JP2017028248A - 基板リフトピンアクチュエータ - Google Patents
基板リフトピンアクチュエータ Download PDFInfo
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- JP2017028248A JP2017028248A JP2016087143A JP2016087143A JP2017028248A JP 2017028248 A JP2017028248 A JP 2017028248A JP 2016087143 A JP2016087143 A JP 2016087143A JP 2016087143 A JP2016087143 A JP 2016087143A JP 2017028248 A JP2017028248 A JP 2017028248A
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- 239000000758 substrate Substances 0.000 title claims description 88
- 239000012530 fluid Substances 0.000 claims abstract description 29
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 2
- 238000012545 processing Methods 0.000 description 32
- 238000000034 method Methods 0.000 description 17
- 239000000463 material Substances 0.000 description 10
- 238000001816 cooling Methods 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 238000000137 annealing Methods 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 239000013529 heat transfer fluid Substances 0.000 description 3
- 238000005468 ion implantation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 238000005086 pumping Methods 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000005355 Hall effect Effects 0.000 description 1
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B66—HOISTING; LIFTING; HAULING
- B66F—HOISTING, LIFTING, HAULING OR PUSHING, NOT OTHERWISE PROVIDED FOR, e.g. DEVICES WHICH APPLY A LIFTING OR PUSHING FORCE DIRECTLY TO THE SURFACE OF A LOAD
- B66F3/00—Devices, e.g. jacks, adapted for uninterrupted lifting of loads
- B66F3/24—Devices, e.g. jacks, adapted for uninterrupted lifting of loads fluid-pressure operated
- B66F3/25—Constructional features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B66—HOISTING; LIFTING; HAULING
- B66F—HOISTING, LIFTING, HAULING OR PUSHING, NOT OTHERWISE PROVIDED FOR, e.g. DEVICES WHICH APPLY A LIFTING OR PUSHING FORCE DIRECTLY TO THE SURFACE OF A LOAD
- B66F3/00—Devices, e.g. jacks, adapted for uninterrupted lifting of loads
- B66F3/24—Devices, e.g. jacks, adapted for uninterrupted lifting of loads fluid-pressure operated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B66—HOISTING; LIFTING; HAULING
- B66F—HOISTING, LIFTING, HAULING OR PUSHING, NOT OTHERWISE PROVIDED FOR, e.g. DEVICES WHICH APPLY A LIFTING OR PUSHING FORCE DIRECTLY TO THE SURFACE OF A LOAD
- B66F3/00—Devices, e.g. jacks, adapted for uninterrupted lifting of loads
- B66F3/24—Devices, e.g. jacks, adapted for uninterrupted lifting of loads fluid-pressure operated
- B66F3/247—Devices, e.g. jacks, adapted for uninterrupted lifting of loads fluid-pressure operated pneumatically actuated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geology (AREA)
- Mechanical Engineering (AREA)
- Structural Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Abstract
Description
本明細書中に記載の実施形態(インプリメンテーション)は、概して、半導体製造に関し、より具体的には、リフトピンアクチュエータ及びこれを用いた方法に関する。
デバイスの微細化は、基板のフィルム層内に形成されたデバイスパターンのための小さな寸法をより重大にしてきた。基板内にクリティカルディメンジョン(限界寸法)を達成することは、良好な品質のフィルム層、及び基板内で下地のフィルム層への良好な接着性を有することから始まる。半導体デバイスの製造中に、基板は、最終用途に適した材料層及び構造を形成するために様々な処理チャンバ内で多くの操作を受けることができる。例えば、基板は、他の操作の中でもとりわけ、いくつかの堆積、アニーリング、エッチング操作を受けることができる。ロボットは、中で処理するための処理チャンバ内の基板支持アセンブリ上に基板を搬送することができる。基板支持アセンブリは、ロボットによる基板の交換を促進するために、基板支持アセンブリから基板を引き離すように作動させることができるリフトピンを含む。
Claims (15)
- 内部容積を有するハウジングと、
内部容積内に配置され、ハウジングに結合されたトラックと、
トラックに移動自在に結合されたガイドと、
ガイドに結合され、少なくとも部分的に内部容積内に配置された中心シャフトと、
中心シャフトとハウジングとの間のシールと、
内部容積内に配置され、中心シャフトをハウジング内に後退させる弾性力を印加するように構成された弾性部材と、
ハウジングに対して中心シャフトを伸長させるために、弾性部材に対抗する流体力を発生させる流体を内部容積内に導入するように構成された入口ポートとを含むリフトピンアクチュエータ。 - 中心シャフト上に配置されたバンドを含み、中心シャフトに対するバンドの位置は、弾性部材によって中心シャフトに掛けられる弾性力を調整するために調整可能である、請求項1記載のリフトピンアクチュエータ。
- 内部容積内に配置された少なくとも1つの内部ベローズを含み、内部ベローズは、シールを形成し、ベローズは、隣接する内部ベローズ間に配置されたベローズガイドを有し、ベローズガイドは、ハウジングに対する内部ベローズの軸方向のアライメントを維持するように構成される、請求項1記載のリフトピンアクチュエータ。
