JP2016526092A - カーボンナノ材料の被覆方法 - Google Patents
カーボンナノ材料の被覆方法 Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1664—Process features with additional means during the plating process
- C23C18/1666—Ultrasonics
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1676—Heating of the solution
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1682—Control of atmosphere
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1689—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
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- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
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- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Carbon And Carbon Compounds (AREA)
- Chemically Coating (AREA)
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Abstract
Description
Claims (16)
- カーボンナノ材料の自己触媒めっき方法であって、前記方法は
少なくとも2種の酸化剤を含む酸化性溶液中のカーボンナノ材料を用意し、前記溶液を第1の温度範囲内に維持し、前記溶液を第1の所定の時間撹拌する工程と、
前記溶液を加熱して、前記第1の温度範囲より高い第2の温度範囲に到達させ、前記溶液を前記第2の温度範囲内に維持しながら、前記溶液を前記第1の時間より短い第2の所定の時間撹拌する工程と、
前記ナノ材料を前記酸化性溶液から取り出す工程と、
増感剤を含む増感水溶液に前記ナノ材料を分散する工程と、
前記ナノ材料を前記増感溶液から取り出す工程と、
前記ナノ材料に付着している種粒子を含む種混合物に前記ナノ材料を浸漬する工程と、
前記ナノ材料を前記種混合物から取り出す工程と、
水性の金属源および第1の水性還元剤を含むめっき溶液に前記ナノ材料を浸漬することによって、金属性層が前記種粒子から前記ナノ材料上に成長するように前記ナノ材料をめっきする工程と、
前記ナノ材料を前記めっき溶液から取り出す工程と、
第2の還元剤を含む水溶液に前記ナノ材料を分散する工程と、
前記溶液を加熱して、第3の温度範囲に到達させ、前記溶液を前記第3の温度範囲内に維持しながら、前記加熱した溶液の超音波処理を第3の所定の時間行う工程と
を含む方法。 - 前記第1の温度範囲が、−10〜10℃であり、前記第1の時間が、1時間〜8時間である、請求項1に記載の方法。
- 前記第2の温度範囲が、30〜50℃であり、前記第2の時間が、10〜60分である、請求項1または2に記載の方法。
- 前記酸化剤が、硫酸、硝酸、過マンガン酸カリウム、二クロム酸カリウムおよび窒化ナトリウムのうちの少なくとも2種を含む、先行する請求項のいずれか一項に記載の方法。
- 前記増感剤が、ホルムアルデヒド、ポリビニルピロリドンまたは塩化スズ(II)を含む、先行する請求項のいずれか一項に記載の方法。
- 前記ナノ材料を前記酸化性溶液から取り出す前記工程が、前記ナノ材料を濾過し、すすぎ液のpH値が約7になるまで脱イオン水ですすぐことを含む、先行する請求項のいずれか一項に記載の方法。
- 前記種粒子が、パラジウムを含む、先行する請求項のいずれか一項に記載の方法。
- 前記第1の還元剤が、硫酸コバルト、塩化第一鉄、ホルムアルデヒド、ポリビニルピロリドン、アンモニア水、エチレンジアミン、エチレンジアミン四酢酸またはベンゾトリアゾールを含む、先行する請求項のいずれか一項に記載の方法。
- 前記めっきする工程が、前記溶液中の溶存酸素を超音波で除去し、したがって前記還元剤の酸化を回避することを含む、先行する請求項のいずれか一項に記載の方法。
- 前記めっきする工程が、前記溶液に窒素ガスを通しながら閉容器中で行われる、先行する請求項のいずれか一項に記載の方法。
- 前記水性の金属源が、パラジウム、銀、金またはニッケルを含む、先行する請求項のいずれか一項に記載の方法。
- 前記水性の金属源が、窒化銀、塩素酸パラジウム、塩化金、塩化ニッケル、アンモニア水、硫酸アンモニウム、エチレンジアミンおよびエチレンジアミン四酢酸を含む群から選択される金属イオン源である、先行する請求項のいずれか一項に記載の方法。
- 前記第3の温度範囲が、60〜100℃であり、前記第3の時間が、少なくとも1時間である、先行する請求項のいずれか一項に記載の方法。
- 前記カーボンナノ材料が、カーボンナノチューブ、カーボンナノファイバーまたはグラフェンである、先行する請求項のいずれか一項に記載の方法。
- 前記めっきする工程が、0.5時間〜24時間行われる、先行する請求項のいずれか一項に記載の方法。
- 前記第2の還元剤が、水酸化カリウム、水素化ホウ素ナトリウム、ピロガロール、L−アスコルビン酸およびヒドラジン一水和物を含む群から選択される、先行する請求項のいずれか一項に記載の方法。
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SE1330038-9 | 2013-04-21 | ||
SE1330038 | 2013-04-21 | ||
PCT/EP2014/057859 WO2014173793A1 (en) | 2013-04-21 | 2014-04-17 | Method for coating of carbon nanomaterials |
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JP6415540B2 JP6415540B2 (ja) | 2018-10-31 |
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US (1) | US10156015B2 (ja) |
JP (1) | JP6415540B2 (ja) |
KR (1) | KR102326994B1 (ja) |
CN (1) | CN105209660B (ja) |
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US20170267532A1 (en) * | 2014-12-22 | 2017-09-21 | Sht Smart High-Tech Ab | Multi-functionalized carbon nanotubes |
KR20160137178A (ko) | 2015-05-22 | 2016-11-30 | 성균관대학교산학협력단 | 은이 코팅된 탄소나노튜브가 함유된 전기접점재료의 제조방법 |
KR101693600B1 (ko) * | 2015-12-02 | 2017-01-09 | 한국생산기술연구원 | 카본 표면에 수용성 도금액 기반 금속 도금을 위한 표면처리 방법 |
FR3078898B1 (fr) | 2018-03-16 | 2023-10-13 | Nexans | Procede de fabrication d'un materiau composite carbone-metal et son utilisation pour fabriquer un cable electrique |
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WO2009119563A1 (ja) * | 2008-03-25 | 2009-10-01 | 東レ株式会社 | 導電性複合体およびその製造方法 |
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- 2014-04-17 JP JP2016509398A patent/JP6415540B2/ja active Active
- 2014-04-17 KR KR1020157032509A patent/KR102326994B1/ko active IP Right Grant
- 2014-04-17 WO PCT/EP2014/057859 patent/WO2014173793A1/en active Application Filing
- 2014-04-17 CN CN201480021818.XA patent/CN105209660B/zh active Active
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JP2007262583A (ja) * | 1998-11-09 | 2007-10-11 | Ebara Corp | めっき方法及び装置 |
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Title |
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Publication number | Publication date |
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KR102326994B1 (ko) | 2021-11-15 |
US10156015B2 (en) | 2018-12-18 |
WO2014173793A1 (en) | 2014-10-30 |
JP6415540B2 (ja) | 2018-10-31 |
KR20160002912A (ko) | 2016-01-08 |
CN105209660A (zh) | 2015-12-30 |
US20160068965A1 (en) | 2016-03-10 |
CN105209660B (zh) | 2018-04-13 |
CN105209660A8 (zh) | 2017-04-12 |
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