JP2016522881A5 - - Google Patents

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Publication number
JP2016522881A5
JP2016522881A5 JP2016502941A JP2016502941A JP2016522881A5 JP 2016522881 A5 JP2016522881 A5 JP 2016522881A5 JP 2016502941 A JP2016502941 A JP 2016502941A JP 2016502941 A JP2016502941 A JP 2016502941A JP 2016522881 A5 JP2016522881 A5 JP 2016522881A5
Authority
JP
Japan
Prior art keywords
plate
temperature sensor
wafer chuck
chuck according
shaft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016502941A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016522881A (ja
JP6382295B2 (ja
Filing date
Publication date
Priority claimed from US13/831,670 external-priority patent/US9984866B2/en
Application filed filed Critical
Publication of JP2016522881A publication Critical patent/JP2016522881A/ja
Publication of JP2016522881A5 publication Critical patent/JP2016522881A5/ja
Application granted granted Critical
Publication of JP6382295B2 publication Critical patent/JP6382295B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2016502941A 2013-03-15 2014-03-14 マルチゾーンヒータ Active JP6382295B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/831,670 2013-03-15
US13/831,670 US9984866B2 (en) 2012-06-12 2013-03-15 Multiple zone heater
PCT/US2014/028937 WO2014144502A1 (en) 2012-06-12 2014-03-14 Multiple zone heater

Publications (3)

Publication Number Publication Date
JP2016522881A JP2016522881A (ja) 2016-08-04
JP2016522881A5 true JP2016522881A5 (enExample) 2017-04-20
JP6382295B2 JP6382295B2 (ja) 2018-08-29

Family

ID=53040011

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016502941A Active JP6382295B2 (ja) 2013-03-15 2014-03-14 マルチゾーンヒータ

Country Status (5)

Country Link
EP (1) EP2973659A4 (enExample)
JP (1) JP6382295B2 (enExample)
KR (1) KR102171734B1 (enExample)
CN (1) CN105518825B (enExample)
TW (2) TWM644795U (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102461150B1 (ko) 2015-09-18 2022-11-01 삼성전자주식회사 3차원 반도체 메모리 장치
US11028021B2 (en) * 2017-10-24 2021-06-08 Watlow Electric Manufacturing Company Termination feedthrough unit with ceramic insulator suitable for vacuum and corrosive applications
US11961747B2 (en) * 2018-03-28 2024-04-16 Kyocera Corporation Heater and heater system
KR102608397B1 (ko) * 2018-10-16 2023-12-01 주식회사 미코세라믹스 미들 영역 독립 제어 세라믹 히터
KR102558722B1 (ko) * 2018-12-20 2023-07-24 엔지케이 인슐레이터 엘티디 세라믹 히터
US20210111059A1 (en) * 2019-10-12 2021-04-15 Applies Materials, Inc. Wafer Heater With Backside And Integrated Bevel Purge
JP7240341B2 (ja) 2020-02-03 2023-03-15 日本碍子株式会社 セラミックヒータ及び熱電対ガイド
JP7202322B2 (ja) * 2020-02-03 2023-01-11 日本碍子株式会社 セラミックヒータ
JP7360992B2 (ja) * 2020-06-02 2023-10-13 京セラ株式会社 端子付構造体
KR102242589B1 (ko) * 2020-09-09 2021-04-21 주식회사 미코세라믹스 세라믹 히터
JP2024172480A (ja) * 2023-05-31 2024-12-12 株式会社Kokusai Electric 基板処理方法、半導体装置の製造方法、基板処理装置及びプログラム
KR102844318B1 (ko) 2023-12-19 2025-08-08 주식회사 에스지에스코리아 멀티 존 히터의 제어 장치 및 제어 방법

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4854495A (en) * 1986-06-20 1989-08-08 Hitachi, Ltd. Sealing structure, method of soldering and process for preparing sealing structure
US6583638B2 (en) * 1999-01-26 2003-06-24 Trio-Tech International Temperature-controlled semiconductor wafer chuck system
KR20010111058A (ko) * 2000-06-09 2001-12-15 조셉 제이. 스위니 전체 영역 온도 제어 정전기 척 및 그 제조방법
JP3897563B2 (ja) * 2001-10-24 2007-03-28 日本碍子株式会社 加熱装置
JP4098112B2 (ja) 2003-02-14 2008-06-11 日本発条株式会社 ヒータユニット
JP4238772B2 (ja) 2003-05-07 2009-03-18 東京エレクトロン株式会社 載置台構造及び熱処理装置
JP2005166354A (ja) * 2003-12-01 2005-06-23 Ngk Insulators Ltd セラミックヒーター
US20080093315A1 (en) * 2004-10-29 2008-04-24 Epicrew Corporation Support for Semiconductor Substrate
JP4787568B2 (ja) * 2004-11-16 2011-10-05 日本碍子株式会社 接合剤、窒化アルミニウム接合体及びその製造方法
JP4640842B2 (ja) * 2006-10-11 2011-03-02 日本碍子株式会社 加熱装置
JP4450106B1 (ja) * 2008-03-11 2010-04-14 東京エレクトロン株式会社 載置台構造及び処理装置
JP5791412B2 (ja) * 2010-07-26 2015-10-07 日本碍子株式会社 セラミックヒーター
JP5855402B2 (ja) 2010-09-24 2016-02-09 日本碍子株式会社 サセプター及びその製法
CN102598212B (zh) * 2010-09-24 2015-07-15 日本碍子株式会社 半导体制造装置部件
JP2012080103A (ja) * 2010-10-01 2012-04-19 Ngk Insulators Ltd サセプター及びその製法
US20120211484A1 (en) * 2011-02-23 2012-08-23 Applied Materials, Inc. Methods and apparatus for a multi-zone pedestal heater
WO2012118606A2 (en) * 2011-03-01 2012-09-07 Applied Materials, Inc. Thin heated substrate support

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