KR20180084640A - 기판 처리 장치, 기판 처리 방법 및 컴퓨터 판독 가능한 기록 매체 - Google Patents

기판 처리 장치, 기판 처리 방법 및 컴퓨터 판독 가능한 기록 매체 Download PDF

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KR20180084640A
KR20180084640A KR1020180002801A KR20180002801A KR20180084640A KR 20180084640 A KR20180084640 A KR 20180084640A KR 1020180002801 A KR1020180002801 A KR 1020180002801A KR 20180002801 A KR20180002801 A KR 20180002801A KR 20180084640 A KR20180084640 A KR 20180084640A
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South Korea
Prior art keywords
substrate processing
substrate
cup
rinse solution
processing method
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KR1020180002801A
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English (en)
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KR102465644B1 (ko
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아키라 후지타
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도쿄엘렉트론가부시키가이샤
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Publication of KR20180084640A publication Critical patent/KR20180084640A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02082—Cleaning product to be cleaned
    • H01L21/02087—Cleaning of wafer edges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
    • B08B2203/0229—Suction chambers for aspirating the sprayed liquid

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

본 발명은 기판을 효율적으로 처리하면서 컵 내부를 효과적으로 세정하는 것을 목적으로 한다.
기판 처리 방법은, 컵의 내측에 기판이 배치된 상태에서, 기판의 표면에 직교하는 방향으로 연장되어 있는 회전축 주위로, 기판의 회전수가 제1 회전수와 상기 제1 회전수와는 상이한 제2 회전수 사이에서 변화하도록 기판을 회전시키면서, 컵에 부착된 린스액 노즐로부터 기판의 이면에 또한 주연부에 린스액을 공급시킴으로써, 이면에 공급된 린스액을 이용하여, 컵 중 린스액 노즐의 주변 영역과, 컵 중 주변 영역보다 외측의 영역의 양방을 세정하는 공정을 포함한다.
KR1020180002801A 2017-01-17 2018-01-09 기판 처리 장치, 기판 처리 방법 및 컴퓨터 판독 가능한 기록 매체 KR102465644B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2017-005771 2017-01-17
JP2017005771A JP6836912B2 (ja) 2017-01-17 2017-01-17 基板処理装置、基板処理方法及びコンピュータ読み取り可能な記録媒体

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KR20180084640A true KR20180084640A (ko) 2018-07-25
KR102465644B1 KR102465644B1 (ko) 2022-11-09

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US (1) US11024519B2 (ko)
JP (1) JP6836912B2 (ko)
KR (1) KR102465644B1 (ko)
CN (1) CN108335995B (ko)
TW (1) TWI757403B (ko)

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TWI661477B (zh) * 2015-06-18 2019-06-01 日商思可林集團股份有限公司 基板處理裝置
JP7093703B2 (ja) * 2018-09-07 2022-06-30 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP7232737B2 (ja) * 2019-08-07 2023-03-03 東京エレクトロン株式会社 基板処理装置
CN110473818A (zh) * 2019-09-25 2019-11-19 广东先导先进材料股份有限公司 一种晶片自动腐蚀喷淋设备
KR102376830B1 (ko) * 2019-09-30 2022-03-21 시바우라 메카트로닉스 가부시끼가이샤 기판 처리 장치

Citations (3)

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Publication number Priority date Publication date Assignee Title
JPH05259060A (ja) * 1992-03-16 1993-10-08 Tokyo Electron Ltd 塗布装置
JP2013128015A (ja) 2011-12-16 2013-06-27 Tokyo Electron Ltd 基板処理装置、基板処理方法および記憶媒体
JP2015050213A (ja) * 2013-08-30 2015-03-16 東京エレクトロン株式会社 基板処理システム及び基板処理方法並びに基板処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体

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KR100897431B1 (ko) * 2001-11-27 2009-05-14 도쿄엘렉트론가부시키가이샤 액처리장치 및 액처리방법
US8152933B2 (en) * 2006-10-05 2012-04-10 Tokyo Electron Limited Substrate processing apparatus, substrate processing method, and drain cup cleaning method
JP2008251806A (ja) * 2007-03-30 2008-10-16 Sumco Corp ウェーハの枚葉式エッチング方法及びそのエッチング装置
JP5693438B2 (ja) * 2011-12-16 2015-04-01 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体
JP5975563B2 (ja) * 2012-03-30 2016-08-23 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP5894897B2 (ja) * 2012-09-28 2016-03-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
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Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
JPH05259060A (ja) * 1992-03-16 1993-10-08 Tokyo Electron Ltd 塗布装置
JP2013128015A (ja) 2011-12-16 2013-06-27 Tokyo Electron Ltd 基板処理装置、基板処理方法および記憶媒体
JP2015050213A (ja) * 2013-08-30 2015-03-16 東京エレクトロン株式会社 基板処理システム及び基板処理方法並びに基板処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体

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Publication number Publication date
CN108335995A (zh) 2018-07-27
CN108335995B (zh) 2023-05-26
JP2018117006A (ja) 2018-07-26
US20180204745A1 (en) 2018-07-19
TW201841212A (zh) 2018-11-16
TWI757403B (zh) 2022-03-11
KR102465644B1 (ko) 2022-11-09
JP6836912B2 (ja) 2021-03-03
US11024519B2 (en) 2021-06-01

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