JP2017164826A - 不良検出方法 - Google Patents
不良検出方法 Download PDFInfo
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- JP2017164826A JP2017164826A JP2016049644A JP2016049644A JP2017164826A JP 2017164826 A JP2017164826 A JP 2017164826A JP 2016049644 A JP2016049644 A JP 2016049644A JP 2016049644 A JP2016049644 A JP 2016049644A JP 2017164826 A JP2017164826 A JP 2017164826A
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- 239000000654 additive Substances 0.000 claims abstract description 133
- 230000000996 additive effect Effects 0.000 claims abstract description 133
- 238000012546 transfer Methods 0.000 claims abstract description 66
- 239000012530 fluid Substances 0.000 claims abstract description 29
- 238000002347 injection Methods 0.000 claims abstract description 28
- 239000007924 injection Substances 0.000 claims abstract description 28
- 239000007788 liquid Substances 0.000 claims description 56
- 238000012545 processing Methods 0.000 claims description 29
- 238000003860 storage Methods 0.000 claims description 24
- 230000007547 defect Effects 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 9
- 239000000243 solution Substances 0.000 abstract 1
- 238000005520 cutting process Methods 0.000 description 34
- 230000007246 mechanism Effects 0.000 description 17
- 238000003754 machining Methods 0.000 description 16
- 230000007423 decrease Effects 0.000 description 7
- 238000001802 infusion Methods 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 5
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- 238000005259 measurement Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000005856 abnormality Effects 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000002173 cutting fluid Substances 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 229920002873 Polyethylenimine Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229920006317 cationic polymer Polymers 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
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- 238000005498 polishing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/20—Investigating the presence of flaws
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
- G01F23/22—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/06—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a liquid
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/22—Measuring resistance of fluids
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Pathology (AREA)
- Biochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Immunology (AREA)
- General Health & Medical Sciences (AREA)
- Fluid Mechanics (AREA)
- Thermal Sciences (AREA)
- Auxiliary Devices For Machine Tools (AREA)
- Dicing (AREA)
- Machine Tool Sensing Apparatuses (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Control Of Positive-Displacement Pumps (AREA)
Abstract
Description
4 基台
4a 開口
4b 支持台
4c 開口
6 カセットエレベータ
8 カセット
10 仮置き機構
12 プッシュプル機構
14 ガイドレール
16 X軸移動テーブル
18 防塵防滴カバー
20 チャックテーブル(保持手段)
20a 保持面
22 クランプ
24 第1搬送機構
26 切削ユニット
28 撮像ユニット
30 切削ブレード
32 洗浄機構
34 第2搬送機構
36 モニタ
38 ノズル
40 加工液供給装置
42 液体供給源
44 流量計
46 流路
48 制御ユニット(制御手段)
48a 添加量算出部
48b 設定部
48c 注入ポンプ制御部
48d 第1判定部
48e 警告発信部
48f 移送ポンプ制御部
48g 第2判定部
48h 停止信号送信部
50 注入ポンプ
52 計測器
54 貯留容器
56 液面検出センサ
58 上限検出用電極
60 下限検出用電極
62 共通電極
64a 第1移送ポンプ
64b 第2移送ポンプ
66a 第1添加剤容器
66b 第2添加剤容器
68 制御ユニット(制御手段)
68a 停止信号受信部
68b 停止部
11 被加工物
13 ダイシングテープ
15 フレーム
Claims (3)
- 一端が液体供給源に接続され他端が加工装置に接続された流路に配設され該流路を流れる液体の流量を計測する流量計と、該液体に添加される添加剤を収容する添加剤容器と、該添加剤容器から供給される添加剤を貯留する貯留容器と、所定量の該添加剤が該貯留容器に常に貯留された状態となるように該添加剤を該添加剤容器から該貯留容器へと移送する移送ポンプと、該流路の該流量計より下流側に該貯留容器の該添加剤を注入する注入ポンプと、該液体に該添加剤を注入して生成される加工液の導電率または電気抵抗率を計測する計測器と、を備える加工液供給装置において添加剤の注入不良を検出する不良検出方法であって、
該加工液中の該添加剤の濃度を設定する濃度設定ステップと、
該濃度設定ステップで設定された該添加剤の濃度と、該流量計で計測された該液体の流量と、をもとに該添加剤の添加量を算出する添加量算出ステップと、
該添加量算出ステップで算出された添加量で該添加剤を該液体に添加する際に、移送ポンプの作動時間が適切か否かを判別する移送ポンプ作動判別ステップと、
該移送ポンプ作動判別ステップで該移送ポンプの作動時間が適切ではないと判別された場合に、該添加剤の注入不良と判定する判定ステップと、を備えることを特徴とする不良検出方法。 - 該判定ステップで該添加剤の注入不良と判定された場合に、警告を発する警告ステップを更に備えることを特徴とする請求項1に記載の不良検出方法。
- 該判定ステップで該添加剤の注入不良と判定された場合に、該加工装置の稼働を停止させる停止信号を発して該加工装置の稼働を停止させる加工装置停止ステップを更に備えることを特徴とする請求項1又は請求項2に記載の不良検出方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016049644A JP6639283B2 (ja) | 2016-03-14 | 2016-03-14 | 不良検出方法 |
