CN107030391A - 激光加工装置 - Google Patents
激光加工装置 Download PDFInfo
- Publication number
- CN107030391A CN107030391A CN201610849546.3A CN201610849546A CN107030391A CN 107030391 A CN107030391 A CN 107030391A CN 201610849546 A CN201610849546 A CN 201610849546A CN 107030391 A CN107030391 A CN 107030391A
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
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- B23K26/046—Automatically focusing the laser beam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B23K26/0626—Energy control of the laser beam
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K2101/40—Semiconductor devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- Dicing (AREA)
Abstract
提供一种激光加工装置,其具有:第一激光机构,该第一激光机构包含:第一X轴进给构件、第一Y轴进给构件,它们在X轴、Y轴方向上对第一卡盘工作台进行加工进给;第一卡盘工作台,其对被加工物进行保持;以及第一聚光器,其将激光光线聚光到被加工物;第二激光机构,其包含:第二X轴进给构件、第二Y轴进给构件,它们在X轴方向、Y轴方向上对第二卡盘工作台进行加工进给;第二卡盘工作台,其对被加工物进行保持;以及第二聚光器,其将激光光线聚光到被加工物;光学系统,其将激光振荡器振荡出的激光光线分支到该第一聚光器和该第二聚光器;以及第一操作面板、第二操作面板,它们对该第一、第二激光机构分别设定加工条件。
Description
技术领域
本发明涉及激光加工装置,对半导体晶片等被加工物照射激光光线而进行加工。
背景技术
在通过激光加工装置制造半导体器件的工序中,在作为大致圆板形状的半导体晶片的正面上通过排列成格子状的分割预定线而划分出多个区域,在该划分出的区域中形成IC、LSI等器件,沿着该分割预定线照射激光光线而对该半导体晶片进行切断,由此对形成有器件的区域进行分割而制造出一个个的半导体器件芯片。
公知该激光加工装置能够对被加工物实施期望的激光加工(例如,参照专利文献1),其包含:卡盘工作台,其对被加工物进行保持;激光光线照射构件,其对保持在该卡盘工作台上的被加工物照射激光光线;以及加工进给构件,其对该卡盘工作台进行加工进给,该激光光线照射构件包含:激光振荡器,其振荡出激光光线;聚光器,其对由该激光振荡器振荡出的激光光线进行聚光并向保持在该卡盘工作台上的被加工物照射;以及衰减器,其配设在该激光振荡器与该聚光器之间,对激光光线的输出进行调整。
并且,关于激光加工装置所采用的激光光线的激光振荡器,为了能够应对各种加工,多数情况下由比较大的输出构成,通常情况下使用衰减器将输出调整得较低以便获得对被加工物适当的输出。
专利文献1:日本特开2010-158691号公报
像上述那样,关于从激光加工装置所采用的激光振荡器输出的激光光线,在其输出被调整为较低之后使用,例如,对于只利用原本激光振荡器可以发挥的输出的1/2以下的输出的被加工物而言,从激光振荡器发出的激光光线的输出的1/2以上被舍弃,存在能力无法充分利用、不经济这样的问题。
发明内容
因此,本发明是鉴于上述情况而完成的,其主要的技术课题在于,提供激光加工装置,在作为激光加工装置的激光振荡器采用输出较大的激光振荡器的情况下,也能够充分地利用其能力。
为了解决上述主要的技术课题,根据本发明,提供一种激光加工装置,其中,该激光加工装置具有:第一激光机构,其包含:第一卡盘工作台,其对被加工物进行保持;第一X轴进给构件,其在X轴方向上对该第一卡盘工作台进行加工进给;第一Y轴进给构件,其在垂直于该X轴方向的Y轴方向上对该第一卡盘工作台进行加工进给;以及第一聚光器,其将激光光线聚光到该第一卡盘工作台上所保持的被加工物;第二激光机构,其包含:第二卡盘工作台,其对被加工物进行保持;第二X轴进给构件,其在X轴方向上对该第二卡盘工作台进行加工进给;第二Y轴进给构件,其在垂直于该X轴方向的Y轴方向上对该第二卡盘工作台进行加工进给;以及第二聚光器,其将激光光线聚光到该第二卡盘工作台上所保持的被加工物;激光振荡器,其振荡出激光光线;光学系统,其将该激光振荡器振荡出的激光光线分支到该第一聚光器和该第二聚光器;第一操作面板,其对该第一激光机构设定加工条件;以及第二操作面板,其对该第二激光机构设定加工条件。
