JP2016505390A5 - - Google Patents

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Publication number
JP2016505390A5
JP2016505390A5 JP2015549732A JP2015549732A JP2016505390A5 JP 2016505390 A5 JP2016505390 A5 JP 2016505390A5 JP 2015549732 A JP2015549732 A JP 2015549732A JP 2015549732 A JP2015549732 A JP 2015549732A JP 2016505390 A5 JP2016505390 A5 JP 2016505390A5
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JP
Japan
Prior art keywords
laser pulse
laser
concave surface
pulse beam
modified
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JP2015549732A
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English (en)
Japanese (ja)
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JP2016505390A (ja
JP6318171B2 (ja
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Priority claimed from PCT/US2013/076677 external-priority patent/WO2014100469A1/en
Publication of JP2016505390A publication Critical patent/JP2016505390A/ja
Publication of JP2016505390A5 publication Critical patent/JP2016505390A5/ja
Application granted granted Critical
Publication of JP6318171B2 publication Critical patent/JP6318171B2/ja
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JP2015549732A 2012-12-20 2013-12-19 レーザ微細加工によりイメージを形成する方法 Active JP6318171B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261740430P 2012-12-20 2012-12-20
US61/740,430 2012-12-20
PCT/US2013/076677 WO2014100469A1 (en) 2012-12-20 2013-12-19 Methods of forming images by laser micromachining

Publications (3)

Publication Number Publication Date
JP2016505390A JP2016505390A (ja) 2016-02-25
JP2016505390A5 true JP2016505390A5 (cg-RX-API-DMAC7.html) 2017-01-19
JP6318171B2 JP6318171B2 (ja) 2018-04-25

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JP2015549732A Active JP6318171B2 (ja) 2012-12-20 2013-12-19 レーザ微細加工によりイメージを形成する方法

Country Status (6)

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US (1) US20140175067A1 (cg-RX-API-DMAC7.html)
JP (1) JP6318171B2 (cg-RX-API-DMAC7.html)
KR (1) KR20150097475A (cg-RX-API-DMAC7.html)
CN (1) CN104884205A (cg-RX-API-DMAC7.html)
TW (1) TWI604909B (cg-RX-API-DMAC7.html)
WO (1) WO2014100469A1 (cg-RX-API-DMAC7.html)

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EP3047932B1 (en) * 2015-01-21 2018-12-26 Agie Charmilles New Technologies SA Method of laser ablation for engraving of a surface with patch optimization, with corresponding software and machine tool
DE102015007216B4 (de) * 2015-06-03 2023-07-20 Asml Netherlands B.V. Verfahren zur Herstellung einer Halteplatte, insbesondere für einen Clamp zur Waferhalterung, Verfahren zur Herstellung einer Haltevorrichtung zur Halterung eines Bauteils, Halteplatte und Haltevorrichtung
GB201603991D0 (en) * 2016-03-08 2016-04-20 Univ Dundee Processing method and apparatus
BR112017027953A2 (pt) * 2015-06-24 2018-08-28 University Of Dundee método e aparelho para escurecimento, superfície tratada a laser, e, dispositivo.
JP6726830B2 (ja) * 2015-08-22 2020-07-22 東京エレクトロン株式会社 基板背面テクスチャリング
AT519177B1 (de) * 2016-10-06 2019-04-15 Trotec Laser Gmbh Verfahren zum Gravieren, Markieren und/oder Beschriften eines Werkstückes mit
WO2018147959A1 (en) * 2017-02-09 2018-08-16 Us Synthetic Corporation Energy machined polycrystalline diamond compacts and related methods
DE102017202269A1 (de) * 2017-02-13 2018-08-16 Sauer Gmbh Verfahren zur bearbeitung einer werkstückoberfläche mittels eines lasers
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JP2021122635A (ja) * 2020-02-07 2021-08-30 国際化工株式会社 レーザーマーキング樹脂成形品
KR102254339B1 (ko) 2021-02-03 2021-05-21 주식회사 21세기 펨토초 펄스 레이저를 이용한 플래닝-폴리싱 장치 및 방법
EP4046817B1 (fr) * 2021-02-23 2024-01-03 DM Surfaces SA Procede de traitement laser d'un composant horloger visant a en noircir au moins une portion
US11784130B2 (en) * 2021-08-27 2023-10-10 Taiwan Semiconductor Manufacturing Company, Ltd. Structure and formation method of package with underfill
CN115819121B (zh) * 2022-12-15 2023-11-07 潮州三环（集团）股份有限公司 一种氧化锆陶瓷表面哑光处理方法、氧化锆陶瓷盖板

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