TWI604909B - 雷射系統及經由雷射微加工形成影像之方法 - Google Patents

雷射系統及經由雷射微加工形成影像之方法 Download PDF

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Publication number
TWI604909B
TWI604909B TW102147344A TW102147344A TWI604909B TW I604909 B TWI604909 B TW I604909B TW 102147344 A TW102147344 A TW 102147344A TW 102147344 A TW102147344 A TW 102147344A TW I604909 B TWI604909 B TW I604909B
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TW
Taiwan
Prior art keywords
laser
pulse
laser processing
processing parameters
spot
Prior art date
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TW102147344A
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English (en)
Chinese (zh)
Other versions
TW201433396A (zh
Inventor
羅伯特 萊辛巴哈
傑弗瑞 豪爾頓
松本久
單芳
麥克 謝恩 挪威爾
Original Assignee
伊雷克托科學工業股份有限公司
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Publication of TW201433396A publication Critical patent/TW201433396A/zh
Application granted granted Critical
Publication of TWI604909B publication Critical patent/TWI604909B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/14—Titanium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/24—Ablative recording, e.g. by burning marks; Spark recording

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Surface Treatment Of Glass (AREA)
TW102147344A 2012-12-20 2013-12-20 雷射系統及經由雷射微加工形成影像之方法 TWI604909B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201261740430P 2012-12-20 2012-12-20

Publications (2)

Publication Number Publication Date
TW201433396A TW201433396A (zh) 2014-09-01
TWI604909B true TWI604909B (zh) 2017-11-11

Family

ID=50973462

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102147344A TWI604909B (zh) 2012-12-20 2013-12-20 雷射系統及經由雷射微加工形成影像之方法

Country Status (6)

Country Link
US (1) US20140175067A1 (cg-RX-API-DMAC7.html)
JP (1) JP6318171B2 (cg-RX-API-DMAC7.html)
KR (1) KR20150097475A (cg-RX-API-DMAC7.html)
CN (1) CN104884205A (cg-RX-API-DMAC7.html)
TW (1) TWI604909B (cg-RX-API-DMAC7.html)
WO (1) WO2014100469A1 (cg-RX-API-DMAC7.html)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016117224A1 (ja) * 2015-01-20 2016-07-28 東レエンジニアリング株式会社 マーキング装置および方法、パターン生成装置、並びに被加工物
EP3047932B1 (en) * 2015-01-21 2018-12-26 Agie Charmilles New Technologies SA Method of laser ablation for engraving of a surface with patch optimization, with corresponding software and machine tool
DE102015007216B4 (de) * 2015-06-03 2023-07-20 Asml Netherlands B.V. Verfahren zur Herstellung einer Halteplatte, insbesondere für einen Clamp zur Waferhalterung, Verfahren zur Herstellung einer Haltevorrichtung zur Halterung eines Bauteils, Halteplatte und Haltevorrichtung
GB201603991D0 (en) * 2016-03-08 2016-04-20 Univ Dundee Processing method and apparatus
BR112017027953A2 (pt) * 2015-06-24 2018-08-28 University Of Dundee método e aparelho para escurecimento, superfície tratada a laser, e, dispositivo.
JP6726830B2 (ja) * 2015-08-22 2020-07-22 東京エレクトロン株式会社 基板背面テクスチャリング
AT519177B1 (de) * 2016-10-06 2019-04-15 Trotec Laser Gmbh Verfahren zum Gravieren, Markieren und/oder Beschriften eines Werkstückes mit
WO2018147959A1 (en) * 2017-02-09 2018-08-16 Us Synthetic Corporation Energy machined polycrystalline diamond compacts and related methods
DE102017202269A1 (de) * 2017-02-13 2018-08-16 Sauer Gmbh Verfahren zur bearbeitung einer werkstückoberfläche mittels eines lasers
JP6722617B2 (ja) * 2017-05-12 2020-07-15 三菱電線工業株式会社 金属表面の粗面化方法
KR102630873B1 (ko) * 2019-05-03 2024-01-31 삼성디스플레이 주식회사 윈도우의 제조 방법
JP2021122635A (ja) * 2020-02-07 2021-08-30 国際化工株式会社 レーザーマーキング樹脂成形品
KR102254339B1 (ko) 2021-02-03 2021-05-21 주식회사 21세기 펨토초 펄스 레이저를 이용한 플래닝-폴리싱 장치 및 방법
EP4046817B1 (fr) * 2021-02-23 2024-01-03 DM Surfaces SA Procede de traitement laser d'un composant horloger visant a en noircir au moins une portion
US11784130B2 (en) * 2021-08-27 2023-10-10 Taiwan Semiconductor Manufacturing Company, Ltd. Structure and formation method of package with underfill
CN115819121B (zh) * 2022-12-15 2023-11-07 潮州三环（集团）股份有限公司 一种氧化锆陶瓷表面哑光处理方法、氧化锆陶瓷盖板

