JP2017054942A5 - - Google Patents
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- JP2017054942A5 JP2017054942A5 JP2015178165A JP2015178165A JP2017054942A5 JP 2017054942 A5 JP2017054942 A5 JP 2017054942A5 JP 2015178165 A JP2015178165 A JP 2015178165A JP 2015178165 A JP2015178165 A JP 2015178165A JP 2017054942 A5 JP2017054942 A5 JP 2017054942A5
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- light emitter
- side electrode
- type semiconductor
- semiconductor layer
- electrically connected
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- 239000004065 semiconductor Substances 0.000 description 6
- 230000003796 beauty Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Description
半導体発光装置1は、p側コンタクト層27、p側電極30aおよびp側電極30bをさらに備える。p側コンタクト層27は、発光体20aおよび20bのp形半導体層25にそれぞれ電気的に接続される。p側電極30aおよび30bは、p形半導体層25の表面上においてそれぞれp側コンタクト層27を覆う。p側電極30aは、p側コンタクト層27を介して発光体20aのp形半導体層25に電気的に接続される。p側電極30bは、別のp側コンタクト層27を介して発光体20bのp形半導体層25に電気的に接続される。
複数の発光体20は、例えば、発光体20に直列接続された第3発光体(以下、発光体20c)をさらに含む。基板10と発光体20cとの間には、p側電極30cが設けられる。そして、 発光体20bのn形半導体層21は、配線35によりp側電極30cに電気的に接続される。配線35は、発光体20cに設けられたコンタクトホール31を介してp側電極30cに接続される。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015178165A JP6637703B2 (ja) | 2015-09-10 | 2015-09-10 | 半導体発光装置 |
US15/056,339 US9722162B2 (en) | 2015-09-10 | 2016-02-29 | Semiconductor light emitting device |
CN201810687787.1A CN108807358B (zh) | 2015-09-10 | 2016-03-10 | 半导体发光装置 |
CN201610137827.6A CN106531758B (zh) | 2015-09-10 | 2016-03-10 | 半导体发光装置 |
TW105107408A TWI612695B (zh) | 2015-09-10 | 2016-03-10 | 半導體發光裝置 |
TW106129390A TWI697140B (zh) | 2015-09-10 | 2016-03-10 | 半導體發光裝置 |
US15/636,218 US10134806B2 (en) | 2015-09-10 | 2017-06-28 | Semiconductor light emitting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015178165A JP6637703B2 (ja) | 2015-09-10 | 2015-09-10 | 半導体発光装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2017054942A JP2017054942A (ja) | 2017-03-16 |
JP2017054942A5 true JP2017054942A5 (ja) | 2018-10-18 |
JP6637703B2 JP6637703B2 (ja) | 2020-01-29 |
Family
ID=58237214
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015178165A Active JP6637703B2 (ja) | 2015-09-10 | 2015-09-10 | 半導体発光装置 |
Country Status (4)
Country | Link |
---|---|
US (2) | US9722162B2 (ja) |
JP (1) | JP6637703B2 (ja) |
CN (2) | CN108807358B (ja) |
TW (2) | TWI697140B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105702821B (zh) * | 2016-03-29 | 2018-01-30 | 苏州晶湛半导体有限公司 | 半导体发光器件及其制造方法 |
JP6380512B2 (ja) * | 2016-11-16 | 2018-08-29 | 富士ゼロックス株式会社 | 発光素子アレイ、および光伝送装置 |
TWI646377B (zh) * | 2017-11-03 | 2019-01-01 | 友達光電股份有限公司 | 顯示裝置及其製造方法 |
US10862006B2 (en) * | 2018-08-17 | 2020-12-08 | Seoul Viosys Co., Ltd. | Light emitting device |
CN110473975A (zh) * | 2019-07-29 | 2019-11-19 | 吉林大学 | 一种交流驱动的双微腔顶发射白光有机电致发光器件 |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3303154B2 (ja) | 1994-09-30 | 2002-07-15 | ローム株式会社 | 半導体発光素子 |
WO2005062389A2 (en) | 2003-12-24 | 2005-07-07 | Matsushita Electric Industrial Co., Ltd. | Semiconductor light emitting device, lighting module, lighting apparatus, display element, and manufacturing method for semiconductor light emitting device |
US20060017060A1 (en) * | 2004-07-26 | 2006-01-26 | Nai-Chuan Chen | Vertical conducting nitride diode using an electrically conductive substrate with a metal connection |