该激光加工装置具有将该第一激光机构和该第二激光机构罩住的机壳,在该机壳中,在对该第一激光机构搬入被加工物的位置配设有第一开闭门,在对该第二激光机构搬入被加工物的位置配设有第二开闭门,该第一操作面板配设于该第一开闭门,该第二操作面板配设于该第二开闭门,该第一开闭门和该第二开闭门在该机壳的垂直于X轴方向的面上沿Y轴方向并排设置。
该第一卡盘工作台定位于第一装卸区域和第一加工区域,在该第一装卸区域中,通过该第一X轴进给构件对被加工物进行装卸,在该第一加工区域中,通过从该第一聚光器照射的激光光线对被加工物实施加工,在该第一装卸区域中配设有:第一盒工作台,其对收纳了被加工物的盒进行载置;第一搬送构件,其将被加工物从载置于该第一盒工作台的盒搬送到临时载置被加工物的第一临时载置构件;以及第一搬入构件,其将搬送到该第一临时载置构件的被加工物搬入该第一卡盘工作台,当相对于该第一盒工作台对该盒进行装卸时,该第一开闭门成为打开状态,该第二卡盘工作台定位于第二装卸区域和第二加工区域,在该第二装卸区域中,通过该第二X轴进给构件对被加工物进行装卸,在该第二加工区域中,通过从该第二聚光器照射的激光光线对被加工物实施加工,在该第二装卸区域中配设有:第二盒工作台,其对收纳了被加工物的盒进行载置;第二搬送构件,其将被加工物从载置于该第二盒工作台的盒搬送到临时载置被加工物的第二临时载置构件;以及第二搬入构件,其将搬送到该第二临时载置构件的被加工物搬入该卡盘工作台,当相对于该第二盒工作台对该盒进行装卸时,该第二开闭门成为打开状态。
根据本发明的激光加工装置,对一台激光振荡器的输出进行分支而构成2个激光机构,实质上可以提供2台激光加工装置,通过对各个激光机构设置用于对各激光机构进行操作的第一、第二操作面板,而能够充分地发挥激光振荡器的能力,同时执行2个激光加工,是经济的。由于振荡出激光光线的激光振荡器是高价的,因此根据本发明的结构,能够降低每一台激光加工装置的成本。
此外,在本发明的激光加工装置中,第一操作面板设置于第一开闭门,该第二操作面板设置于第二开闭门,该第一开闭门与该第二开闭门在该机壳的垂直于X轴方向的面上沿Y轴方向并排设置,能够分别高效地对2台激光机构进行操作。
并且,由于该第一卡盘工作台定位于第一装卸区域和第一加工区域,在该第一装卸区域中,通过该第一X轴进给构件对被加工物进行装卸,在该第一加工区域中,通过从该第一聚光器照射的激光光线对被加工物实施加工,在该第一装卸区域中配设有:第一盒工作台,其对收纳了被加工物的盒进行载置;第一搬送构件,其将被加工物从载置于该第一盒工作台的盒搬送到临时载置被加工物的第一临时载置构件;以及第一搬入构件,其将搬送到该第一临时载置构件的被加工物搬入该第一卡盘工作台,当相对于该第一盒工作台对该盒进行装卸时,使该第一开闭门成为打开状态,该第二卡盘工作台定位于第二装卸区域和第二加工区域,在该第二装卸区域中,通过该第二X轴进给构件对被加工物进行装卸,在该第二加工区域中,通过从该第二聚光器照射的激光光线对被加工物实施加工,在该第二装卸区域中配设有:第二盒工作台,其对收纳了被加工物的盒进行载置;第二搬送构件,其将被加工物从载置于该第二盒工作台的盒搬送到临时载置被加工物的第二临时载置构件,以及第二搬入构件,其将搬送到该第二临时载置构件的被加工物搬入该卡盘工作台,当相对于该第二盒工作台对该盒进行装卸时,该第二开闭门成为打开状态,例如,在使第一开闭门成为打开状态,而将盒从外部搬入第一盒工作台的情况下等时,能够防止错误地对操作面板进行操作而使第一激光机构工作。在使第二开闭门成为打开状态的情况下也能够得到相同的作用效果。
附图说明
图1是根据本发明而构成的激光加工装置的整体立体图。
图2是示出图1所示的激光加工装置的主要部分的立体图。
图3是图1所示的激光加工装置的激光光线照射构件的框图。
图4是图1所示的激光加工装置的盒载置机构的立体图。
图5是图1所示的激光加工装置的第一、第二临时载置构件的立体图。
图6是图1所示的激光加工装置的第一、第二搬送构件的立体图。
图7是图1所示的激光加工装置的第一、第二搬入构件的立体图。
图8是示出在图1所示的激光加工装置中,将第一搬送构件定位于将第一盒载置机构的半导体晶片W拉出的位置的状态的立体图。
图9是示出在图1所示的激光加工装置中,将半导体晶片W搬送到第一临时载置构件上并进行临时载置的状态的立体图。
图10是示出在图1所示的激光加工装置中,利用第一搬入构件对临时载置在第一临时载置构件上的半导体晶片W进行保持的状态的立体图。
