JP2017042910A5 - - Google Patents

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Publication number
JP2017042910A5
JP2017042910A5 JP2016234679A JP2016234679A JP2017042910A5 JP 2017042910 A5 JP2017042910 A5 JP 2017042910A5 JP 2016234679 A JP2016234679 A JP 2016234679A JP 2016234679 A JP2016234679 A JP 2016234679A JP 2017042910 A5 JP2017042910 A5 JP 2017042910A5
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Japan
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microelements
unexpanded
expanded
mixture
prepolymer
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JP2016234679A
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Japanese (ja)
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JP2017042910A (ja
JP6415521B2 (ja
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Priority claimed from US13/955,398 external-priority patent/US20150038066A1/en
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JP2016234679A 2013-07-31 2016-12-02 低密度研磨パッド Active JP6415521B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/955,398 2013-07-31
US13/955,398 US20150038066A1 (en) 2013-07-31 2013-07-31 Low density polishing pad

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2016531739A Division JP6517802B2 (ja) 2013-07-31 2014-07-17 低密度研磨パッド

Publications (3)

Publication Number Publication Date
JP2017042910A JP2017042910A (ja) 2017-03-02
JP2017042910A5 true JP2017042910A5 (de) 2018-10-04
JP6415521B2 JP6415521B2 (ja) 2018-10-31

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Application Number Title Priority Date Filing Date
JP2016531739A Active JP6517802B2 (ja) 2013-07-31 2014-07-17 低密度研磨パッド
JP2016234679A Active JP6415521B2 (ja) 2013-07-31 2016-12-02 低密度研磨パッド
JP2018238139A Withdrawn JP2019077036A (ja) 2013-07-31 2018-12-20 低密度研磨パッド

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JP2016531739A Active JP6517802B2 (ja) 2013-07-31 2014-07-17 低密度研磨パッド

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2018238139A Withdrawn JP2019077036A (ja) 2013-07-31 2018-12-20 低密度研磨パッド

Country Status (8)

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US (1) US20150038066A1 (de)
EP (1) EP3027363B1 (de)
JP (3) JP6517802B2 (de)
KR (1) KR101801693B1 (de)
CN (1) CN105408063B (de)
SG (1) SG11201600242PA (de)
TW (1) TWI579106B (de)
WO (1) WO2015017138A1 (de)

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KR102054309B1 (ko) 2018-04-17 2019-12-10 에스케이씨 주식회사 다공성 연마 패드 및 이의 제조방법
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CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
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KR102202076B1 (ko) 2018-12-26 2021-01-12 에스케이씨 주식회사 연마패드용 조성물, 연마패드 및 이의 제조방법
KR20200079847A (ko) 2018-12-26 2020-07-06 에스케이씨 주식회사 연마패드용 조성물, 연마패드 및 이의 제조방법
KR102283399B1 (ko) 2018-12-26 2021-07-30 에스케이씨솔믹스 주식회사 연마패드용 조성물, 연마패드 및 이의 제조방법
KR102185265B1 (ko) 2018-12-26 2020-12-01 에스케이씨 주식회사 연마패드용 조성물, 연마패드 및 이의 제조방법
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KR102237351B1 (ko) 2019-06-17 2021-04-07 에스케이씨솔믹스 주식회사 연마패드용 조성물, 연마패드 및 반도체 소자의 제조방법
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TWI743831B (zh) 2019-06-17 2021-10-21 南韓商Ｓｋｃ索密思股份有限公司 用於研磨墊之組成物、研磨墊及半導體裝置之製備方法
KR102237362B1 (ko) 2019-06-17 2021-04-07 에스케이씨솔믹스 주식회사 연마패드용 조성물, 연마패드 및 반도체 소자의 제조방법
KR102237367B1 (ko) 2019-06-17 2021-04-07 에스케이씨솔믹스 주식회사 연마패드용 조성물, 연마패드 및 반도체 소자의 제조방법
KR102197481B1 (ko) 2019-06-27 2020-12-31 에스케이씨 주식회사 연마패드 및 이의 제조방법
KR102273097B1 (ko) 2019-10-23 2021-07-05 에스케이씨솔믹스 주식회사 연마패드용 조성물, 연마패드 및 이의 제조방법
TWI741753B (zh) 2019-10-29 2021-10-01 南韓商Ｓｋｃ索密思股份有限公司 研磨墊、製造該研磨墊之方法及使用該研磨墊以製造半導體裝置之方法
KR102188525B1 (ko) 2019-10-29 2020-12-08 에스케이씨 주식회사 연마패드, 이의 제조방법, 및 이를 이용한 반도체 소자의 제조방법
KR102304965B1 (ko) 2019-10-30 2021-09-24 에스케이씨솔믹스 주식회사 연마패드, 이의 제조방법, 및 이를 이용한 반도체 소자의 제조방법
KR102287235B1 (ko) 2019-10-30 2021-08-06 에스케이씨솔믹스 주식회사 가교도가 조절된 연마패드 및 이의 제조방법
KR102287923B1 (ko) 2019-10-30 2021-08-09 에스케이씨솔믹스 주식회사 연마패드, 이의 제조방법, 및 이를 이용한 반도체 소자의 제조방법
KR102298114B1 (ko) 2019-11-05 2021-09-03 에스케이씨솔믹스 주식회사 연마패드, 이의 제조방법 및 이를 이용한 반도체 소자의 제조방법
KR102298111B1 (ko) 2019-11-15 2021-09-03 에스케이씨솔믹스 주식회사 재생 폴리올을 포함하는 폴리우레탄 연마패드 및 이의 제조방법
KR102300050B1 (ko) 2019-11-15 2021-09-08 에스케이씨솔믹스 주식회사 연마패드로부터 재생된 폴리올 및 이의 제조방법
KR102300038B1 (ko) 2019-11-15 2021-09-08 에스케이씨솔믹스 주식회사 연마패드로부터 재생된 폴리올 조성물 및 이의 제조방법
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