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5126532A (en) * 1989-01-10 1992-06-30 Canon Kabushiki Kaisha Apparatus and method of boring using laser
FI92112C (fi) * 1992-11-09 1994-09-26 Partek Cargotec Oy Menetelmä taustastaan tummempina erottuvien alueiden muodostamiseksi kirkkaaseen metallipintaan ja tällä tavoin värjättyjä alueita käsittävä metallipinta
US5461212A (en) * 1993-06-04 1995-10-24 Summit Technology, Inc. Astigmatic laser ablation of surfaces
US5841099A (en) * 1994-07-18 1998-11-24 Electro Scientific Industries, Inc. Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets
EP0996549B1 (en) * 1997-07-16 2003-04-09 Otis Elevator Company Method and compositions for laser imprinting, and articles imprinted using such methods and compositions
JPH11207477A (ja) * 1998-01-26 1999-08-03 Mitsubishi Electric Corp きさげ加工装置およびきさげ加工方法
JP4465065B2 (ja) * 1998-10-30 2010-05-19 シャープ株式会社 配線の断線修復方法
ATE346715T1 (de) * 2000-10-26 2006-12-15 Xsil Technology Ltd Steueurung von laserbearbeitung
US6864459B2 (en) * 2001-02-08 2005-03-08 The Regents Of The University Of California High precision, rapid laser hole drilling
US7357486B2 (en) * 2001-12-20 2008-04-15 Hewlett-Packard Development Company, L.P. Method of laser machining a fluid slot
US20050087522A1 (en) * 2003-10-24 2005-04-28 Yunlong Sun Laser processing of a locally heated target material
US7486705B2 (en) * 2004-03-31 2009-02-03 Imra America, Inc. Femtosecond laser processing system with process parameters, controls and feedback
US20060000814A1 (en) * 2004-06-30 2006-01-05 Bo Gu Laser-based method and system for processing targeted surface material and article produced thereby
US20070235902A1 (en) * 2006-03-31 2007-10-11 3M Innovative Properties Company Microstructured tool and method of making same using laser ablation
JP4910100B2 (ja) * 2006-07-06 2012-04-04 日本ケミコン株式会社 電子部品の金属ケース
US10876193B2 (en) * 2006-09-29 2020-12-29 University Of Rochester Nanostructured materials, methods, and applications
GB2444037A (en) * 2006-11-27 2008-05-28 Xsil Technology Ltd Laser Machining
US8710402B2 (en) * 2007-06-01 2014-04-29 Electro Scientific Industries, Inc. Method of and apparatus for laser drilling holes with improved taper
JP5580049B2 (ja) * 2007-10-16 2014-08-27 三星ダイヤモンド工業株式会社 脆性材料基板のｕ字状溝加工方法およびこれを用いた除去加工方法およびくり抜き加工方法および面取り方法
GB0804955D0 (en) * 2008-03-18 2008-04-16 Rumsby Philip T Method and apparatus for laser processing the surface of a drum
JP5454080B2 (ja) * 2008-10-23 2014-03-26 住友電気工業株式会社 レーザ加工方法およびレーザ加工装置
JP4612733B2 (ja) * 2008-12-24 2011-01-12 東芝機械株式会社 パルスレーザ加工装置
JP5473414B2 (ja) * 2009-06-10 2014-04-16 株式会社ディスコ レーザ加工装置
US8389895B2 (en) * 2010-06-25 2013-03-05 Electro Scientifix Industries, Inc. Method and apparatus for reliably laser marking articles
JP2012183549A (ja) * 2011-03-04 2012-09-27 Mitsubishi Electric Corp ＳｉＣ半導体ウェハのマーキング方法およびＳｉＣ半導体ウェハ
CN103442839B (zh) * 2011-03-30 2015-12-23 日本碍子株式会社 对金属构件的标记方法

Also Published As

Publication number Publication date
US20140175067A1 (en) 2014-06-26
TW201433396A (zh) 2014-09-01
CN104884205A (zh) 2015-09-02
WO2014100469A1 (en) 2014-06-26
WO2014100469A8 (en) 2014-12-31
JP2016505390A (ja) 2016-02-25
JP6318171B2 (ja) 2018-04-25
KR20150097475A (ko) 2015-08-26

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