图11是示出在图1所示的激光加工装置中,通过第一搬入构件将半导体晶片W搬入到卡盘工作台上的状态的立体图。
图12是示出根据本发明构成的激光加工装置被机壳覆盖的状态的立体图。
标号说明
1:激光加工装置;1a、1b:第一、第二激光机构;2:静止基台;3、3′:第一、第二卡盘工作台机构;36、36′:第一、第二卡盘工作台;4:激光光线照射单元;5:激光光线照射构件;51、51′:第一、第二聚光器;6、6′:第一、第二拍摄构件;7、7′:第一、第二盒载置机构;8、8′:第一、第二临时载置构件;9、9′:第一、第二搬送构件;10、10′:第一、第二搬入构件;11、11′:吸引垫;200:机壳;201:第一开闭门;202:第一操作面板;203:第一观察窗;204:第二开闭门;205:第二操作面板;206:第二观察窗。
具体实施方式
以下,关于根据本发明构成的激光加工装置的优选的实施方式,参照附图详细地进行说明。
图1中示出本发明的激光加工装置1的整体立体图。图1所示的激光加工装置1具有:静止基台2;第一卡盘工作台机构3,其以能够在箭头X所示的X轴方向上移动的方式配设于该静止基台2,对被加工物进行保持;第二卡盘工作台机构3′,其与第一卡盘工作台机构3并列地配设,同样地以能够在X轴方向上移动的方式配设,对被加工物进行保持;以及作为激光光线照射构件的激光光线照射单元4,其配置在静止基台2上的夹在该第一、第二卡盘工作台机构3、3′之间的区域,在图1中观察时,在近前侧形成包含第一卡盘工作台机构3的第一激光机构1a,夹着激光光线照射单元4在里侧形成包含第二卡盘工作台机构3′的第二激光机构1b。
为了详细地说明图1所示的本实施方式的激光加工装置的构造,在图2中示出从静止基台2上拆卸图1的第一、第二盒工作台7、7′、第一、第二临时载置构件8、8′、第一、第二搬送构件9、9′以及第一、第二搬入构件10、10′的状态。设置在静止基台2的大致中央所配设的激光光线照射单元4的图2中的近前侧的区域的第一卡盘工作台机构3具有:第一一对导轨31、31,它们被配设为能够在X轴方向上移动;移动基台32,其被配设为能够在该导轨31、31上滑动;滑动块33,其被配设为能够在与X轴方向垂直的箭头Y所示的Y轴方向上移动;罩台35,其借助圆筒部件34支承在该滑动块33上;以及作为保持构件的第一卡盘工作台36(第一保持构件),其对被加工物进行保持。该第一卡盘工作台36具有由多孔性材料形成的吸附卡盘361,在作为吸附卡盘361的上表面的保持面上通过使未图示的吸引构件工作而保持被加工物。通过配设在圆筒部件34内的未图示的脉冲电机使这样构成的第一卡盘工作台36旋转。另外,在卡盘工作台36上配设有夹具362,该夹具362用于固定环状的框架F,该框架F隔着保护带T支承作为被加工物的半导体晶片W。
上述移动基台32在下表面上设置有与上述一对导轨31、31嵌合的一对被引导槽321、321,并且在上表面上设置有沿着Y轴方向平行地形成的一对导轨322、322。这样构成的移动基台32构成为因被引导槽321、321与一对导轨31、31嵌合而能够沿着一对导轨31、31在X轴方向上移动。第一卡盘工作台机构3具有用于使移动基台32沿着一对导轨31、31在X轴方向上移动的第一X轴进给构件37。第一X轴进给构件37包含:外螺杆371,其平行地配设在上述一对导轨31与31之间;以及脉冲电机372等驱动源,其用于对该外螺杆371进行旋转驱动。外螺杆371的一端旋转自如地支承于上述静止基台2上所固定的轴承块373,其另一端与上述脉冲电机372的输出轴传动连结。另外,外螺杆371与在移动基台32的中央部下表面上突出设置的未图示的内螺纹块上所形成的贯穿内螺纹孔螺合。因此,通过脉冲电机372对外螺杆371进行正转和反转驱动,而使移动基台32沿着导轨31、31在X轴方向上移动。
在第一卡盘工作台机构3中设置有用于对上述第一卡盘工作台36的X轴方向位置进行检测的X轴方向位置检测构件(省略图示)。该X轴方向位置检测构件例如每1μm将1脉冲的脉冲信号发送给未图示的控制构件。并且,该控制构件通过对所输入的脉冲信号进行计数而检测卡盘工作台36的X轴方向位置。另外,在作为上述X轴进给构件37的驱动源使用脉冲电机372的情况下,也可以通过对输出脉冲电机372的驱动信号的控制构件的驱动脉冲进行计数,而检测卡盘工作台36的X轴方向位置。并且,在作为上述X轴进给构件37的驱动源使用伺服电机的情况下,也可以通过将检测伺服电机的转速的编码器所输出的脉冲信号发送给控制构件,对该控制构件所输入的脉冲信号进行计数,而检测卡盘工作台36的X轴方向位置。
