JP2016534571A - 基板貫通インターポーザを用いる低パッケージ寄生インダクタンス - Google Patents

基板貫通インターポーザを用いる低パッケージ寄生インダクタンス Download PDF

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Publication number
JP2016534571A
JP2016534571A JP2016540338A JP2016540338A JP2016534571A JP 2016534571 A JP2016534571 A JP 2016534571A JP 2016540338 A JP2016540338 A JP 2016540338A JP 2016540338 A JP2016540338 A JP 2016540338A JP 2016534571 A JP2016534571 A JP 2016534571A
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JP
Japan
Prior art keywords
interposer
thin film
contacts
multilayer thin
film capacitors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016540338A
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English (en)
Japanese (ja)
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JP2016534571A5 (enExample
Inventor
チャンハン・ホビー・ユン
チェンジエ・ズオ
ジョンヘ・キム
デイク・ダニエル・キム
マリオ・フランシスコ・ヴェレス
Original Assignee
クアルコム，インコーポレイテッド
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Publication date
Application filed by クアルコム，インコーポレイテッド filed Critical クアルコム，インコーポレイテッド
Publication of JP2016534571A publication Critical patent/JP2016534571A/ja
Publication of JP2016534571A5 publication Critical patent/JP2016534571A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H10W70/685—
    • H10W90/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H10W72/00—
    • H10W90/724—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
JP2016540338A 2013-09-06 2014-09-03 基板貫通インターポーザを用いる低パッケージ寄生インダクタンス Pending JP2016534571A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/020,558 2013-09-06
US14/020,558 US9370103B2 (en) 2013-09-06 2013-09-06 Low package parasitic inductance using a thru-substrate interposer
PCT/US2014/053864 WO2015034898A1 (en) 2013-09-06 2014-09-03 Low package parasitic inductance using a thru-substrate interposer

Publications (2)

Publication Number Publication Date
JP2016534571A true JP2016534571A (ja) 2016-11-04
JP2016534571A5 JP2016534571A5 (enExample) 2017-09-28

Family

ID=51570877

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016540338A Pending JP2016534571A (ja) 2013-09-06 2014-09-03 基板貫通インターポーザを用いる低パッケージ寄生インダクタンス

Country Status (4)

Country Link
US (1) US9370103B2 (enExample)
EP (1) EP3042394B1 (enExample)
JP (1) JP2016534571A (enExample)
WO (1) WO2015034898A1 (enExample)

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US10470309B2 (en) 2015-09-20 2019-11-05 Qualcomm Incorporated Inductor and capacitor integrated on a substrate
US10163856B2 (en) * 2015-10-30 2018-12-25 Taiwan Semiconductor Manufacturing Company, Ltd. Stacked integrated circuit structure and method of forming
JP2017204511A (ja) * 2016-05-10 2017-11-16 ソニー株式会社 半導体装置、半導体装置の製造方法、及び、電子機器
US20170330677A1 (en) * 2016-05-11 2017-11-16 Cascade Microtech, Inc. Space transformers, planarization layers for space transformers, methods of fabricating space transformers, and methods of planarizing space transformers
US20180184524A1 (en) * 2016-12-27 2018-06-28 Innovium, Inc. Mixed ball grid array pitch for integrated circuit package
KR102663810B1 (ko) 2016-12-30 2024-05-07 삼성전자주식회사 전자 소자 패키지
US10091873B1 (en) * 2017-06-22 2018-10-02 Innovium, Inc. Printed circuit board and integrated circuit package
US20190304899A1 (en) * 2018-04-03 2019-10-03 Mediatek Singapore Pte. Ltd. Methods and systems for supply noise suppression in systems-on-chip
US10714462B2 (en) * 2018-04-24 2020-07-14 Advanced Micro Devices, Inc. Multi-chip package with offset 3D structure
TWI750467B (zh) 2018-05-15 2021-12-21 南韓商三星電子股份有限公司 半導體封裝
US10419050B1 (en) 2018-05-29 2019-09-17 Apple Inc. Printed circuit board interposer for radio frequency signal transmission
US10621387B2 (en) * 2018-05-30 2020-04-14 Seagate Technology Llc On-die decoupling capacitor area optimization
US10784199B2 (en) * 2019-02-20 2020-09-22 Micron Technology, Inc. Component inter-digitated VIAS and leads
US12183675B2 (en) 2019-03-13 2024-12-31 Advanced Micro Devices, Inc. Fan-out packages with warpage resistance
US11545435B2 (en) 2019-06-10 2023-01-03 Qualcomm Incorporated Double sided embedded trace substrate
KR102878673B1 (ko) 2020-06-30 2025-10-29 삼성전자주식회사 집적 회로 칩 및 이를 포함한 반도체 패키지
US11508660B2 (en) * 2020-09-04 2022-11-22 Intel Corporation Molded power delivery interconnect module for improved Imax and power integrity
US11646343B2 (en) 2020-12-29 2023-05-09 United Microelectronics Corp. Capacitor structure and method for manufacturing the same
CN115241174A (zh) * 2021-04-23 2022-10-25 华为技术有限公司 一种滤波结构及电子设备
US12033903B1 (en) * 2021-12-09 2024-07-09 Amazon Technologies, Inc. High-density microbump and probe pad arrangement for semiconductor components
WO2024249086A1 (en) * 2023-05-26 2024-12-05 Microsoft Technology Licensing, Llc Integrated circuit with stacked interposer
US20240429221A1 (en) * 2023-06-22 2024-12-26 Intel Corporation Glass layers and capacitors for use with integrated circuit packages

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JP2001284483A (ja) * 2000-03-29 2001-10-12 Ngk Spark Plug Co Ltd 配線基板
JP2005012106A (ja) * 2003-06-20 2005-01-13 Ngk Spark Plug Co Ltd コンデンサ
JP2006210776A (ja) * 2005-01-31 2006-08-10 Ibiden Co Ltd コンデンサ内蔵パッケージ基板及びその製法

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JP2005012106A (ja) * 2003-06-20 2005-01-13 Ngk Spark Plug Co Ltd コンデンサ
JP2006210776A (ja) * 2005-01-31 2006-08-10 Ibiden Co Ltd コンデンサ内蔵パッケージ基板及びその製法

Also Published As

Publication number Publication date
CN105518859A (zh) 2016-04-20
WO2015034898A1 (en) 2015-03-12
US9370103B2 (en) 2016-06-14
EP3042394B1 (en) 2021-10-20
US20150070863A1 (en) 2015-03-12
EP3042394A1 (en) 2016-07-13

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