JP2017175022A - 薄膜トランジスタ - Google Patents
薄膜トランジスタ Download PDFInfo
- Publication number
- JP2017175022A JP2017175022A JP2016060913A JP2016060913A JP2017175022A JP 2017175022 A JP2017175022 A JP 2017175022A JP 2016060913 A JP2016060913 A JP 2016060913A JP 2016060913 A JP2016060913 A JP 2016060913A JP 2017175022 A JP2017175022 A JP 2017175022A
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- layer
- thin film
- film transistor
- gate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 129
- 239000004065 semiconductor Substances 0.000 claims abstract description 63
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 57
- 229910052814 silicon oxide Inorganic materials 0.000 claims abstract description 57
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims abstract description 54
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 48
- 239000001301 oxygen Substances 0.000 claims description 48
- 229910052760 oxygen Inorganic materials 0.000 claims description 48
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 25
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 25
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 238000009413 insulation Methods 0.000 abstract description 10
- 239000004615 ingredient Substances 0.000 abstract description 2
- 238000010276 construction Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 349
- 239000010408 film Substances 0.000 description 158
- 239000000758 substrate Substances 0.000 description 47
- 238000005401 electroluminescence Methods 0.000 description 41
- 239000007789 gas Substances 0.000 description 35
- 230000004048 modification Effects 0.000 description 26
- 238000012986 modification Methods 0.000 description 26
- 239000011229 interlayer Substances 0.000 description 22
- 229910052751 metal Inorganic materials 0.000 description 21
- 239000002184 metal Substances 0.000 description 21
- 238000000034 method Methods 0.000 description 21
- 230000015556 catabolic process Effects 0.000 description 20
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 17
- 229910000077 silane Inorganic materials 0.000 description 17
- 230000000052 comparative effect Effects 0.000 description 16
- 239000000463 material Substances 0.000 description 16
- 239000010936 titanium Substances 0.000 description 12
- 230000007423 decrease Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 10
- 238000010494 dissociation reaction Methods 0.000 description 10
- 230000005593 dissociations Effects 0.000 description 10
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 10
- 238000001039 wet etching Methods 0.000 description 10
- 238000001312 dry etching Methods 0.000 description 9
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 description 8
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 8
- 239000003990 capacitor Substances 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000002356 single layer Substances 0.000 description 7
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 239000001257 hydrogen Substances 0.000 description 6
- 229910052739 hydrogen Inorganic materials 0.000 description 6
- 230000009467 reduction Effects 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 229910052750 molybdenum Inorganic materials 0.000 description 5
- 239000011733 molybdenum Substances 0.000 description 5