上述滑动块33在下表面上设置有一对被引导槽331、331,该一对被引导槽331、331与上述移动基台32的上表面上所设置的一对导轨322、322嵌合,该上述滑动块33构成为通过使该被引导槽331、331与一对导轨322、322嵌合而能够在Y轴方向上移动。在第一卡盘工作台机构3上具有Y轴进给构件38,该Y轴进给构件38用于使滑动块33沿着设置于移动基台32的一对导轨322、322在Y轴方向上移动。Y轴进给构件38包含:外螺杆381,其平行地配设在上述一对导轨322、322之间;以及脉冲电机382等驱动源,其用于对该外螺杆381进行旋转驱动。外螺杆381的一端旋转自如地支承于上述移动基台32的上表面上所固定的轴承块383,另一端与上述脉冲电机382的输出轴传动连结。另外,外螺杆381与在滑动块33的中央部下表面上突出设置的未图示的内螺纹块上所形成的贯穿内螺纹孔螺合。通过该脉冲电机382对外螺杆381进行正转和反转驱动,而使滑动块33沿着导轨322、322在Y轴方向上移动。
在第一卡盘工作台机构3中设置有Y轴方向位置检测构件,与X轴方向同样地,该Y轴方向位置检测构件用于检测上述卡盘工作台36的Y轴方向位置(省略图示)。该Y轴方向位置检测构件例如每1μm将1脉冲的脉冲信号发送给上述控制构件。并且,该控制构件通过对所输入的脉冲信号进行计数而检测卡盘工作台36的Y轴方向位置。另外,在作为上述Y轴进给构件的驱动源使用脉冲电机382的情况下,通过对输出脉冲电机382的驱动信号的该控制构件的驱动脉冲进行计数,而能够检测卡盘工作台36的Y轴方向位置。并且,在作为上述Y轴进给构件38的驱动源使用伺服电机的情况下,也可以通过将检测伺服电机的转速的编码器所输出的脉冲信号发送给后述的控制构件,对控制构件所输入的脉冲信号进行计数,而检测卡盘工作台36的Y轴方向位置。
此外,如图2所示,在本实施方式的激光加工装置中,夹着配置于静止基台2的上表面的激光光线照射单元4,在上述第一卡盘工作台机构3的相反侧的区域中具有第二卡盘工作台机构3′。第二卡盘工作台机构3′与上述的第一卡盘工作台机构3同样具有:第二卡盘工作台36′(第二保持构件),其对被加工物进行保持;第二X轴进给构件37′,其在X轴方向上对该第二卡盘工作台36′进行加工进给;以及第二Y轴进给构件38′,其在与X轴方向垂直的Y轴方向上进行加工进给,按照对形成同一结构的第一卡盘工作台机构3的各标号赋予“′”的方式进行记载,关于各结构的作用,由于与第一卡盘工作台机构3相同,因此省略其详细情况。
上述激光光线照射单元4具有:配设在上述静止基台2上的支承部件41;以及支承于该支承部件41的壳体42,壳体42具有:延长部42a、42b,它们分别向上述第一、第二卡盘工作台机构3、3′侧水平地延长,并收纳有后述的激光光线照射构件5的光学系统;第一、第二聚光器51、51′,它们分别配设于延长部42a、42b,构成激光光线照射构件5的一部分;以及第一、第二拍摄构件6、6′,它们对应该激光加工的加工区域进行检测。另外,拍摄构件6、6′具有:照明构件,其照射被加工物;光学系统,其捕捉由该照明构件照射的区域;以及拍摄元件(CCD)等,其拍摄由该光学系统捕捉到的像,该拍摄构件6、6′构成为将拍摄到的图像信号发送给控制构件。
使用图3对激光光线照射构件5进一步详细地说明。激光光线照射构件5具有:脉冲激光光线振荡单元52;配置在分支前的光路上的1/2波长板53;偏光分束器54;第一、第二光束遮光器55、59;第一、第二衰减器56、60;第一、第二波长设定单元57、61;配置在分支后的光路上的第一、第二1/2波长板58、62;以及第一、第二聚光器51、51′等。
脉冲激光光线振荡单元52包含未图示的激光振荡器和重复频率设定单元,例如,振荡出波长被设定为1064nm、重复频率被设定为50kHz的激光光线LB。该激光光线LB被偏光分束器54分支成由偏光分束器54反射的S偏光的第一激光束LB1(第一光路)和透射过偏光分束器54的P偏光的第二激光束LB2(第二光路)。
在脉冲激光光线振荡单元52与偏光分束器54之间插入1/2波长板53,能够通过未图示的旋转角度调整单元对该1/2波长板53的旋转角度进行调整,而使该1/2波长板53的出射光的偏光面旋转。由此,能够通过使该1/2波长板53的偏光面旋转,而连续性地改变从偏光分束器54输出的S偏光的第一激光束LB1与P偏光的第二激光束LB2的强度比。
在从偏光分束器54射出的第一、第二激光束LB1、LB2的光路上配设有第一、第二光束遮光器55、59。各光束遮光器55、59中具有未图示的遮光器驱动装置,构成为能够驱动到切断该激光束LB1、LB2的位置和不切断的位置,能够适当切换为只对被加工物照射第一激光束LB1、只对被加工物照射第二激光束LB2、或者同时对各被加工物照射这双方等方式。
通过了第一、第二光束遮光器55、59的第一、第二激光束LB1、LB2的强度分别被第一、第二衰减器56、60调整。第一、第二衰减器56、60能够使用公知的激光光线的可变衰减器,与针对被加工物的必要的加工条件对应地适当将激光强度调整为可变。