US7906788B2 (en) * | 2004-12-22 | 2011-03-15 | Panasonic Corporation | Semiconductor light emitting device, illumination module, illumination apparatus, method for manufacturing semiconductor light emitting device, and method for manufacturing semiconductor light emitting element |
KR101047683B1 (ko) * | 2005-05-17 | 2011-07-08 | 엘지이노텍 주식회사 | 와이어 본딩이 불필요한 발광소자 패키징 방법 |
US7998761B2 (en) * | 2006-01-09 | 2011-08-16 | Seoul Opto Device Co., Ltd. | Light emitting diode with ITO layer and method for fabricating the same |
JP5123269B2 (ja) * | 2008-09-30 | 2013-01-23 | ソウル オプト デバイス カンパニー リミテッド | 発光素子及びその製造方法 |
KR100999689B1 (ko) * | 2008-10-17 | 2010-12-08 | 엘지이노텍 주식회사 | 반도체 발광소자 및 그 제조방법, 이를 구비한 발광장치 |
KR101533817B1 (ko) * | 2008-12-31 | 2015-07-09 | 서울바이오시스 주식회사 | 복수개의 비극성 발광셀들을 갖는 발광 소자 및 그것을 제조하는 방법 |
KR101557362B1 (ko) * | 2008-12-31 | 2015-10-08 | 서울바이오시스 주식회사 | 복수개의 비극성 발광셀들을 갖는 발광 소자 및 그것을 제조하는 방법 |
JP2010165983A (ja) * | 2009-01-19 | 2010-07-29 | Sharp Corp | 発光チップ集積デバイスおよびその製造方法 |
US9093293B2 (en) * | 2009-04-06 | 2015-07-28 | Cree, Inc. | High voltage low current surface emitting light emitting diode |
US20110018013A1 (en) | 2009-07-21 | 2011-01-27 | Koninklijke Philips Electronics N.V. | Thin-film flip-chip series connected leds |
CN102201426B (zh) * | 2010-03-23 | 2016-05-04 | 展晶科技(深圳)有限公司 | 发光二极管及其制作方法 |
JP2011199221A (ja) * | 2010-03-24 | 2011-10-06 | Hitachi Cable Ltd | 発光ダイオード |
JP5426481B2 (ja) * | 2010-05-26 | 2014-02-26 | 株式会社東芝 | 発光装置 |
DE102010048159B4 (de) * | 2010-10-11 | 2023-10-05 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Leuchtdiodenchip |
CN102593113B (zh) * | 2011-01-10 | 2015-04-01 | 展晶科技(深圳)有限公司 | 发光二极管封装结构 |
JP4989773B1 (ja) | 2011-05-16 | 2012-08-01 | 株式会社東芝 | 半導体発光素子 |
TW201310703A (zh) | 2011-08-17 | 2013-03-01 | Ritedia Corp | 垂直式發光二極體結構及其製備方法 |
TW201347233A (zh) * | 2012-05-08 | 2013-11-16 | Phostek Inc | 發光二極體裝置及其製造方法 |
DE102012215524A1 (de) * | 2012-08-31 | 2014-03-06 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil |
KR101956101B1 (ko) * | 2012-09-06 | 2019-03-11 | 엘지이노텍 주식회사 | 발광소자 |
CN104737310B (zh) * | 2012-10-15 | 2017-09-01 | 首尔伟傲世有限公司 | 半导体装置及其制造方法 |
WO2014081243A1 (en) * | 2012-11-23 | 2014-05-30 | Seoul Viosys Co., Ltd. | Light emitting diode having a plurality of light emitting units |
US8963121B2 (en) * | 2012-12-07 | 2015-02-24 | Micron Technology, Inc. | Vertical solid-state transducers and high voltage solid-state transducers having buried contacts and associated systems and methods |
KR102065390B1 (ko) * | 2013-02-15 | 2020-01-13 | 엘지이노텍 주식회사 | 발광소자, 발광소자 패키지 및 라이트 유닛 |
TWI549322B (zh) * | 2013-04-10 | 2016-09-11 | 映瑞光電科技(上海)有限公司 | 一種結合磊晶結構與封裝基板爲一體之整合式led元件及其製作方法 |
JP2014170977A (ja) | 2014-06-27 | 2014-09-18 | Toshiba Corp | 発光装置 |
TWI552394B (zh) * | 2014-11-18 | 2016-10-01 | 隆達電子股份有限公司 | 發光二極體結構與發光二極體模組 |
-
2015
- 2015-09-10 JP JP2015178165A patent/JP6637703B2/ja active Active
-
2016
- 2016-02-29 US US15/056,339 patent/US9722162B2/en active Active
- 2016-03-10 TW TW106129390A patent/TWI697140B/zh not_active IP Right Cessation
- 2016-03-10 CN CN201810687787.1A patent/CN108807358B/zh active Active
- 2016-03-10 CN CN201610137827.6A patent/CN106531758B/zh active Active
- 2016-03-10 TW TW105107408A patent/TWI612695B/zh active
-
2017
- 2017-06-28 US US15/636,218 patent/US10134806B2/en active Active
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