JP2017064744A - レーザー加工装置 - Google Patents
レーザー加工装置 Download PDFInfo
- Publication number
- JP2017064744A JP2017064744A JP2015191941A JP2015191941A JP2017064744A JP 2017064744 A JP2017064744 A JP 2017064744A JP 2015191941 A JP2015191941 A JP 2015191941A JP 2015191941 A JP2015191941 A JP 2015191941A JP 2017064744 A JP2017064744 A JP 2017064744A
- Authority
- JP
- Japan
- Prior art keywords
- laser
- workpiece
- cassette
- axis direction
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000007246 mechanism Effects 0.000 claims abstract description 98
- 230000003287 optical effect Effects 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims description 15
- 238000003754 machining Methods 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 description 50
- 235000012431 wafers Nutrition 0.000 description 48
- 230000010287 polarization Effects 0.000 description 8
- 230000001678 irradiating effect Effects 0.000 description 7
- 238000003384 imaging method Methods 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 241000270281 Coluber constrictor Species 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- OQZCSNDVOWYALR-UHFFFAOYSA-N flurochloridone Chemical compound FC(F)(F)C1=CC=CC(N2C(C(Cl)C(CCl)C2)=O)=C1 OQZCSNDVOWYALR-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/011—Layered products comprising a layer of metal all layers being exclusively metallic all layers being formed of iron alloys or steels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- High Energy & Nuclear Physics (AREA)
- Robotics (AREA)
- Electromagnetism (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
Abstract
【解決手段】本発明によれば、被加工物を保持する第一の保持手段をX軸、Y軸方向に加工送りする第一のX軸送り手段、第一のY軸送り手段と、被加工物にレーザー光線を集光する第一の集光器と、から構成される第一のレーザー機構と、被加工物を保持する第二の保持手段をX軸方向、Y軸方向に加工送りする第二のX軸送り手段と、第二のY軸送り手段と、被加工物にレーザー光線を集光する第二の集光器と、から少なくとも構成される第二のレーザー機構と、発振器が発振したレーザー光線を該第一の集光器と該第二の集光器とに分岐する光学系と、該第一、第二のレーザー機構に対してそれぞれ加工条件を設定する第一の操作パネル、第二の操作パネルと、から少なくとも構成されるレーザー加工装置が提供される。
【選択図】図12
Description
第二のチャックテーブル機構3´は、上記した第一のチャックテーブル機構3と同様に、被加工物を保持する第二のチャックテーブル36´(第二の保持手段)と、該第二のチャックテーブル36´をX軸方向に加工送りする第二のX軸送り手段37´と、X軸方向に直交するY軸方向に加工送りする第二のY軸方向に加工送りする第二のY軸送り手段38´を有しており、同一の構成をなす第一のチャックテーブル機構3に付与されている各符号に「´」付した形で記載され、各構成の作用については、第一のチャックテーブル機構3と同一であるため、その詳細を省略する。
図示のレーザー光線照射手段5は、パルスレーザー光線発振手段52、分岐する前の光路上に配置された1/2波長板53、偏光ビームスプリッター54、第一、第二のビームシャッター55、59、第一、第二のアッテネータ56、60、第一、第二の波長設定手段57、61、分岐後の光路上に配置される第一、第二の1/2波長板58、62、及び第一、第二の集光器51、51´等を備えている。
図1、図4に示す第一、第二のカセット載置機構7、7´は、上記チャックテーブル機構3、3´のチャックテーブル36に対して被加工物を着脱する位置に隣接して設けられており、図示しない昇降手段により昇降させられる第一、第二のカセットテーブル71、71´上に複数の被加工物を収容するための第一、第二のカセット70、70´が載置される。
半導体ウエーハWが保持された第一のチャックテーブル36が第一の加工領域に位置付けられると、第一の撮像手段6及び制御手段によって、半導体ウエーハWのレーザー加工すべき加工領域を検出するアライメント工程を実行する。すなわち、第一の撮像手段6及び制御手段は、半導体ウエーハWの所定方向に形成されている加工予定ラインに沿ってレーザー光線を照射するレーザー光線照射手段5の第一の集光器51との位置合わせを行うためのパターンマッチング等の画像処理を実行し、レーザー光線照射位置を検出するアライメント工程を遂行する。また、半導体ウエーハWに形成されている所定方向に直交する方向に形成されている加工予定ラインに対しても同様にレーザー光線照射位置を検出するアライメント工程を遂行する。