在经过了第一、第二衰减器56、60的第一、第二激光束LB1、LB2的光路上配置有第一、第二波长设定单元57、61。例如,能够使从激光光线振荡单元52振荡出的波长为1064nm的激光光线通过非线性晶体而转换成532nm的波长,进一步通过单晶而转换成波长为355nm的波长。在对于被加工物使用具有透过性的波长(1064nm)而在内部形成变质层的情况、或使用具有吸收性的波长(355nm)而对正面进行烧蚀加工的情况等,能够通过该波长设定单元适当切换,通过在各光路上具有该第一、第二波长设定单元57、61而能够设定成使第一、第二激光束LB1、LB2的波长不同。
此外,在经过了上述第一、第二波长设定单元57、61的第一、第二激光束LB1、LB2的光路上配设有第一、第二1/2波长板58、62。在第一、第二1/2波长板58、62上分别具有未图示的旋转驱动构件,能够使各1/2波长板58、62旋转。各1/2波长板58、62与作为加工对象的被加工物的材质对应地调整第一激光束LB1和第二激光束LB2的偏光面的方向,调整成适合被加工物的材质的激光光线的偏光面的方向。
并且,通过了上述第一、第二1/2波长板58、62的第一、第二激光束LB1、LB2向设置于各个光路的最终端的第一、第二聚光器51、51′入射,通过各聚光器51、51′所具有的未图示的聚光透镜而聚光到第一、第二卡盘工作台36、36′上所保持的被加工物。
本实施方式的激光光线照射构件5构成为如上,上述的光学系统收纳于壳体42的延长部42a、42b,该壳体42夹在静止基台2的第一、第二卡盘工作台机构3、3′之间且配置于大致中央位置,第一、第二聚光器51、51′被配设为在延长部42a、42b的端部、能够面向第一、第二卡盘工作台36、36′的位置、即面向与对被加工物进行激光加工的第一、第二卡盘工作台36、36′的位置对应的第一、第二加工区域。
另外,在本实施方式中,以X轴、Y轴进给构件具有:平行地配设在一对导轨间的外螺杆;以及设置于移动基台、或者滑动块的下表面的具有与外螺杆螺合的内螺纹孔的内螺纹块,X轴、Y轴进给构件由用于对该外螺杆进行旋转驱动的脉冲电机等驱动源构成的方式进行了说明,但本发明不限于此,例如,也可以采用由所谓轴线性马达构成的结构,该结构包括线性导轨和移动基台或线圈动子,其中,该线性导轨取代外螺杆而在X轴、Y轴方向上延伸,该移动基台以能够移动的方式嵌插于该线性导轨且在其上方配设有卡盘工作台,该线圈动子装配于滑动块。
返回图1继续进行说明,在上述静止基台2上具有:第一、第二盒载置机构7、7′,它们载置有用于收纳半导体晶片等多个被加工部的第一、第二盒70、70′;第一、第二临时载置构件8、8′,它们临时地承载从该第一、第二盒70、70′取出的被加工物;第一、第二搬送构件9、9′,它们用于相对于第一、第二盒70、70′将被加工物的取出及收纳;以及第一、第二搬入构件10、10′,它们用于将临时载置在第一、第二临时载置构件8、8′上的被加工物搬入卡盘工作台36的上表面,并且将加工后的被加工物载置在上述第一、第二临时载置构件8、8′上。
以下,关于配设在静止基台2上的上述盒载置机构、临时载置构件、搬出构件、搬入构件等,详细地进行说明。图1、图4所示的第一、第二盒载置机构7、7′与相对于上述卡盘工作台机构3、3′的卡盘工作台36装卸被加工物的被加工物装卸区域相邻地设置,将用于收纳多个被加工物的第一、第二盒70、70′载置在由未图示的升降构件升降的第一、第二盒工作台71、71′上。
参照图1、图5对第一、第二临时载置构件8、8′进行说明。第一、第二临时载置构件8、8′与上述盒载置机构7、7′的X轴方向相邻地设置,配设在相对于卡盘工作台36、36′装卸被加工物的被加工物装卸区域的正上方。该第一、第二临时载置构件8、8′具有:截面L字状且形成为长条的支承轨道81a、81b、81a′、81b′;支承轨道移动构件82、82′,它们构成为支承该支承轨道81a、81b、81a′、81b′的端部,并且能够在Y轴方向上移动以便使两者的间隔变窄或变宽。关于由该支承轨道81a、81b、81a′、81b′形成的间隔,当变窄时设定为能够对隔着保护带T支承作为被加工物的半导体晶片W的环状的框架F的外径进行保持这样的尺寸,当变宽时设定为两者的间隔比框架F的外径宽这样的尺寸。
对于上述第一、第二搬送构件,参照图1、6进行说明。第一、第二搬送构件9、9′具有:第一、第二搬送臂91、91′;第一、第二把持部件92、92′,它们在该第一、第二搬送臂91、91′的前端部,设置在配设有上述盒载置机构7、7′的方向上,用于对框架F进行把持,该框架F对收纳于盒70、70′的半导体晶片进行支承;以及搬送臂移动构件93、93′,它们将第一、第二搬送臂91、91′支承为能够沿着X轴方向移动。该把持部件92、92′构成为由从未图示的气缸提供的空气压力驱动,对该框架F进行把持。