- 238000009751 slip forming Methods 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- 239000001272 nitrous oxide Substances 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- -1 polyethylene Polymers 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 239000010937 tungsten Substances 0.000 description 4
- 239000011787 zinc oxide Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 229910001882 dioxygen Inorganic materials 0.000 description 3
- 229910052733 gallium Inorganic materials 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 3
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 238000000231 atomic layer deposition Methods 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- MGRWKWACZDFZJT-UHFFFAOYSA-N molybdenum tungsten Chemical compound [Mo].[W] MGRWKWACZDFZJT-UHFFFAOYSA-N 0.000 description 2
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000013077 target material Substances 0.000 description 2
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 2
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 125000001637 1-naphthyl group Chemical group [H]C1=C([H])C([H])=C2C(*)=C([H])C([H])=C([H])C2=C1[H] 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229920000144 PEDOT:PSS Polymers 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910018503 SF6 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- RBTKNAXYKSUFRK-UHFFFAOYSA-N heliogen blue Chemical compound [Cu].[N-]1C2=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=NC([N-]1)=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=N2 RBTKNAXYKSUFRK-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 1
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 1
- IBHBKWKFFTZAHE-UHFFFAOYSA-N n-[4-[4-(n-naphthalen-1-ylanilino)phenyl]phenyl]-n-phenylnaphthalen-1-amine Chemical compound C1=CC=CC=C1N(C=1C2=CC=CC=C2C=CC=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C3=CC=CC=C3C=CC=2)C=C1 IBHBKWKFFTZAHE-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 1
- 150000007978 oxazole derivatives Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000001552 radio frequency sputter deposition Methods 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 1
- 229960000909 sulfur hexafluoride Drugs 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910001930 tungsten oxide Inorganic materials 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1222—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
- H01L27/1225—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer with semiconductor materials not belonging to the group IV of the periodic table, e.g. InGaZnO
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1237—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a different composition, shape, layout or thickness of the gate insulator in different devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4908—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET for thin film semiconductor, e.g. gate of TFT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
- H01L29/511—Insulating materials associated therewith with a compositional variation, e.g. multilayer structures
- H01L29/512—Insulating materials associated therewith with a compositional variation, e.g. multilayer structures the variation being parallel to the channel plane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
- H01L29/517—Insulating materials associated therewith the insulating material comprising a metallic compound, e.g. metal oxide, metal silicate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