1a、1b:第一、第二のレーザー機構
2:静止基台
3、3´:第一、第二のチャックテーブル機構
36、36´:第一、第二のチャックテーブル
4:レーザー光線照射ユニット
5:レーザー光線照射手段
51、51´:第一、第二の集光器
6、6´:第一、第二の撮像手段
7、7´:第一、第二のカセット載置機構
8、8´:第一、第二の仮置手段
9、9´:第一、第二の搬送手段
10、10´:第一、第二の搬入手段
11、11´:吸引パッド
200:ハウジング
201:第一の開閉扉
202:第一の操作パネル
203:第一の覗き窓
204:第二の開閉扉
205:第二の操作パネル
206:第二の覗き窓
Claims (3)
- レーザー加工装置であって、
被加工物を保持する第一の保持手段と、該第一の保持手段をX軸方向に加工送りする第一のX軸送り手段と、該第一の保持手段を該X軸方向に直交するY軸方向に加工送りする第一のY軸送り手段と、該第一の保持手段に保持された被加工物にレーザー光線を集光する第一の集光器と、から少なくとも構成される第一のレーザー機構と、
被加工物を保持する第二の保持手段と、該第二の保持手段をX軸方向に加工送りする第二のX軸送り手段と、該第二の保持手段を該X軸方向に直交するY軸方向に加工送りする第二のY軸送り手段と、該第二の保持手段に保持された被加工物にレーザー光線を集光する第二の集光器と、から少なくとも構成される第二のレーザー機構と、
レーザー光線を発振する発振器と、該発振器が発振したレーザー光線を該第一の集光器と該第二の集光器とに分岐する光学系と、
該第一のレーザー機構に対して加工条件を設定する第一の操作パネルと、該第二のレーザー機構に対して加工条件を設定する第二の操作パネルと、から少なくとも構成されるレーザー加工装置。 - 該レーザー加工装置は、該第一のレーザー機構及び該第二のレーザー機構を覆うハウジングを有し、該ハウジングには、該第一のレーザー機構に対して被加工物を搬入する位置に第一の開閉扉が配設され、該第二のレーザー機構に対して被加工物を搬入する位置に第二の開閉扉が配設され、
該第一の操作パネルは該第一の開閉扉に配設され、該第二の操作パネルは該第二の開閉扉に配設され、
該第一の開閉扉と該第二の開閉扉とは、該ハウジングのX軸方向と対向する面においてY軸方向に並設された、請求項1に記載のレーザー加工装置。 - 該第一の保持手段は、該第一のX軸送り手段によって被加工物を着脱する第一の着脱領域と、該第一の集光器から照射されるレーザー光線によって被加工物に加工を施す第一の加工領域とに位置付けられ、
該第一の着脱領域には、被加工物を収容したカセットが載置される第一のカセットテーブルと、該第一のカセットテーブルに載置されたカセットから被加工物が仮置きされる第一の仮置手段まで被加工物を搬送する第一の搬送手段と、該第一の仮置手段に搬送された被加工物を該第一の保持手段に搬入する第一の搬入手段とが配設され、
該第一の開閉扉は該第一のカセットテーブルに該カセットを着脱する際に開状態とされるものであり、
該第二の保持手段は、該第二のX軸送り手段によって被加工物を着脱する第二の着脱領域と、該第二の集光器から照射されるレーザー光線によって被加工物に加工を施す第二の加工領域とに位置付けられ、
該第二の着脱領域には、被加工物を収容したカセットが載置される第二のカセットテーブルと、該第二のカセットテーブルに載置されたカセットから被加工物が仮置きされる第二の仮置手段まで被加工物を搬送する第二の搬送手段と、該第二の仮置手段に搬送された被加工物を該保持手段に搬入する第二の搬入手段と、が配設され、
該第二の開閉扉は該第二のカセットテーブルにカセットを着脱する際に開状態とされるものである、請求項2に記載のレーザー加工装置。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015191941A JP6546823B2 (ja) | 2015-09-29 | 2015-09-29 | レーザー加工装置 |
TW105125174A TW201718159A (zh) | 2015-09-29 | 2016-08-08 | 雷射加工裝置 |
KR1020160113320A KR102468635B1 (ko) | 2015-09-29 | 2016-09-02 | 레이저 가공 장치 |
MYPI2016703315A MY183578A (en) | 2015-09-29 | 2016-09-09 | Laser processing apparatus |
SG10201607633RA SG10201607633RA (en) | 2015-09-29 | 2016-09-14 | Laser processing apparatus |
US15/270,610 US10722980B2 (en) | 2015-09-29 | 2016-09-20 | Laser processing apparatus |
CN201610849546.3A CN107030391B (zh) | 2015-09-29 | 2016-09-23 | 激光加工装置 |
DE102016218865.8A DE102016218865A1 (de) | 2015-09-29 | 2016-09-29 | Laserbearbeitungsvorrichtung |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015191941A JP6546823B2 (ja) | 2015-09-29 | 2015-09-29 | レーザー加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017064744A true JP2017064744A (ja) | 2017-04-06 |
JP6546823B2 JP6546823B2 (ja) | 2019-07-17 |
Family
ID=58282207
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015191941A Active JP6546823B2 (ja) | 2015-09-29 | 2015-09-29 | レーザー加工装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US10722980B2 (ja) |
JP (1) | JP6546823B2 (ja) |
KR (1) | KR102468635B1 (ja) |