对于第一、第二搬入构件10、10′,参照图1、图7进行说明。第一、第二搬入构件10、10′由搬入臂12、12′、工作杆13、13′以及升降构件14、14′构成,该搬入臂12、12′在前端具有用于对支承被加工物即半导体晶片的框架F进行吸引保持的吸引垫11、11′,该工作杆13、13′使搬入臂12、12′升降,升降构件14、14′使工作杆13、13′升降,例如升降构件14、14′由空气活塞等构成。在各搬入臂12、12′中分别具有4个吸引垫11、11′,吸引垫11、11′分别被未图示的螺旋弹簧等以向下方按压的方式施力,并且利用柔性管与未图示的吸引构件所连结的真空分配器连通。
以上说明的激光光线照射构件、盒载置机构、临时载置构件、搬出构件以及搬入构件像图1所示那样配置在静止基台2上,以下参照图1、8至14,对于由设置在第一卡盘工作台机构3侧的激光光线照射构件、盒载置机构、临时载置构件、搬出构件以及搬入构件构成的激光机构1a的搬出、搬入工序的作用进行说明。另外,关于由设置在第二卡盘工作台机构3′侧的激光光线照射构件、盒载置机构、临时载置构件、搬出构件以及搬入构件构成的激光机构1b,由于也实现全部相同的作用,因此省略其详细的说明。
如图1、8所示,与第一卡盘工作台机构3的X轴方向相邻地配设有第一盒载置机构7。在由该第一盒载置机构7和相对于第一卡盘工作台36装卸被加工物的位置形成的第一装卸区域的正上方配设有第一临时载置构件8。并且,在第一卡盘工作台机构3的第一装卸区域、即第一临时载置构件8的侧方配设有第一搬出构件9,而且在夹着第一卡盘工作台机构3且与第一搬出构件9对置的位置配设有第一搬入构件10。
这里,对于从第一盒70相对于作为被加工物即半导体晶片W的保持构件的卡盘工作台36进行搬出、搬入的工序进行说明。首先,如图8所示,第一临时载置构件8使支承轨道移动构件82工作,而使支承轨道81a、81b处于按照支承半导体晶片W的框架F的外径宽度变窄的状态。由于设置于搬送臂91的前端部的把持部件92的高度位置不改变,因此使第一盒工作台71适当升降,而将接下来取出的半导体晶片W的高度位置调整为与该把持部件92的高度位置一致。
在使收纳于第一盒70的半导体晶片W的高度位置与把持部件92的高度位置一致之后,使搬送臂91向第一盒70侧移动,而使把持部件92与收纳于第一盒70的半导体晶片W的环状框架F卡合。并且,通过由未图示的气缸提供的气压而对把持部件92进行驱动从而对环状框架F进行把持。在对环状框架F进行了把持之后,使搬送臂移动构件93工作而将搬送臂91朝向第一盒载置机构7的相反侧拉出,如图9所示,将半导体晶片W搬送到第一临时载置机构8的支承轨道81a、81b上,解除把持部件92的把持状态,而将半导体晶片W临时载置在支承轨道81a、81b上。
当在第一临时载置构件8的支承轨道81a、81b上临时载置半导体晶片W之后,如图10所示(为便于说明,图10中省略了搬送臂91),使第一搬入构件10的升降构件14工作,而使工作杆13下降。在工作杆13的上端连结有在前端部具有吸引垫11的搬入臂12,借助工作杆13的下降而使设置于搬入臂12的前端部的吸引垫11与对第一临时载置构件8上所临时载置的半导体晶片W进行支承的环状框架F抵接。吸引垫11像上述那样,被未图示的线圈弹簧朝向下方施力,因与环状框架F抵接而相对于搬入臂12向上方稍微相对移动。并且,因吸引垫11与环状框架F抵接而工作杆13的下降停止,并且经由与吸引垫11连结的未图示的真空分配器而提供负压,隔着框架F将半导体晶片W吸引固定于吸引垫11。
在将半导体晶片W吸引固定于吸引垫11之后,如图11所示,使第一临时载置构件8的支承轨道移动构件82工作,而使支承轨道81a、81b的间隔比环状框架F的外径宽度扩宽。然后,使工作杆13进一步下降,而在定位于被加工物装卸位置的第一卡盘工作台36的上表面上载置半导体晶片W,将提供到吸引垫的负压的提供切断,并且使工作杆13上升到图9所示的待机位置。在这样将半导体晶片W载置在该卡盘工作台36上之后,通过使未图示的吸引构件工作,而在该卡盘工作台36的上表面上隔着保护带T对半导体晶片W进行吸引保持。当在该卡盘工作台36的上表面上对半导体晶片W进行了吸引保持之后,使夹具362工作,而将环状框架F固定于卡盘工作台36。这样,当在该卡盘工作台36上固定了半导体晶片W之后,使构成第一卡盘工作台机构3的X轴进给构件37工作,而使该卡盘工作台36向在上方配设有激光光线照射单元4的第一聚光器51的第一加工区域移动。
以上,对第一激光机构1a的搬送、搬入工序进行了说明。像上述那样,在第二卡盘工作台机构3′侧也配设有相同的盒载置机构、临时载置构件、搬出构件以及搬入构件,第二激光机构1b能够实现与第一激光机构1a相同的作用。另外,上述的第一激光机构1a的盒载置机构、临时载置构件、搬出构件以及搬入构件由来自未图示的控制构件的输出接口的输出信号控制。