- H01L29/518—Insulating materials associated therewith the insulating material containing nitrogen, e.g. nitride, oxynitride, nitrogen-doped material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Geometry (AREA)
- Thin Film Transistor (AREA)
Abstract
【解決手段】薄膜トランジスタ100は、チャネル領域131、並びに、チャネル領域131より抵抗率が低いソース領域132及びドレイン領域133を有する酸化物半導体層130と、酸化物半導体層130のチャネル領域131上に設けられたゲート絶縁層140と、ゲート絶縁層140上に設けられたゲート電極150と、ゲート絶縁層140の側面、並びに、ソース領域132及びドレイン領域133を覆う酸化アルミニウム層160とを備え、ゲート絶縁層140は、第1絶縁層141と第2絶縁層142とを含む多層構造を有し、第1絶縁層141は、シリコン酸化物を主成分として含み、チャネル領域131上に接触して設けられている。
【選択図】図5
Description
[1.有機EL表示装置]
まず、本実施の形態に係る有機EL表示装置の概要について、図1〜図4を用いて説明する。なお、図1は、本実施の形態に係る薄膜半導体アレイ基板1の構成を示す図である。図2は、本実施の形態に係る有機EL表示装置10の一部切り欠き斜視図である。図3は、本実施の形態に係る有機EL表示装置10のピクセルバンクの一例を示す図である。図4は、本実施の形態に係る有機EL表示装置10における画素回路31の回路構成を示す図である。
以下では、本実施の形態に係るTFT基板20に形成される薄膜トランジスタについて、図5を用いて説明する。
基板110は、例えば、電気絶縁性を有する材料から構成される基板である。例えば、基板110は、無アルカリガラス、石英ガラス、高耐熱性ガラスなどのガラス材料、又は、ポリエチレン、ポリプロピレン、ポリイミドなどの樹脂材料から構成される基板である。
アンダーコート層120は、基板110上に設けられた無機層の一例である。アンダーコート層120は、基板110の表面(酸化物半導体層130が形成される側の面)に形成されている。アンダーコート層120が設けられることにより、基板110に含まれる不純物(例えば、ナトリウム及びリンなど)、又は、大気中の水分などが酸化物半導体層130に浸入するのを抑制することができる。これにより、酸化物半導体層130の膜質を安定化させて、TFT特性を安定化させることができる。
酸化物半導体層130は、チャネル層として用いられる。具体的には、図5に示すように、酸化物半導体層130は、チャネル領域131、ソース領域132及びドレイン領域133を有する。チャネル領域131は、ゲート絶縁層140を挟んでゲート電極150と対向する領域である。ソース領域132及びドレイン領域133は、チャネル領域131より抵抗率が低い低抵抗化領域である。ソース領域132及びドレイン領域133は、例えば、成膜した酸化物半導体の所定の領域に対して酸素欠損を引き起こすことで形成される。
ゲート絶縁層140は、酸化物半導体層130のチャネル領域131上に設けられている。本実施の形態では、ゲート絶縁層140の側面は、チャネル領域131の側面と面一であり、上面視において、ゲート絶縁層140の輪郭線とチャネル領域131の輪郭線とは略一致している。なお、本実施の形態では、ゲート絶縁層140は、酸化物半導体層130のチャネル領域131上のみに形成されているが、これに限らない。
ゲート電極150は、ゲート絶縁層140上に設けられている。本実施の形態では、ゲート電極150の側面は、ゲート絶縁層140の側面と面一であり、上面視において、ゲート電極150の輪郭線とゲート絶縁層140の輪郭線とは略一致している。
酸化アルミニウム層160は、酸化物半導体層130上に設けられ、かつ、ソース領域132及びドレイン領域133に接触している。本実施の形態では、酸化アルミニウム層160は、酸化物半導体層130の上面のうち、ゲート絶縁層140によって覆われていない部分に設けられている。具体的には、酸化アルミニウム層160は、ソース領域132上及びドレイン領域133上に設けられている。
層間絶縁層170は、酸化アルミニウム層160を覆うように設けられている。具体的には、層間絶縁層170は、薄膜トランジスタ100が形成されている素子領域の全面を覆うように形成されている。
ソース電極180s及びドレイン電極180dは、層間絶縁層170上に所定形状で形成されている。ソース電極180s及びドレイン電極180dの各々は、酸化物半導体層130と電気的に接続されている。
次に、本実施の形態に係る薄膜トランジスタ100の製造方法について、図6A〜図6Cを用いて説明する。
ここで、図7〜図11を用いて、本実施の形態に係る薄膜トランジスタ100の効果について説明する。
まず、比較例に係る薄膜トランジスタ100xの特性を測定した結果について、図7〜図9を用いて説明する。図7は、比較例に係る薄膜トランジスタ100xの断面図である。図7に示すように、比較例に係る薄膜トランジスタ100xは、ゲート絶縁層140xがシリコン窒化物又はシリコン酸化物を主成分として含む単層構造を有する点を除いて、実施の形態に係る薄膜トランジスタ100と同じである。
上述した比較例に対して、本実施の形態に係る薄膜トランジスタ100は、図5に示したように、ゲート絶縁層140が第1絶縁層141と第2絶縁層142とを含む多層構造を有する。以下では、実施例に係る薄膜トランジスタ100の特性を測定した結果について、図10及び図11を用いて説明する。
以上のように、本実施の形態に係る薄膜トランジスタ100は、チャネル領域131、並びに、チャネル領域131より抵抗率が低いソース領域132及びドレイン領域133を有する酸化物半導体層130と、酸化物半導体層130のチャネル領域131上に設けられたゲート絶縁層140と、ゲート絶縁層140上に設けられたゲート電極150と、ゲート絶縁層140の側面、並びに、ソース領域132及びドレイン領域133を覆う酸化アルミニウム層160とを備え、ゲート絶縁層140は、第1絶縁層141と第2絶縁層142とを含む多層構造を有し、第1絶縁層141は、シリコン酸化物を主成分として含み、チャネル領域131上に接触して設けられている。例えば、第2絶縁層142は、第1絶縁層141より酸素含有率が低い絶縁層である。例えば、第2絶縁層142は、シリコン窒化膜を主成分として含む。
以下では、上記の実施の形態の変形例1について説明する。
次に、上記の実施の形態の変形例2について説明する。
次に、上記の実施の形態の変形例3について説明する。
以上、本発明に係る薄膜トランジスタについて、上記実施の形態及びその変形例に基づいて説明したが、本発明は、上記の実施の形態に限定されるものではない。
10 有機EL表示装置
20 TFT基板
21 バンク
30 画素
30B、30G、30R サブ画素
31 画素回路
32、33、100、100x、200、300、400 薄膜トランジスタ
32d、33d、180d ドレイン電極
32g、33g、150 ゲート電極
32s、33s、180s ソース電極
34 キャパシタ
40 有機EL素子
41 陽極
42 EL層
43 陰極
50 ゲート配線
60 ソース配線
70 電源配線
110 基板
120 アンダーコート層
130、130a 酸化物半導体層
131 チャネル領域