CN (1) | CN107030391B (ja) |
DE (1) | DE102016218865A1 (ja) |
MY (1) | MY183578A (ja) |
SG (1) | SG10201607633RA (ja) |
TW (1) | TW201718159A (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108044355A (zh) * | 2017-12-22 | 2018-05-18 | 沈阳芯嘉科技有限公司 | 一种激光砂轮划片机及复合材料切割方法 |
WO2018181736A1 (ja) | 2017-03-29 | 2018-10-04 | Agc株式会社 | 水性分散液および水性分散液の製造方法 |
KR20190032485A (ko) * | 2017-09-06 | 2019-03-27 | 히라따기꼬오 가부시키가이샤 | 작업장치 및 작업시스템 |
JP2019107681A (ja) * | 2017-12-19 | 2019-07-04 | 東京エレクトロン株式会社 | レーザー加工装置、およびレーザー加工方法 |
JP2019107682A (ja) * | 2017-12-19 | 2019-07-04 | 東京エレクトロン株式会社 | レーザー加工装置、およびレーザー加工方法 |
JP2020171961A (ja) * | 2019-04-09 | 2020-10-22 | 株式会社ディスコ | レーザー加工装置 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6976745B2 (ja) * | 2017-06-30 | 2021-12-08 | 株式会社ディスコ | ウエーハ生成装置 |
US20190151993A1 (en) * | 2017-11-22 | 2019-05-23 | Asm Technology Singapore Pte Ltd | Laser-cutting using selective polarization |
JP7009194B2 (ja) * | 2017-12-12 | 2022-01-25 | 株式会社ディスコ | ウエーハ生成装置および搬送トレー |
JP6727361B2 (ja) * | 2018-03-09 | 2020-07-22 | 平田機工株式会社 | レーザ処理装置、及び加工処理方法 |
CN108817391B (zh) * | 2018-08-17 | 2023-08-15 | 北京万维增材科技有限公司 | 一种双熔覆头激光熔覆金属增材制造设备 |
JP7164396B2 (ja) * | 2018-10-29 | 2022-11-01 | 株式会社ディスコ | ウエーハ生成装置 |
US11534862B2 (en) * | 2019-04-09 | 2022-12-27 | Disco Corporation | Laser processing apparatus |
DE102021102387A1 (de) | 2021-02-02 | 2022-08-04 | Trumpf Laser- Und Systemtechnik Gmbh | Vorrichtung und Verfahren zur Laserbearbeitung eines Werkstücks |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09308983A (ja) * | 1996-05-17 | 1997-12-02 | Sumitomo Heavy Ind Ltd | レーザ加工装置 |
JP2001203145A (ja) * | 2000-01-20 | 2001-07-27 | Nikon Corp | 露光装置 |
US20090255911A1 (en) * | 2008-04-10 | 2009-10-15 | Applied Materials, Inc. | Laser scribing platform and hybrid writing strategy |
JP2011009552A (ja) * | 2009-06-26 | 2011-01-13 | Dainippon Screen Mfg Co Ltd | 描画システムおよびパターン形成システム |
US20110228073A1 (en) * | 2010-03-19 | 2011-09-22 | Lightspeed Genomics, Inc. | Illumination apparatus optimized for synthetic aperture optics imaging using minimum selective excitation patterns |
JP2011187481A (ja) * | 2010-03-04 | 2011-09-22 | Disco Corp | 加工装置 |
US20110233178A1 (en) * | 2010-03-29 | 2011-09-29 | Chi Wah Cheng | Laser processing apparatus |
JP2013126688A (ja) * | 2011-11-14 | 2013-06-27 | Canon Inc | レーザ加工装置、レーザ加工方法、基板の製造方法及びインクジェットヘッドの製造方法 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4653903A (en) * | 1984-01-24 | 1987-03-31 | Canon Kabushiki Kaisha | Exposure apparatus |
US5290992A (en) * | 1992-10-07 | 1994-03-01 | International Business Machines Corporation | Apparatus for maximizing light beam utilization |
KR100446052B1 (ko) * | 1997-05-15 | 2004-10-14 | 스미도모쥬기가이고교 가부시키가이샤 | 다수의갈바노스캐너를사용한레이저빔가공장치 |
JP2004160483A (ja) * | 2002-11-12 | 2004-06-10 | Disco Abrasive Syst Ltd | レーザー加工方法およびレーザー加工装置 |