接着,对第一激光机构1a的激光加工工序进行说明。
当将保持着半导体晶片W的第一卡盘工作台36定位于第一加工区域时,通过第一拍摄构件6和控制构件执行对半导体晶片W的应该激光加工的加工区域进行检测的对准工序。即,第一拍摄构件6和控制构件执行图案匹配等图像处理,且执行检测激光光线照射位置的对准工序,该图案匹配等图像处理用于与沿着半导体晶片W的第1方向上所形成的加工预定线照射激光光线的激光光线照射构件5的第一聚光器51进行对位。并且,对于半导体晶片W上所形成的在与第1方向垂直的方向上形成的加工预定线也同样地执行检测激光光线照射位置的对准工序。
在像上述那样对第一卡盘工作台36上所保持的半导体晶片W上所形成的加工预定线进行检测并实施激光光线照射位置的对准工序之后,使该卡盘工作台36向激光光线照射构件5的第一聚光器51所在的第一加工区域移动,将规定的加工预定线的一端定位在第一聚光器51的正下方。并且,由第一聚光器51的未图示的聚光透镜进行聚光,使对于半导体晶片W具有透过性的脉冲激光光线的聚光点与半导体晶片W的内部的规定的高度位置对准。接着,从第一聚光器51照射对于半导体晶片W具有透过性的波长的脉冲激光光线并且使卡盘工作台36在图1的X轴方向上以规定的速度移动。并且,在加工预定线的另一端到达第一聚光器51的正下方位置之后,停止脉冲激光光线的照射,并且停止卡盘工作台36的移动。其结果为,在半导体晶片W的内部形成沿着加工预定线的变质层。在对于一个加工预定线实施这样的激光加工之后,通过Y轴进给构件38相对于Y轴方向对卡盘工作台36进行加工进给,与上述同样地,对于沿着X轴方向的加工预定线重复进行激光加工。由此,能够进行对于全部的加工预定线的激光加工。上述的第一激光机构1a所实施的激光加工工序能够在第二激光机构1b中都全部同样地实施,省略其详细的说明。
当上述的激光加工工序结束时,按照与基于图8至11进行了说明的搬出、搬入工序相反的步骤,将保持在第一卡盘工作台36上的半导体晶片W收纳在第一盒70搬出前所收纳的位置。即,使X轴进给构件37工作,使卡盘工作台36从第一加工区域移动到第一装卸区域,该卡盘工作台36对移动到第一加工区域而激光加工后的半导体晶片W进行保持。然后,与根据图11所说明的动作相反地,使第一搬入构件10的工作杆13下降,而使吸引垫11与对该卡盘工作台36上所保持的半导体晶片W进行支承的环状框架F抵接从而产生负压,由此将半导体晶片W吸引固定于吸引垫11。在将半导体晶片W固定于吸引垫11之后,将该卡盘工作台36所具有的固定用夹具362的固定状态解除,而使工作杆13上升,使半导体晶片W上升到比第一临时载置构件8的支承轨道81a、81b高的位置。
在半导体晶片W移动到比支承轨道81a、81b高的位置之后,使第一临时载置构件8的支承轨道移动构件82工作,使支承轨道81a、81b间的距离按照环状框架F的外径变窄。在使支承轨道81a、81b变窄之后,使第一搬入构件10的工作杆13下降,而使由吸引垫吸引保持的半导体晶片W定位在第一临时载置构件8的支承轨道81a、81b上,成为图10的状态,并且将吸引垫11所产生的负压解除而载置在支承轨道81a、81b上,再次使工作杆13移动到最上位位置。
最后,使定位在远离第一盒70的位置的第一搬送构件9的搬送臂91向第一盒70侧移动。此时,由于对半导体晶片W进行保持的框架F与第一搬送臂91抵接地移动,因此不需要使把持部件92工作。这样,通过将半导体晶片W按压于搬送臂91,而返回到图8所示的加工前所收纳的盒70的规定的位置,并进行收纳。
如图12所示,图1所示的包含激光机构1a、1b的激光加工装置1具有将各激光机构1a、1b罩住的机壳200。此外,在配置于机壳200内的激光加工装置1的该X轴方向上载置有激光机构1a、1b的盒工作台的一侧所对置的机壳200的壁面上,沿Y轴方向并排设置有第一开闭门201和第二开闭门204,被设定为第一开闭门201向左开、第二开闭门204向右开的所谓左右对开式。该开闭门201、204分别被配设为能够通过开放而访问第一装卸区域和第二装卸区域,该第一装卸区域由机壳200内的激光机构1a的第一盒载置机构7和相对于第一卡盘工作台36装卸被加工物的位置形成,该第二装卸区域由激光机构1b的第二盒载置机构7′和相对于第二卡盘工作台36′装卸被加工物的位置形成,在相对于第一、第二盒工作台71、71′对第一、第二盒70、70′进行搬入、搬出时使用该开闭门201、204。
在上述的第一、第二开闭门201、204中分别配设有用于对第一激光机构1a进行操作的第一操作面板202、以及用于对第二激光机构1b进行操作的第二操作面板205,能够通过对各操作面板进行操作而对未图示的控制构件进行各种设定,能够独立地操作第一激光机构1a和第二激光机构1b。通过具有这样的结构,防止在将第一开闭门开放而进行将第一盒70载置于第一盒工作台7的作业时,错误地对第一操作面板202进行操作而使第一激光机构1a工作的情况,防止在将第二开闭门开放而进行将第二盒70′载置于第二盒工作台7′的作业时,错误地对第二操作面板205进行操作而使第二激光机构1a工作的情况。