132 ソース領域
133 ドレイン領域
140、140x、240、340、440 ゲート絶縁層
141 第1絶縁層
141a 第1絶縁膜
142、242、342 第2絶縁層
142a 第2絶縁膜
150a ゲート金属膜
160 酸化アルミニウム層
170 層間絶縁層
171d、171s コンタクトホール
443 第3絶縁層
Claims (8)
- チャネル領域、並びに、当該チャネル領域より抵抗率が低いソース領域及びドレイン領域を有する酸化物半導体層と、
前記酸化物半導体層の前記チャネル領域上に設けられたゲート絶縁層と、
前記ゲート絶縁層上に設けられたゲート電極と、
前記ゲート絶縁層の側面、並びに、前記ソース領域及び前記ドレイン領域を覆う酸化アルミニウム層とを備え、
前記ゲート絶縁層は、第1絶縁層と第2絶縁層とを含む多層構造を有し、
前記第1絶縁層は、シリコン酸化物を主成分として含み、前記チャネル領域上に接触して設けられている
薄膜トランジスタ。 - 前記第2絶縁層は、前記第1絶縁層より酸素含有率が低い絶縁層である
請求項1に記載の薄膜トランジスタ。 - 前記第2絶縁層は、シリコン窒化物を主成分として含む
請求項2に記載の薄膜トランジスタ。 - 前記第2絶縁層は、前記第1絶縁層より酸素との結合エネルギーが高い絶縁層である
請求項1に記載の薄膜トランジスタ。 - 前記第2絶縁層は、酸化アルミニウム、フッ素添加シリコン酸化物、炭素添加シリコン酸化物、又は、シリコン酸窒化物を主成分として含む
請求項4に記載の薄膜トランジスタ。 - 前記第2絶縁層は、前記第1絶縁層より酸素含有率が高いシリコン酸化物を主成分として含む
請求項1に記載の薄膜トランジスタ。 - 前記ゲート絶縁層は、さらに、前記第1絶縁層と前記第2絶縁層との間に積層された第3絶縁層を含む
請求項1〜6のいずれか1項に記載の薄膜トランジスタ。 - 前記チャネル領域、前記ゲート絶縁層及び前記ゲート電極の各々の側面は、略面一である
請求項1〜7のいずれか1項に記載の薄膜トランジスタ。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016060913A JP2017175022A (ja) | 2016-03-24 | 2016-03-24 | 薄膜トランジスタ |
US15/468,042 US10276722B2 (en) | 2016-03-24 | 2017-03-23 | Thin film transistor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016060913A JP2017175022A (ja) | 2016-03-24 | 2016-03-24 | 薄膜トランジスタ |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2017175022A true JP2017175022A (ja) | 2017-09-28 |
Family
ID=59897306
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016060913A Pending JP2017175022A (ja) | 2016-03-24 | 2016-03-24 | 薄膜トランジスタ |
Country Status (2)
Country | Link |
---|---|
US (1) | US10276722B2 (ja) |
JP (1) | JP2017175022A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021034577A (ja) * | 2019-08-26 | 2021-03-01 | 株式会社ジャパンディスプレイ | 半導体装置および半導体装置の製造方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7007080B2 (ja) * | 2016-07-19 | 2022-02-10 | 株式会社ジャパンディスプレイ | Tft回路基板 |
JP7109902B2 (ja) * | 2017-10-26 | 2022-08-01 | 株式会社ジャパンディスプレイ | 表示装置及びその製造方法 |
CN109037345B (zh) * | 2018-07-27 | 2022-06-07 | 京东方科技集团股份有限公司 | 薄膜晶体管及其制作方法、阵列基板以及显示装置 |
CN109638018A (zh) * | 2018-12-03 | 2019-04-16 | 武汉华星光电半导体显示技术有限公司 | 一种柔性显示面板及其显示器件 |
JP2020129635A (ja) * | 2019-02-12 | 2020-08-27 | 株式会社ジャパンディスプレイ | 半導体装置および半導体装置の製造方法 |
US11605723B2 (en) * | 2020-07-28 | 2023-03-14 | Micron Technology, Inc. | Transistors and memory arrays |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003086808A (ja) * | 2001-09-10 | 2003-03-20 | Masashi Kawasaki | 薄膜トランジスタおよびマトリクス表示装置 |
JP2007073563A (ja) * | 2005-09-02 | 2007-03-22 | Kochi Prefecture Sangyo Shinko Center | 薄膜トランジスタ |
JP2007073561A (ja) * | 2005-09-02 | 2007-03-22 | Kochi Prefecture Sangyo Shinko Center | 薄膜トランジスタ |
JP2009141002A (ja) * | 2007-12-04 | 2009-06-25 | Canon Inc | 絶縁層を有する酸化物半導体素子およびそれを用いた表示装置 |
JP2011228622A (ja) * | 2010-03-30 | 2011-11-10 | Sony Corp | 薄膜トランジスタおよびその製造方法、並びに表示装置 |
JP2015065426A (ja) * | 2013-08-30 | 2015-04-09 | 株式会社半導体エネルギー研究所 | 半導体装置およびその作製方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11186553A (ja) | 1997-12-17 | 1999-07-09 | Hitachi Ltd | アクティブマトリクス型液晶表示装置 |
JP2000323717A (ja) | 1999-05-13 | 2000-11-24 | Toshiba Corp | 薄膜トランジスタおよびこの薄膜トランジスタの製造方法 |
JP4882256B2 (ja) | 2004-12-06 | 2012-02-22 | 凸版印刷株式会社 | 薄膜トランジスタ |
JP4560502B2 (ja) | 2005-09-06 | 2010-10-13 | キヤノン株式会社 | 電界効果型トランジスタ |
CN101258607B (zh) | 2005-09-06 | 2011-01-05 | 佳能株式会社 | 使用非晶氧化物膜作为沟道层的场效应晶体管、使用非晶氧化物膜作为沟道层的场效应晶体管的制造方法、以及非晶氧化物膜的制造方法 |
US8969867B2 (en) * | 2012-01-18 | 2015-03-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