US7364952B2 (en) | 2003-09-16 | 2008-04-29 | The Trustees Of Columbia University In The City Of New York | Systems and methods for processing thin films |
US20060114948A1 (en) * | 2004-11-29 | 2006-06-01 | Lo Ho W | Workpiece processing system using a common imaged optical assembly to shape the spatial distributions of light energy of multiple laser beams |
JP4571851B2 (ja) | 2004-11-30 | 2010-10-27 | 株式会社ディスコ | 切削装置 |
JP4769048B2 (ja) * | 2005-08-23 | 2011-09-07 | 株式会社ディスコ | 基板の加工方法 |
JP5101073B2 (ja) * | 2006-10-02 | 2012-12-19 | 浜松ホトニクス株式会社 | レーザ加工装置 |
JP2008110383A (ja) | 2006-10-31 | 2008-05-15 | Disco Abrasive Syst Ltd | レーザー加工装置 |
JP2008126252A (ja) | 2006-11-17 | 2008-06-05 | Disco Abrasive Syst Ltd | レーザー加工装置 |
CN101020277A (zh) * | 2007-03-22 | 2007-08-22 | 苏州德龙激光有限公司 | 分布式激光加工系统 |
JP2010158691A (ja) | 2009-01-07 | 2010-07-22 | Disco Abrasive Syst Ltd | レーザー加工装置 |
JP5473415B2 (ja) | 2009-06-10 | 2014-04-16 | 株式会社ディスコ | レーザ加工装置 |
JP5473414B2 (ja) * | 2009-06-10 | 2014-04-16 | 株式会社ディスコ | レーザ加工装置 |
CN201754204U (zh) * | 2010-06-22 | 2011-03-02 | 深圳市大族激光科技股份有限公司 | 一种激光分光装置及激光加工设备 |
JP5964621B2 (ja) | 2012-03-16 | 2016-08-03 | 株式会社ディスコ | レーザー加工装置 |
KR101416411B1 (ko) * | 2012-12-28 | 2014-08-08 | 현대자동차 주식회사 | 레이저 용접기 |
CN104682463A (zh) * | 2013-11-29 | 2015-06-03 | 陕西荣基实业有限公司 | 一种用于氢气燃料电源电源柜 |
CN103913412A (zh) * | 2014-04-22 | 2014-07-09 | 苏州华周胶带有限公司 | 一种胶带真空老化箱 |
CN204361539U (zh) * | 2015-01-30 | 2015-05-27 | 南宁市金德泰电控设备制造有限公司 | 一种高低压配电柜 |
-
2015
- 2015-09-29 JP JP2015191941A patent/JP6546823B2/ja active Active
-
2016
- 2016-08-08 TW TW105125174A patent/TW201718159A/zh unknown
- 2016-09-02 KR KR1020160113320A patent/KR102468635B1/ko active IP Right Grant
- 2016-09-09 MY MYPI2016703315A patent/MY183578A/en unknown
- 2016-09-14 SG SG10201607633RA patent/SG10201607633RA/en unknown
- 2016-09-20 US US15/270,610 patent/US10722980B2/en active Active
- 2016-09-23 CN CN201610849546.3A patent/CN107030391B/zh active Active
- 2016-09-29 DE DE102016218865.8A patent/DE102016218865A1/de active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09308983A (ja) * | 1996-05-17 | 1997-12-02 | Sumitomo Heavy Ind Ltd | レーザ加工装置 |
JP2001203145A (ja) * | 2000-01-20 | 2001-07-27 | Nikon Corp | 露光装置 |
US20090255911A1 (en) * | 2008-04-10 | 2009-10-15 | Applied Materials, Inc. | Laser scribing platform and hybrid writing strategy |
JP2011009552A (ja) * | 2009-06-26 | 2011-01-13 | Dainippon Screen Mfg Co Ltd | 描画システムおよびパターン形成システム |
JP2011187481A (ja) * | 2010-03-04 | 2011-09-22 | Disco Corp | 加工装置 |
US20110228073A1 (en) * | 2010-03-19 | 2011-09-22 | Lightspeed Genomics, Inc. | Illumination apparatus optimized for synthetic aperture optics imaging using minimum selective excitation patterns |
US20110233178A1 (en) * | 2010-03-29 | 2011-09-29 | Chi Wah Cheng | Laser processing apparatus |
