JP2016517185A5 - - Google Patents

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Publication number
JP2016517185A5
JP2016517185A5 JP2016511785A JP2016511785A JP2016517185A5 JP 2016517185 A5 JP2016517185 A5 JP 2016517185A5 JP 2016511785 A JP2016511785 A JP 2016511785A JP 2016511785 A JP2016511785 A JP 2016511785A JP 2016517185 A5 JP2016517185 A5 JP 2016517185A5
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JP
Japan
Prior art keywords
platen
acoustic sensor
bracket
acoustic
polishing pad
Prior art date
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Application number
JP2016511785A
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English (en)
Japanese (ja)
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JP2016517185A (ja
JP6397896B2 (ja
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Publication date
Priority claimed from US13/874,495 external-priority patent/US20140329439A1/en
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Publication of JP2016517185A publication Critical patent/JP2016517185A/ja
Publication of JP2016517185A5 publication Critical patent/JP2016517185A5/ja
Application granted granted Critical
Publication of JP6397896B2 publication Critical patent/JP6397896B2/ja
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JP2016511785A 2013-05-01 2014-04-28 Ｓｉ貫通電極露出処理の音響的なモニター及び制御のための装置及び方法 Active JP6397896B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/874,495 US20140329439A1 (en) 2013-05-01 2013-05-01 Apparatus and methods for acoustical monitoring and control of through-silicon-via reveal processing
US13/874,495 2013-05-01
PCT/US2014/035756 WO2014179241A1 (en) 2013-05-01 2014-04-28 Apparatus and methods for acoustical monitoring and control of through-silicon-via reveal processing

Publications (3)

Publication Number Publication Date
JP2016517185A JP2016517185A (ja) 2016-06-09
JP2016517185A5 true JP2016517185A5 (enExample) 2017-06-15
JP6397896B2 JP6397896B2 (ja) 2018-09-26

Family

ID=51841646

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016511785A Active JP6397896B2 (ja) 2013-05-01 2014-04-28 Ｓｉ貫通電極露出処理の音響的なモニター及び制御のための装置及び方法

Country Status (6)

Country Link
US (1) US20140329439A1 (enExample)
JP (1) JP6397896B2 (enExample)
KR (1) KR102242321B1 (enExample)
CN (1) CN105164794B (enExample)
TW (1) TWI686264B (enExample)
WO (1) WO2014179241A1 (enExample)

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KR102333209B1 (ko) 2015-04-28 2021-12-01 삼성디스플레이 주식회사 기판 연마 장치
KR102401388B1 (ko) 2016-06-24 2022-05-24 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마를 위한 슬러리 분배 디바이스
WO2018052816A1 (en) * 2016-09-15 2018-03-22 Applied Materials, Inc. Chemical mechanical polishing smart ring
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US11565365B2 (en) * 2017-11-13 2023-01-31 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for monitoring chemical mechanical polishing
CN108188931A (zh) * 2017-12-22 2018-06-22 华侨大学 双面行星磨削/研磨加工中工件破碎的在线控制系统
WO2019152222A1 (en) * 2018-02-05 2019-08-08 Applied Materials, Inc. Piezo-electric end-pointing for 3d printed cmp pads
JP7354131B2 (ja) 2018-03-13 2023-10-02 アプライド マテリアルズ インコーポレイテッド 化学機械研磨中の振動のモニタリング
JP7116645B2 (ja) * 2018-09-12 2022-08-10 キオクシア株式会社 研磨装置
JP7325913B2 (ja) * 2019-11-22 2023-08-15 株式会社ディスコ ウェーハ加工装置
US11289387B2 (en) * 2020-07-31 2022-03-29 Applied Materials, Inc. Methods and apparatus for backside via reveal processing
JP7682641B2 (ja) * 2021-02-22 2025-05-26 株式会社荏原製作所 基板処理装置
WO2022186992A1 (en) 2021-03-03 2022-09-09 Applied Materials, Inc. Acoustic monitoring and sensors for chemical mechanical polishing
KR20240025029A (ko) 2021-07-06 2024-02-26 어플라이드 머티어리얼스, 인코포레이티드 광 센서를 사용한 화학적 기계적 연마 진동 측정
CN117677465A (zh) * 2021-07-06 2024-03-08 应用材料公司 用于化学机械抛光的包含声学窗口的抛光垫
US12403561B2 (en) 2022-03-09 2025-09-02 Applied Materials, Inc. Eddy current monitoring to detect vibration in polishing
US12403560B2 (en) 2022-06-03 2025-09-02 Applied Materials, Inc. Determining substrate precession with acoustic signals

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