KR20180081767A - 전자 부품을 실장한 기판과 방열판을 구비한 전자 부품 모듈 및 그 제조 방법 - Google Patents

전자 부품을 실장한 기판과 방열판을 구비한 전자 부품 모듈 및 그 제조 방법 Download PDF

Info

Publication number
KR20180081767A
KR20180081767A KR1020187016114A KR20187016114A KR20180081767A KR 20180081767 A KR20180081767 A KR 20180081767A KR 1020187016114 A KR1020187016114 A KR 1020187016114A KR 20187016114 A KR20187016114 A KR 20187016114A KR 20180081767 A KR20180081767 A KR 20180081767A
Authority
KR
South Korea
Prior art keywords
substrate
substrate portion
electronic component
heat sink
component module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020187016114A
Other languages
English (en)
Korean (ko)
Inventor
도모히로 요코치
겐이치로 하세가와
히데타다 카지노
야스노리 카사마
Original Assignee
가부시키가이샤 덴소
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 덴소 filed Critical 가부시키가이샤 덴소
Publication of KR20180081767A publication Critical patent/KR20180081767A/ko
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H01L23/367—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H01L23/13—
    • H01L23/14—
    • H01L23/40—
    • H01L25/10—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/288—Configurations of stacked chips characterised by arrangements for thermal management of the stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1020187016114A 2015-12-02 2016-12-01 전자 부품을 실장한 기판과 방열판을 구비한 전자 부품 모듈 및 그 제조 방법 Withdrawn KR20180081767A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015235905A JP2017103366A (ja) 2015-12-02 2015-12-02 電子部品モジュールおよびその製造方法
JPJP-P-2015-235905 2015-12-02
PCT/JP2016/085719 WO2017094834A1 (ja) 2015-12-02 2016-12-01 電子部品を実装した基板と放熱板を備えた電子部品モジュールおよびその製造方法

Publications (1)

Publication Number Publication Date
KR20180081767A true KR20180081767A (ko) 2018-07-17

Family

ID=58796963

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187016114A Withdrawn KR20180081767A (ko) 2015-12-02 2016-12-01 전자 부품을 실장한 기판과 방열판을 구비한 전자 부품 모듈 및 그 제조 방법

Country Status (6)

Country Link
US (1) US20200258805A1 (https=)
JP (1) JP2017103366A (https=)
KR (1) KR20180081767A (https=)
CN (1) CN108370642A (https=)
TW (1) TW201733414A (https=)
WO (1) WO2017094834A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7398877B2 (ja) * 2019-04-18 2023-12-15 新光電気工業株式会社 半導体装置用ステム及び半導体装置
US11456231B2 (en) * 2021-01-18 2022-09-27 Fortinet, Inc. Heatsink arrangement for integrated circuit assembly and method for assembling thereof
WO2022195865A1 (ja) * 2021-03-19 2022-09-22 サンケン電気株式会社 四面冷却パワーモジュール

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007305674A (ja) 2006-05-09 2007-11-22 Denso Corp 部品内蔵基板及びその配線不良検査方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62118492U (https=) * 1986-01-20 1987-07-28
US5265322A (en) * 1990-02-05 1993-11-30 Motorola, Inc. Electronic module assembly and method of forming same
US5925298A (en) * 1995-06-26 1999-07-20 Ford Motor Company Method for reworking a multi-layer circuit board using a shape memory alloy material
JP3411512B2 (ja) * 1998-12-15 2003-06-03 ティーディーケイ株式会社 電子機器
JP2006100302A (ja) * 2004-09-28 2006-04-13 Sharp Corp 高周波モジュールおよびその製造方法
DE102009060777A1 (de) * 2009-12-22 2011-06-30 Automotive Lighting Reutlingen GmbH, 72762 Elektronisches Steuergerät und Verfahren zur Herstellung einer Einheit aus einem Grundkörper und einer Leiterplatte zum Einsatz in einem solchen Steuergerät
CN201869439U (zh) * 2010-12-05 2011-06-15 新高电子材料（中山）有限公司 高散热金属基电路板
JP2013012508A (ja) * 2011-06-28 2013-01-17 Ntt Electornics Corp 電子機器
CN204560003U (zh) * 2015-02-09 2015-08-12 江阴通利光电科技有限公司 一种可弯曲电路板组件

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007305674A (ja) 2006-05-09 2007-11-22 Denso Corp 部品内蔵基板及びその配線不良検査方法

Also Published As

Publication number Publication date
JP2017103366A (ja) 2017-06-08
US20200258805A1 (en) 2020-08-13
CN108370642A (zh) 2018-08-03
TW201733414A (zh) 2017-09-16
WO2017094834A1 (ja) 2017-06-08

Similar Documents

Publication Publication Date Title
JP6822940B2 (ja) 回路基板
US20060043562A1 (en) Circuit device and manufacture method for circuit device
WO2019098316A1 (ja) 高周波モジュール
CN214256936U (zh) 模块
TWI664881B (zh) 零件模組
KR20150025129A (ko) 전자 소자 모듈 및 그 제조 방법
KR20150009728A (ko) 전자 소자 모듈 및 그 실장 구조
US20150207216A1 (en) Wireless module
KR20150000173A (ko) 전자 소자 모듈 및 그 제조 방법
US9907180B2 (en) Multilayer electronic device and manufacturing method therefor
KR20180081767A (ko) 전자 부품을 실장한 기판과 방열판을 구비한 전자 부품 모듈 및 그 제조 방법
KR101139084B1 (ko) 다층 프린트 기판 및 그 제조 방법
KR101555403B1 (ko) 배선기판
JP2009239109A (ja) 電子部品配線基板および部品実装モジュール
KR20190099709A (ko) 인쇄회로기판
US10188000B2 (en) Component mounting board
JP5544280B2 (ja) 配線基板
CN205491421U (zh) 部件内置基板
KR20140023587A (ko) 코일 구조 및 이를 구비하는 기판
CN208016129U (zh) 树脂电路基板、部件搭载树脂电路基板
JP4883882B2 (ja) 電子装置
US20250374440A1 (en) Method for forming an electrical and mechanical connection arrangement of at least two flexible printed circuit boards (flexible PCB) or flexible PCB segments as well as subsequently manufactured flexible PCB of any length
JP2012109386A (ja) 配線基板
JP2006202870A (ja) 立体的電子回路モジュールとその製造方法およびそれらを用いた電子装置
KR101799095B1 (ko) 메탈코어를 구비한 인쇄회로기판 및 그 제조방법

Legal Events

Date Code Title Description
A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PC1202 Submission of document of withdrawal before decision of registration

St.27 status event code: N-1-6-B10-B11-nap-PC1202

WITB Written withdrawal of application
P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000