JP2017103366A - 電子部品モジュールおよびその製造方法 - Google Patents

電子部品モジュールおよびその製造方法 Download PDF

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Publication number
JP2017103366A
JP2017103366A JP2015235905A JP2015235905A JP2017103366A JP 2017103366 A JP2017103366 A JP 2017103366A JP 2015235905 A JP2015235905 A JP 2015235905A JP 2015235905 A JP2015235905 A JP 2015235905A JP 2017103366 A JP2017103366 A JP 2017103366A
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JP
Japan
Prior art keywords
substrate
electronic component
substrate portion
component module
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015235905A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017103366A5 (https=
Inventor
横地　智宏
Tomohiro Yokochi
智宏 横地
長谷川　賢一郎
Kenichiro Hasegawa
賢一郎 長谷川
梶野　秀忠
Hidetada Kajino
秀忠 梶野
康徳 笠間
Yasunori Kasama
康徳 笠間
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2015235905A priority Critical patent/JP2017103366A/ja
Priority to CN201680071521.3A priority patent/CN108370642A/zh
Priority to PCT/JP2016/085719 priority patent/WO2017094834A1/ja
Priority to US15/780,728 priority patent/US20200258805A1/en
Priority to KR1020187016114A priority patent/KR20180081767A/ko
Priority to TW105139926A priority patent/TW201733414A/zh
Publication of JP2017103366A publication Critical patent/JP2017103366A/ja
Publication of JP2017103366A5 publication Critical patent/JP2017103366A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/288—Configurations of stacked chips characterised by arrangements for thermal management of the stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2015235905A 2015-12-02 2015-12-02 電子部品モジュールおよびその製造方法 Pending JP2017103366A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2015235905A JP2017103366A (ja) 2015-12-02 2015-12-02 電子部品モジュールおよびその製造方法
CN201680071521.3A CN108370642A (zh) 2015-12-02 2016-12-01 具备安装电子部件的基板和散热板的电子部件模块及其制造方法
PCT/JP2016/085719 WO2017094834A1 (ja) 2015-12-02 2016-12-01 電子部品を実装した基板と放熱板を備えた電子部品モジュールおよびその製造方法
US15/780,728 US20200258805A1 (en) 2015-12-02 2016-12-01 Electronic component module provided with substrate on which electronic components are mounted and heat sink and manufacturing method of the same
KR1020187016114A KR20180081767A (ko) 2015-12-02 2016-12-01 전자 부품을 실장한 기판과 방열판을 구비한 전자 부품 모듈 및 그 제조 방법
TW105139926A TW201733414A (zh) 2015-12-02 2016-12-02 安裝有電子零件之基板和具備有散熱板之電子零件模組及其製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015235905A JP2017103366A (ja) 2015-12-02 2015-12-02 電子部品モジュールおよびその製造方法

Publications (2)

Publication Number Publication Date
JP2017103366A true JP2017103366A (ja) 2017-06-08
JP2017103366A5 JP2017103366A5 (https=) 2018-01-18

Family

ID=58796963

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015235905A Pending JP2017103366A (ja) 2015-12-02 2015-12-02 電子部品モジュールおよびその製造方法

Country Status (6)

Country Link
US (1) US20200258805A1 (https=)
JP (1) JP2017103366A (https=)
KR (1) KR20180081767A (https=)
CN (1) CN108370642A (https=)
TW (1) TW201733414A (https=)
WO (1) WO2017094834A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022195865A1 (ja) * 2021-03-19 2022-09-22 サンケン電気株式会社 四面冷却パワーモジュール

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7398877B2 (ja) * 2019-04-18 2023-12-15 新光電気工業株式会社 半導体装置用ステム及び半導体装置
US11456231B2 (en) * 2021-01-18 2022-09-27 Fortinet, Inc. Heatsink arrangement for integrated circuit assembly and method for assembling thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5265322A (en) * 1990-02-05 1993-11-30 Motorola, Inc. Electronic module assembly and method of forming same
US5925298A (en) * 1995-06-26 1999-07-20 Ford Motor Company Method for reworking a multi-layer circuit board using a shape memory alloy material
JP2000183574A (ja) * 1998-12-15 2000-06-30 Tdk Corp 電子機器
JP2013012508A (ja) * 2011-06-28 2013-01-17 Ntt Electornics Corp 電子機器

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62118492U (https=) * 1986-01-20 1987-07-28
JP2006100302A (ja) * 2004-09-28 2006-04-13 Sharp Corp 高周波モジュールおよびその製造方法
JP4697037B2 (ja) 2006-05-09 2011-06-08 株式会社デンソー 部品内蔵基板及びその配線不良検査方法
DE102009060777A1 (de) * 2009-12-22 2011-06-30 Automotive Lighting Reutlingen GmbH, 72762 Elektronisches Steuergerät und Verfahren zur Herstellung einer Einheit aus einem Grundkörper und einer Leiterplatte zum Einsatz in einem solchen Steuergerät
CN201869439U (zh) * 2010-12-05 2011-06-15 新高电子材料（中山）有限公司 高散热金属基电路板
CN204560003U (zh) * 2015-02-09 2015-08-12 江阴通利光电科技有限公司 一种可弯曲电路板组件

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5265322A (en) * 1990-02-05 1993-11-30 Motorola, Inc. Electronic module assembly and method of forming same
US5925298A (en) * 1995-06-26 1999-07-20 Ford Motor Company Method for reworking a multi-layer circuit board using a shape memory alloy material
JP2000183574A (ja) * 1998-12-15 2000-06-30 Tdk Corp 電子機器
JP2013012508A (ja) * 2011-06-28 2013-01-17 Ntt Electornics Corp 電子機器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022195865A1 (ja) * 2021-03-19 2022-09-22 サンケン電気株式会社 四面冷却パワーモジュール

Also Published As

Publication number Publication date
US20200258805A1 (en) 2020-08-13
KR20180081767A (ko) 2018-07-17
CN108370642A (zh) 2018-08-03
TW201733414A (zh) 2017-09-16
WO2017094834A1 (ja) 2017-06-08

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