JP2017186185A5 - - Google Patents

Download PDF

Info

Publication number
JP2017186185A5
JP2017186185A5 JP2016074610A JP2016074610A JP2017186185A5 JP 2017186185 A5 JP2017186185 A5 JP 2017186185A5 JP 2016074610 A JP2016074610 A JP 2016074610A JP 2016074610 A JP2016074610 A JP 2016074610A JP 2017186185 A5 JP2017186185 A5 JP 2017186185A5
Authority
JP
Japan
Prior art keywords
laser
glass substrate
hole
processed
protective material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016074610A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017186185A (ja
JP6590749B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2016074610A priority Critical patent/JP6590749B2/ja
Priority claimed from JP2016074610A external-priority patent/JP6590749B2/ja
Publication of JP2017186185A publication Critical patent/JP2017186185A/ja
Publication of JP2017186185A5 publication Critical patent/JP2017186185A5/ja
Application granted granted Critical
Publication of JP6590749B2 publication Critical patent/JP6590749B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2016074610A 2016-04-01 2016-04-01 レーザ加工装置およびレーザ加工方法 Active JP6590749B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2016074610A JP6590749B2 (ja) 2016-04-01 2016-04-01 レーザ加工装置およびレーザ加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016074610A JP6590749B2 (ja) 2016-04-01 2016-04-01 レーザ加工装置およびレーザ加工方法

Publications (3)

Publication Number Publication Date
JP2017186185A JP2017186185A (ja) 2017-10-12
JP2017186185A5 true JP2017186185A5 (cg-RX-API-DMAC7.html) 2018-12-06
JP6590749B2 JP6590749B2 (ja) 2019-10-16

Family

ID=60046096

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016074610A Active JP6590749B2 (ja) 2016-04-01 2016-04-01 レーザ加工装置およびレーザ加工方法

Country Status (1)

Country Link
JP (1) JP6590749B2 (cg-RX-API-DMAC7.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102030521B1 (ko) * 2017-11-30 2019-10-10 (주)에스엠텍 레이저를 이용한 태양전지 모듈용 유리표면 가공 장치
CN113828943B (zh) * 2021-09-18 2023-10-03 湖北优尼科光电技术股份有限公司 一种玻璃基板的加工方法
CN114933407B (zh) * 2022-05-18 2023-07-14 常州亚玛顿股份有限公司 一种mini LED背光结构用通孔玻璃基板的制备方法及背光结构

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4441008A (en) * 1981-09-14 1984-04-03 Ford Motor Company Method of drilling ultrafine channels through glass
JPH0679486A (ja) * 1992-08-25 1994-03-22 Rohm Co Ltd インクジェットヘッドの加工方法
JP2001354439A (ja) * 2000-06-12 2001-12-25 Matsushita Electric Ind Co Ltd ガラス基板の加工方法および高周波回路の製作方法
US8584354B2 (en) * 2010-08-26 2013-11-19 Corning Incorporated Method for making glass interposer panels
JP2014214036A (ja) * 2013-04-24 2014-11-17 旭硝子株式会社 レーザを用いてガラス基板に貫通孔を形成する方法
JP6113299B2 (ja) * 2013-11-14 2017-04-12 三菱電機株式会社 レーザ加工方法およびレーザ加工装置
JP2015213949A (ja) * 2014-05-09 2015-12-03 ビアメカニクス株式会社 レーザ加工方法
JP2015229167A (ja) * 2014-06-04 2015-12-21 ビアメカニクス株式会社 レーザ加工方法

Similar Documents

Publication Publication Date Title
JP2017501884A5 (cg-RX-API-DMAC7.html)
WO2015193819A3 (en) Method and apparatus for increasing bonding in material extrusion additive manufacturing
JP2016512382A5 (cg-RX-API-DMAC7.html)
EP3572166A4 (en) ADDITIVE MANUFACTURING EQUIPMENT USING SELECTIVE ELECTRON BEAM FUSION AND COMBINED ELECTRON BEAM ABUTMENT
JP2015511571A5 (cg-RX-API-DMAC7.html)
JP2017504553A5 (cg-RX-API-DMAC7.html)
FR2981346B1 (fr) Procede de traitement thermique de couches d'argent
JP2018528078A5 (cg-RX-API-DMAC7.html)
SG10201804904YA (en) Wafer producing apparatus
EP3621416A3 (en) Two-step, direct-write laser metallization
WO2012149070A3 (en) Single-shot laser ablation of a metal film on a polymer membrane
CN105705291A (zh) 用于制造构件的方法以及光学辐照设备
MX2016014560A (es) Tecnica para el tratamiento multi-pulsos fotodisruptivo de un material.
ATE549946T1 (de) Verfahren zur verarbeitung von nahrungsmittelmaterial mit einem impulslaserstrahl
JP2014223671A5 (ja) レーザ加工方法及びレーザ加工装置
JP2017186185A5 (cg-RX-API-DMAC7.html)
WO2016112050A9 (en) Multi-tone amplitude photomask
WO2009117323A3 (en) Method and apparatus for irradiating a surface with continuous-wave or pulsed light
WO2016010943A3 (en) Method of and system for arresting crack propagation
MY183580A (en) Wafer production method
MX387054B (es) Rodillo de horno y metodo de fabricacion para el mismo.
MX2019002476A (es) Metodo para formar rugosidad en una superficie de cuerpo moldeado metalico.
JP2014067805A5 (cg-RX-API-DMAC7.html)
TW201613713A (en) Wafer processing method
Jiao et al. Refining femtosecond laser induced periodical surface structures with liquid assist