TW106104797A TWI712464B (zh) | 2016-03-14 | 2017-02-14 | 不良檢測方法 |
CN201710134157.7A CN107186900B (zh) | 2016-03-14 | 2017-03-08 | 不良检测方法 |
KR1020170030405A KR102251264B1 (ko) | 2016-03-14 | 2017-03-10 | 불량 검출 방법 |
Applications Claiming Priority (1)
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JP2016049644A JP6639283B2 (ja) | 2016-03-14 | 2016-03-14 | 不良検出方法 |
Publications (2)
Publication Number | Publication Date |
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JP2017164826A true JP2017164826A (ja) | 2017-09-21 |
JP6639283B2 JP6639283B2 (ja) | 2020-02-05 |
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JP2016049644A Active JP6639283B2 (ja) | 2016-03-14 | 2016-03-14 | 不良検出方法 |
Country Status (4)
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JP (1) | JP6639283B2 (ja) |
KR (1) | KR102251264B1 (ja) |
CN (1) | CN107186900B (ja) |
TW (1) | TWI712464B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019136843A (ja) * | 2018-02-14 | 2019-08-22 | 株式会社ディスコ | 切削装置 |
JP2020191426A (ja) * | 2019-05-23 | 2020-11-26 | 株式会社ディスコ | 加工装置 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7162513B2 (ja) * | 2018-12-07 | 2022-10-28 | 株式会社ディスコ | 加工装置 |
JP7310917B2 (ja) * | 2019-11-18 | 2023-07-19 | 株式会社島津製作所 | 全有機体炭素測定方法及び全有機体炭素測定装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0455746A (ja) * | 1990-06-25 | 1992-02-24 | Kurita Water Ind Ltd | 薬注装置の監視装置 |
JPH11317386A (ja) * | 1998-05-07 | 1999-11-16 | Dainippon Screen Mfg Co Ltd | 処理液供給装置 |
JP2002016030A (ja) * | 2000-06-27 | 2002-01-18 | Mitsubishi Chemical Engineering Corp | 研磨液の調製方法および調製装置 |
JP2008030153A (ja) * | 2006-07-28 | 2008-02-14 | Disco Abrasive Syst Ltd | 切削装置 |
US20160070274A1 (en) * | 2014-09-08 | 2016-03-10 | Haas Automation, Inc. | Automatic machine tool coolant mixer |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
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KR970063435A (ko) * | 1996-02-13 | 1997-09-12 | 김광호 | 반도체 제조 장치 |
JP2002184744A (ja) * | 2001-10-09 | 2002-06-28 | Seiko Epson Corp | 薬液処理装置および半導体装置の製造方法 |
JP4819523B2 (ja) | 2006-02-21 | 2011-11-24 | 株式会社ディスコ | 加工液供給装置 |
CN101489661A (zh) * | 2006-05-19 | 2009-07-22 | 乔治洛德方法研究和开发液化空气有限公司 | 在处理环境中回收工艺流体的系统和方法 |
US20100226835A1 (en) * | 2009-03-03 | 2010-09-09 | Ecolab Inc. | Method and apparatus for dispensing solid product |
CN102033037A (zh) * | 2009-09-28 | 2011-04-27 | 无锡江南计算技术研究所 | 冷却液的质量控制方法 |
JP2012172117A (ja) * | 2011-02-23 | 2012-09-10 | Yushiro Chemical Industry Co Ltd | 固定砥粒ワイヤソー用水溶性加工液 |
KR101450965B1 (ko) * | 2011-09-29 | 2014-10-15 | 다이닛뽕스크린 세이조오 가부시키가이샤 | 기판처리장치 및 기판처리방법 |
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2016
- 2016-03-14 JP JP2016049644A patent/JP6639283B2/ja active Active
-
2017
- 2017-02-14 TW TW106104797A patent/TWI712464B/zh active
- 2017-03-08 CN CN201710134157.7A patent/CN107186900B/zh active Active
- 2017-03-10 KR KR1020170030405A patent/KR102251264B1/ko active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0455746A (ja) * | 1990-06-25 | 1992-02-24 | Kurita Water Ind Ltd | 薬注装置の監視装置 |
JPH11317386A (ja) * | 1998-05-07 | 1999-11-16 | Dainippon Screen Mfg Co Ltd | 処理液供給装置 |
JP2002016030A (ja) * | 2000-06-27 | 2002-01-18 | Mitsubishi Chemical Engineering Corp | 研磨液の調製方法および調製装置 |
JP2008030153A (ja) * | 2006-07-28 | 2008-02-14 | Disco Abrasive Syst Ltd | 切削装置 |
US20160070274A1 (en) * | 2014-09-08 | 2016-03-10 | Haas Automation, Inc. | Automatic machine tool coolant mixer |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019136843A (ja) * | 2018-02-14 | 2019-08-22 | 株式会社ディスコ | 切削装置 |
JP7046632B2 (ja) | 2018-02-14 | 2022-04-04 | 株式会社ディスコ | 切削装置 |
JP2020191426A (ja) * | 2019-05-23 | 2020-11-26 | 株式会社ディスコ | 加工装置 |
JP7349260B2 (ja) | 2019-05-23 | 2023-09-22 | 株式会社ディスコ | 加工装置 |
Also Published As
Publication number | Publication date |
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TWI712464B (zh) | 2020-12-11 |
JP6639283B2 (ja) | 2020-02-05 |
CN107186900B (zh) | 2020-10-09 |
KR102251264B1 (ko) | 2021-05-11 |
CN107186900A (zh) | 2017-09-22 |
TW201731627A (zh) | 2017-09-16 |
KR20170106924A (ko) | 2017-09-22 |
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