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JP2017042161A Active JP6877025B2 (ja) 2016-03-23 2017-03-06 回路基板の検査方法、検査装置、及びプログラム

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JP (1) JP6877025B2 (enExample)
KR (1) KR101966513B1 (enExample)
CN (1) CN107229011B (enExample)
TW (1) TWI625531B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019211395A (ja) * 2018-06-07 2019-12-12 ヤマハファインテック株式会社 接触燃焼式ガスセンサ及びその製造方法
JP7035857B2 (ja) * 2018-07-03 2022-03-15 オムロン株式会社 検査方法、検査システム及びプログラム
CN109884501B (zh) * 2019-03-06 2022-04-19 惠科股份有限公司 一种检测机台、断线短路检测机及校正方法
US12135353B2 (en) * 2019-11-15 2024-11-05 Tektronix, Inc. Indirect acquisition of a signal from a device under test

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63244854A (ja) * 1987-03-31 1988-10-12 Tokyo Electron Ltd プロ−ブ装置
US5416592A (en) * 1992-03-23 1995-05-16 Tokyo Electron Kabushiki Kaisha Probe apparatus for measuring electrical characteristics of objects
JPH06129831A (ja) * 1992-10-14 1994-05-13 Nitto Seiko Co Ltd 基板検査装置
JP2899492B2 (ja) * 1992-12-18 1999-06-02 株式会社テスコン プリント基板検査方法と検査装置
JPH06347502A (ja) * 1993-06-10 1994-12-22 Fujitsu Ltd プリント基板試験方法
JP3509040B2 (ja) * 1995-03-23 2004-03-22 日置電機株式会社 回路基板検査装置におけるプローブの移動制御方法
US7952373B2 (en) * 2000-05-23 2011-05-31 Verigy (Singapore) Pte. Ltd. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
EP1633019B1 (en) * 2003-06-12 2012-09-05 JSR Corporation Anisotropc conductive connector device and production method therefor and circuit device inspection device
US7218127B2 (en) * 2004-02-18 2007-05-15 Formfactor, Inc. Method and apparatus for probing an electronic device in which movement of probes and/or the electronic device includes a lateral component
JP2006214820A (ja) * 2005-02-02 2006-08-17 Yamaha Motor Co Ltd 基板検査装置および基板検査方法
JP2006260068A (ja) * 2005-03-16 2006-09-28 Fuji Photo Film Co Ltd 処理装置の調整方法及び装置
US8311758B2 (en) * 2006-01-18 2012-11-13 Formfactor, Inc. Methods and apparatuses for dynamic probe adjustment
JP2008164292A (ja) * 2006-12-26 2008-07-17 Tokyo Electron Ltd プローブ検査装置、位置ずれ補正方法、情報処理装置、情報処理方法及びプログラム
JP4987497B2 (ja) * 2007-01-31 2012-07-25 日置電機株式会社 回路基板検査装置
JP4932618B2 (ja) * 2007-06-29 2012-05-16 東京エレクトロン株式会社 検査方法及びこの方法を記録したプログラム記録媒体
US9000798B2 (en) * 2012-06-13 2015-04-07 Taiwan Semiconductor Manufacturing Company, Ltd. Method of test probe alignment control
JP6199199B2 (ja) * 2014-02-20 2017-09-20 東京エレクトロン株式会社 基板処理装置、位置ずれ補正方法及び記憶媒体
JP6277347B2 (ja) * 2014-02-28 2018-02-14 日本電産リード株式会社 可撓性回路基板を対象とする検査装置及び検査方法
JP6339834B2 (ja) * 2014-03-27 2018-06-06 東京エレクトロン株式会社 基板検査装置

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