并且,配设为定位于上述壁面的左方的第一开闭门201中所配设的第一操作面板202向左开,定位于右方的第二开闭门204中所配设的第二操作面板205向右开。在该实施方式的激光加工装置中,假定从机壳200的外部一边确认各激光机构1a、1b的动作一边对操作面板进行操作的情况,如图12所示,在机壳200的各激光机构1a、1b的侧方设置有第一、第二观察窗203、206。并且,一边对第一、第二观察窗203、206进行观察一边进行操作的操作员以将上述第一、第二操作面板202、205分别适当向左侧、右侧打开的方式进行操作。通过采用这样的包含观察窗、操作面板的结构,而在具有第一、第二激光机构1a、1b且分别各自设置操作面板的情况下,防止将两者混淆而引起操作错误的情况。
Claims (3)
1.一种激光加工装置,其中,该激光加工装置具有:
第一激光机构,其包含:第一卡盘工作台,其对被加工物进行保持;第一X轴进给构件,其在X轴方向上对该第一卡盘工作台进行加工进给;第一Y轴进给构件,其在垂直于该X轴方向的Y轴方向上对该第一卡盘工作台进行加工进给;以及第一聚光器,其将激光光线聚光到该第一卡盘工作台上所保持的被加工物;
第二激光机构,其包含:第二卡盘工作台,其对被加工物进行保持;第二X轴进给构件,其在X轴方向上对该第二卡盘工作台进行加工进给;第二Y轴进给构件,其在垂直于该X轴方向的Y轴方向上对该第二卡盘工作台进行加工进给;以及第二聚光器,其将激光光线聚光到该第二卡盘工作台上所保持的被加工物;
激光振荡器,其振荡出激光光线;
光学系统,其将该激光振荡器振荡出的激光光线分支到该第一聚光器和该第二聚光器;
第一操作面板,其对该第一激光机构设定加工条件;以及
第二操作面板,其对该第二激光机构设定加工条件。
2.根据权利要求1所述的激光加工装置,其中,
该激光加工装置具有将该第一激光机构和该第二激光机构罩住的机壳,在该机壳中,在对该第一激光机构搬入被加工物的位置配设有第一开闭门,在对该第二激光机构搬入被加工物的位置配设有第二开闭门,
该第一操作面板配设于该第一开闭门,该第二操作面板配设于该第二开闭门,
该第一开闭门和该第二开闭门在该机壳的垂直于X轴方向的面上沿Y轴方向并排设置。
3.根据权利要求2所述的激光加工装置,其中,
该第一卡盘工作台定位于第一装卸区域和第一加工区域,在该第一装卸区域中,通过该第一X轴进给构件对被加工物进行装卸,在该第一加工区域中,通过从该第一聚光器照射的激光光线对被加工物实施加工,
在该第一装卸区域中配设有:第一盒工作台,其对收纳了被加工物的盒进行载置;第一搬送构件,其将被加工物从载置于该第一盒工作台的盒搬送到临时载置被加工物的第一临时载置构件;以及第一搬入构件,其将搬送到该第一临时载置构件的被加工物搬入该第一卡盘工作台,
当相对于该第一盒工作台对该盒进行装卸时,该第一开闭门成为打开状态,
该第二卡盘工作台定位于第二装卸区域和第二加工区域,在该第二装卸区域中,通过该第二X轴进给构件对被加工物进行装卸,在该第二加工区域中,通过从该第二聚光器照射的激光光线对被加工物实施加工,
在该第二装卸区域中配设有:第二盒工作台,其对收纳了被加工物的盒进行载置;第二搬送构件,其将被加工物从载置于该第二盒工作台的盒搬送到临时载置被加工物的第二临时载置构件;以及第二搬入构件,其将搬送到该第二临时载置构件的被加工物搬入该卡盘工作台,
当相对于该第二盒工作台对该盒进行装卸时,该第二开闭门成为打开状态。
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TW201718159A (zh) | 2017-06-01 |
US10722980B2 (en) | 2020-07-28 |
CN107030391B (zh) | 2020-07-31 |
US20170087671A1 (en) | 2017-03-30 |
KR20170038146A (ko) | 2017-04-06 |
SG10201607633RA (en) | 2017-04-27 |
JP2017064744A (ja) | 2017-04-06 |
KR102468635B1 (ko) | 2022-11-17 |
DE102016218865A1 (de) | 2017-03-30 |
JP6546823B2 (ja) | 2019-07-17 |
MY183578A (en) | 2021-02-26 |
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