JP6108898B2 (ja) | 2013-03-19 | 2017-04-05 | 株式会社東芝 | 表示装置、薄膜トランジスタ、表示装置の製造方法及び薄膜トランジスタの製造方法 |
JP2016100585A (ja) * | 2014-11-26 | 2016-05-30 | 株式会社Joled | 半導体装置およびその製造方法、ならびに表示装置および電子機器 |
-
2016
- 2016-03-24 JP JP2016060913A patent/JP2017175022A/ja active Pending
-
2017
- 2017-03-23 US US15/468,042 patent/US10276722B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003086808A (ja) * | 2001-09-10 | 2003-03-20 | Masashi Kawasaki | 薄膜トランジスタおよびマトリクス表示装置 |
JP2007073563A (ja) * | 2005-09-02 | 2007-03-22 | Kochi Prefecture Sangyo Shinko Center | 薄膜トランジスタ |
JP2007073561A (ja) * | 2005-09-02 | 2007-03-22 | Kochi Prefecture Sangyo Shinko Center | 薄膜トランジスタ |
JP2009141002A (ja) * | 2007-12-04 | 2009-06-25 | Canon Inc | 絶縁層を有する酸化物半導体素子およびそれを用いた表示装置 |
JP2011228622A (ja) * | 2010-03-30 | 2011-11-10 | Sony Corp | 薄膜トランジスタおよびその製造方法、並びに表示装置 |
JP2015065426A (ja) * | 2013-08-30 | 2015-04-09 | 株式会社半導体エネルギー研究所 | 半導体装置およびその作製方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021034577A (ja) * | 2019-08-26 | 2021-03-01 | 株式会社ジャパンディスプレイ | 半導体装置および半導体装置の製造方法 |
JP7412924B2 (ja) | 2019-08-26 | 2024-01-15 | 株式会社ジャパンディスプレイ | 半導体装置および半導体装置の製造方法 |
US11894387B2 (en) | 2019-08-26 | 2024-02-06 | Japan Display Inc. | Semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
US20170278974A1 (en) | 2017-09-28 |
US10276722B2 (en) | 2019-04-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10644165B2 (en) | Thin-film transistor, method of fabricating thin-film transistor, and display device | |
US10276722B2 (en) | Thin film transistor | |
JP5948427B2 (ja) | 薄膜半導体基板、発光パネル及び薄膜半導体基板の製造方法 | |
US10811631B2 (en) | Thin film transistor element substrate, method of producing the substrate, and organic EL display device including the thin film transistor element substrate | |
WO2015029286A1 (ja) | 薄膜トランジスタ基板の製造方法及び薄膜トランジスタ基板 | |
TW201413975A (zh) | 薄膜電晶體陣列基板及其製造方法 | |
KR20110113568A (ko) | 박막 트랜지스터 및 표시 장치 및 전자 기기 | |
US8633479B2 (en) | Display device with metal oxidel layer and method for manufacturing the same | |
US10249761B2 (en) | Thin-film transistor substrate | |
US9893193B2 (en) | Thin-film transistor including a gate electrode with a side wall insulating layer and display device | |
JP2015149467A (ja) | 薄膜トランジスタ基板の製造方法 | |
JP6331052B2 (ja) | 薄膜トランジスタ、薄膜トランジスタの製造方法及び有機el表示装置 | |
JP2017191838A (ja) | 薄膜トランジスタ基板 | |
JPWO2014196107A1 (ja) | 薄膜トランジスタ素子とその製造方法及び表示装置 | |
US8981368B2 (en) | Thin film transistor, method of manufacturing thin film transistor, display, and electronic apparatus | |
JP2016111104A (ja) | 薄膜半導体基板の製造方法 | |
KR20190056479A (ko) | 유기 발광 표시 장치 | |
JP6263721B2 (ja) | 薄膜トランジスタ、薄膜トランジスタの製造方法及び有機el表示装置 | |
JP6500202B2 (ja) | 薄膜トランジスタ及び薄膜トランジスタの製造方法 | |
JP2021013021A (ja) | ディスプレイ装置 | |
JP2017191834A (ja) | 薄膜トランジスタ基板 | |
US20170207326A1 (en) | Method of manufacturing thin-film transistor substrate | |
JP6500203B2 (ja) | 薄膜トランジスタ及び薄膜トランジスタの製造方法 | |
WO2016038823A1 (ja) | 薄膜トランジスタ及び薄膜トランジスタの製造方法 | |
KR20130027023A (ko) | 표시 장치, 표시 장치에 사용되는 박막 트랜지스터, 및 박막 트랜지스터의 제조 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20170322 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180622 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190326 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20190328 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190527 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20191001 |