- ガイドのベアリングは、ばね荷重が掛けられている、請求項1記載のリフトピンアクチュエータ。
- 弾性部材とハウジングとの間に配置されたスリーブを含む、請求項1記載のリフトピンアクチュエータ。
- ハウジングに結合され、中心シャフトの位置を示す指標を提供するように構成されたセンサを含む、請求項1記載のリフトピンアクチュエータ。
- ハウジングは、
トラックをハウジングに取り付けるための締結具にアクセスするための開口部と、
開口部内に配置された取り外し可能なプラグシーリングを含む、請求項1記載のリフトピンアクチュエータ。 - 上で基板を支持するように構成されたワークピース面を有する基板支持体と、
ワークピース面から基板を昇降させるように構成された基板支持体を貫通して配置されたリフトピンと、
リフトピンに結合され、リフトピンを伸縮するように動作可能なリフトピンアクチュエータであって、リフトピンアクチュエータは、
内部容積を有するハウジングと、
内部容積内に配置され、ハウジングに結合されたトラックと、
トラックに移動自在に結合されたガイドと、
ガイドに結合され、少なくとも部分的に内部容積内に配置された中心シャフトと、
中心シャフトとハウジングとの間のシールと、
内部容積内に配置され、中心シャフトをハウジング内に後退させる弾性力を印加するように構成された弾性部材と、
ハウジングに対して中心シャフトを伸長させるために、弾性部材に対抗する流体力を発生させる流体を内部容積内に導入するように構成された入口ポートとを含むリフトピンアクチュエータとを含む基板支持アセンブリ。 - 台座アセンブリであって、
ベースと、
ベースと基板支持体の間に配置されたファシリティプレートを含む台座アセンブリを含む、請求項8記載の基板支持アセンブリ。 - リフトピンアクチュエータは、基板支持アセンブリの台座アセンブリの内部に配置されている、請求項9記載の基板支持アセンブリ。
- リフトピンアクチュエータは、基板支持アセンブリの台座アセンブリの下方に配置されている、請求項9記載の基板支持アセンブリ。
- 中心シャフト上に配置されたバンドを含み、中心シャフトに対するバンドの位置は、弾性部材によって中心シャフトに掛けられた弾性力を調整するために調整可能である、請求項8記載の基板支持アセンブリ。
- 少なくとも1つの内部ベローズは、少なくとも2つの軸方向に整列された内部ベローズを含む、請求項8記載の基板支持アセンブリ。
- 内部容積内に配置された少なくとも1つの内部ベローズを含み、内部ベローズは、シールを形成し、ベローズは、隣接する内部ベローズ間に配置されたベローズガイドを有し、ベローズガイドは、ハウジングに対する内部ベローズの軸方向のアライメントを維持するように構成される、請求項13記載の基板支持アセンブリ。
- 弾性部材とハウジングとの間に配置されたスリーブを含む、請求項8記載の基板支持アセンブリ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201562197476P | 2015-07-27 | 2015-07-27 | |
US62/197,476 | 2015-07-27 |
Publications (2)
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JP2017028248A true JP2017028248A (ja) | 2017-02-02 |
JP6709104B2 JP6709104B2 (ja) | 2020-06-10 |
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JP2016001887U Expired - Fee Related JP3205145U (ja) | 2015-07-27 | 2016-04-25 | 基板リフトピンアクチュエータ |
JP2016087143A Expired - Fee Related JP6709104B2 (ja) | 2015-07-27 | 2016-04-25 | 基板リフトピンアクチュエータ |
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Country Status (5)
Country | Link |
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US (1) | US10283397B2 (ja) |
JP (2) | JP3205145U (ja) |
KR (2) | KR20170013179A (ja) |
CN (2) | CN206022340U (ja) |
TW (2) | TWM539571U (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021533569A (ja) * | 2018-08-10 | 2021-12-02 | 北京北方華創微電子装備有限公司Beijing Naura Microelectronics Equipment Co., Ltd. | リフトシンブルシステム、反応チャンバおよび半導体処理装置 |
JP2022501811A (ja) * | 2018-09-17 | 2022-01-06 | バット ホールディング アーゲー | ピンリフトデバイス |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM539571U (zh) | 2015-07-27 | 2017-04-11 | 應用材料股份有限公司 | 基板材升降杆致動器 |
US20170115657A1 (en) | 2015-10-22 | 2017-04-27 | Lam Research Corporation | Systems for Removing and Replacing Consumable Parts from a Semiconductor Process Module in Situ |
US9881820B2 (en) * | 2015-10-22 | 2018-01-30 | Lam Research Corporation | Front opening ring pod |
US10062599B2 (en) | 2015-10-22 | 2018-08-28 | Lam Research Corporation | Automated replacement of consumable parts using interfacing chambers |
US10381258B2 (en) * | 2015-12-02 | 2019-08-13 | Tokyo Electron Limited | Apparatus of processing workpiece in depressurized space |
US10388558B2 (en) * | 2016-12-05 | 2019-08-20 | Tokyo Electron Limited | Plasma processing apparatus |
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Also Published As
Publication number | Publication date |
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TWM539571U (zh) | 2017-04-11 |
CN206022340U (zh) | 2017-03-15 |
KR20170013179A (ko) | 2017-02-06 |
JP6709104B2 (ja) | 2020-06-10 |
TW201703918A (zh) | 2017-02-01 |
TWI674168B (zh) | 2019-10-11 |
JP3205145U (ja) | 2016-07-07 |
US10283397B2 (en) | 2019-05-07 |
KR20170000490U (ko) | 2017-02-06 |
CN106409744A (zh) | 2017-02-15 |
US20170032997A1 (en) | 2017-02-02 |
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