JP2016506634A5 - - Google Patents

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Publication number
JP2016506634A5
JP2016506634A5 JP2015552169A JP2015552169A JP2016506634A5 JP 2016506634 A5 JP2016506634 A5 JP 2016506634A5 JP 2015552169 A JP2015552169 A JP 2015552169A JP 2015552169 A JP2015552169 A JP 2015552169A JP 2016506634 A5 JP2016506634 A5 JP 2016506634A5
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JP
Japan
Prior art keywords
growth substrate
led die
light
active layer
led
Prior art date
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Application number
JP2015552169A
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English (en)
Japanese (ja)
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JP2016506634A (ja
JP6751562B2 (ja
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Priority claimed from PCT/IB2014/058077 external-priority patent/WO2014108821A1/en
Publication of JP2016506634A publication Critical patent/JP2016506634A/ja
Publication of JP2016506634A5 publication Critical patent/JP2016506634A5/ja
Application granted granted Critical
Publication of JP6751562B2 publication Critical patent/JP6751562B2/ja
Active legal-status Critical Current
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JP2015552169A 2013-01-10 2014-01-06 側方放射用に成形された成長基板を有するｌｅｄ Active JP6751562B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361750914P 2013-01-10 2013-01-10
US61/750,914 2013-01-10
PCT/IB2014/058077 WO2014108821A1 (en) 2013-01-10 2014-01-06 Led with shaped growth substrate for side emission

Publications (3)

Publication Number Publication Date
JP2016506634A JP2016506634A (ja) 2016-03-03
JP2016506634A5 true JP2016506634A5 (enExample) 2017-02-09
JP6751562B2 JP6751562B2 (ja) 2020-09-09

Family

ID=50000054

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015552169A Active JP6751562B2 (ja) 2013-01-10 2014-01-06 側方放射用に成形された成長基板を有するｌｅｄ

Country Status (7)

Country Link
US (1) US20150340566A1 (enExample)
EP (1) EP2943986B1 (enExample)
JP (1) JP6751562B2 (enExample)
KR (1) KR102146595B1 (enExample)
CN (1) CN104885235B (enExample)
TW (1) TWI645577B (enExample)
WO (1) WO2014108821A1 (enExample)

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WO2015076591A1 (ko) * 2013-11-21 2015-05-28 주식회사 루멘스 발광 소자 패키지, 백라이트 유닛, 조명 장치 및 발광 소자 패키지의 제작 방법
WO2015076750A1 (en) * 2013-11-22 2015-05-28 Heptagon Micro Optics Pte. Ltd. Compact optoelectronic modules
TWI757315B (zh) * 2017-07-28 2022-03-11 晶元光電股份有限公司 發光裝置以及其製造方法
KR102601620B1 (ko) * 2017-08-03 2023-11-15 크리엘이디, 인크. 고밀도 픽셀화된 led 칩 및 칩 어레이 장치, 그리고 그 제조 방법
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WO2021188713A1 (en) * 2020-03-18 2021-09-23 Avicenatech Corp. Led array for in-plane optical interconnects

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