JP2013126688A (ja) * | 2011-11-14 | 2013-06-27 | Canon Inc | レーザ加工装置、レーザ加工方法、基板の製造方法及びインクジェットヘッドの製造方法 |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018181736A1 (ja) | 2017-03-29 | 2018-10-04 | Agc株式会社 | 水性分散液および水性分散液の製造方法 |
KR20190032485A (ko) * | 2017-09-06 | 2019-03-27 | 히라따기꼬오 가부시키가이샤 | 작업장치 및 작업시스템 |
KR102259288B1 (ko) * | 2017-09-06 | 2021-05-31 | 히라따기꼬오 가부시키가이샤 | 작업장치 및 작업시스템 |
US11583963B2 (en) | 2017-09-06 | 2023-02-21 | Hirata Corporation | Processing device and processing system |
JP2019107681A (ja) * | 2017-12-19 | 2019-07-04 | 東京エレクトロン株式会社 | レーザー加工装置、およびレーザー加工方法 |
JP2019107682A (ja) * | 2017-12-19 | 2019-07-04 | 東京エレクトロン株式会社 | レーザー加工装置、およびレーザー加工方法 |
JP6999401B2 (ja) | 2017-12-19 | 2022-01-18 | 東京エレクトロン株式会社 | レーザー加工装置 |
JP6999402B2 (ja) | 2017-12-19 | 2022-01-18 | 東京エレクトロン株式会社 | レーザー加工装置 |
CN108044355A (zh) * | 2017-12-22 | 2018-05-18 | 沈阳芯嘉科技有限公司 | 一种激光砂轮划片机及复合材料切割方法 |
CN108044355B (zh) * | 2017-12-22 | 2024-01-23 | 沈阳芯嘉科技有限公司 | 一种激光砂轮划片机及复合材料切割方法 |
JP2020171961A (ja) * | 2019-04-09 | 2020-10-22 | 株式会社ディスコ | レーザー加工装置 |
JP7449097B2 (ja) | 2019-04-09 | 2024-03-13 | 株式会社ディスコ | レーザー加工装置 |
Also Published As
Publication number | Publication date |
---|---|
TW201718159A (zh) | 2017-06-01 |
US10722980B2 (en) | 2020-07-28 |
CN107030391B (zh) | 2020-07-31 |
US20170087671A1 (en) | 2017-03-30 |
KR20170038146A (ko) | 2017-04-06 |
SG10201607633RA (en) | 2017-04-27 |
KR102468635B1 (ko) | 2022-11-17 |
CN107030391A (zh) | 2017-08-11 |
DE102016218865A1 (de) | 2017-03-30 |
JP6546823B2 (ja) | 2019-07-17 |
MY183578A (en) | 2021-02-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2017064744A (ja) | レーザー加工装置 | |
JP2017064743A (ja) | レーザー加工装置 | |
TWI582875B (zh) | A laser processing device with a plasma detection mechanism | |
JP5456510B2 (ja) | レーザ加工装置 | |
TWI630967B (zh) | Laser processing device | |
TWI680821B (zh) | 雷射加工裝置 | |
JP2018098363A (ja) | レーザー加工装置 | |
TW201433395A (zh) | 雷射加工方法 | |
JP4555092B2 (ja) | レーザー加工装置 | |
JP6844901B2 (ja) | レーザ加工装置及びレーザ加工方法 | |
TWI538041B (zh) | Processing method of optical element wafers | |
TW201618173A (zh) | 晶圓的加工方法 | |
TW201029784A (en) | Laser machining device | |
JP5495869B2 (ja) | レーザー加工溝の確認方法 | |
JP5683121B2 (ja) | レーザ加工装置 | |
JP2014116361A (ja) | ウエーハのレーザー加工方法およびレーザー加工装置 | |
TWI590900B (zh) | Sapphire substrate processing methods | |
JP2008110383A (ja) | レーザー加工装置 | |
JP2011146656A5 (ja) | ウェハ処理装置、ウェハ処理方法およびデバイスの製造方法 | |
TW201740444A (zh) | 封裝晶圓的對準方法 | |
JP2013000777A (ja) | レーザー加工装置 | |
JP4782544B2 (ja) | レーザー加工装置 | |
JP6968693B2 (ja) | 加工装置 | |
KR20180052537A (ko) | 반송 장치, 가공 장치 및 반송 방법 | |
JP2009061486A (ja) | レーザ加工装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180724 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20190516 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20190528 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20190624 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6546823 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |