SG11202107006XA - Adhesive composition for optical irradiation peeling, laminate body, and laminate body production method and peeling method - Google Patents
Adhesive composition for optical irradiation peeling, laminate body, and laminate body production method and peeling methodInfo
- Publication number
- SG11202107006XA SG11202107006XA SG11202107006XA SG11202107006XA SG11202107006XA SG 11202107006X A SG11202107006X A SG 11202107006XA SG 11202107006X A SG11202107006X A SG 11202107006XA SG 11202107006X A SG11202107006X A SG 11202107006XA SG 11202107006X A SG11202107006X A SG 11202107006XA
- Authority
- SG
- Singapore
- Prior art keywords
- laminate body
- peeling
- adhesive composition
- optical irradiation
- production method
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title 1
- 230000001070 adhesive effect Effects 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 230000003287 optical effect Effects 0.000 title 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/14—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
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- B32B27/00—Layered products comprising a layer of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
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- B32B43/006—Delaminating
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- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K3/04—Carbon
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- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
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- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- C09J7/00—Adhesives in the form of films or foils
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- C09J7/00—Adhesives in the form of films or foils
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- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/98—Methods for disconnecting semiconductor or solid-state bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018245938 | 2018-12-27 | ||
JP2019098890 | 2019-05-27 | ||
PCT/JP2019/051020 WO2020138240A1 (en) | 2018-12-27 | 2019-12-25 | Adhesive composition for optical irradiation peeling, laminate body, and laminate body production method and peeling method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202107006XA true SG11202107006XA (en) | 2021-07-29 |
Family
ID=71128711
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202107006XA SG11202107006XA (en) | 2018-12-27 | 2019-12-25 | Adhesive composition for optical irradiation peeling, laminate body, and laminate body production method and peeling method |
Country Status (8)
Country | Link |
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US (1) | US20220073801A1 (en) |
EP (1) | EP3907074A4 (en) |
JP (2) | JP7486025B2 (en) |
KR (1) | KR20210107788A (en) |
CN (1) | CN113226743A (en) |
SG (1) | SG11202107006XA (en) |
TW (1) | TW202026387A (en) |
WO (1) | WO2020138240A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3790038A4 (en) * | 2018-05-01 | 2022-01-12 | Nissan Chemical Corporation | Temporary adhesive containing polysiloxane that contains heat resistant polymerization inhibitor |
WO2021112070A1 (en) * | 2019-12-02 | 2021-06-10 | 信越化学工業株式会社 | Wafer processing temporary adhesive, wafer laminate, thin wafer manufacturing method |
KR20230161989A (en) * | 2021-03-26 | 2023-11-28 | 닛산 가가쿠 가부시키가이샤 | Adhesive composition, laminate, method for producing laminate, and method for producing semiconductor substrate |
WO2022202029A1 (en) * | 2021-03-26 | 2022-09-29 | 日産化学株式会社 | Multilayer body, method for producing multilayer body, and method for producing semiconductor substrate |
CN117716475A (en) * | 2021-07-26 | 2024-03-15 | 日产化学株式会社 | Method for producing laminate and kit of adhesive composition |
EP4369380A1 (en) * | 2021-07-26 | 2024-05-15 | Nissan Chemical Corporation | Layered body manufacturing method, and kit for adhesive composition |
WO2023032165A1 (en) * | 2021-09-03 | 2023-03-09 | 昭和電工マテリアルズ株式会社 | Film for temporary fixing, laminate for temporary fixing, and method for producing semiconductor device |
WO2023214308A1 (en) * | 2022-05-06 | 2023-11-09 | Flooring Industries Limited, Sarl | Panel and adhesive system for panels |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4250075A (en) * | 1979-02-05 | 1981-02-10 | Dow Corning Corporation | Electrically conductive polydiorganosiloxanes |
JPS62149751A (en) * | 1985-12-25 | 1987-07-03 | Dow Corning Kk | Heat-resistant polyorganosiloxane composition |
US4777205A (en) * | 1987-07-22 | 1988-10-11 | Wacker Silicones Corporation | Electrically conductive compositions |
JP2882823B2 (en) * | 1989-11-15 | 1999-04-12 | 東レ・ダウコーニング・シリコーン株式会社 | adhesive |
JP2978319B2 (en) * | 1991-10-31 | 1999-11-15 | 東レ・ダウコーニング・シリコーン株式会社 | Base fabric for airbag |
JP4565804B2 (en) | 2002-06-03 | 2010-10-20 | スリーエム イノベイティブ プロパティズ カンパニー | Laminate including ground substrate, method for producing the same, method for producing ultrathin substrate using laminate, and apparatus therefor |
JP2008127544A (en) * | 2006-11-24 | 2008-06-05 | Emulsion Technology Co Ltd | Method for processing electronic part and adhesive tape for processing electronic part |
EP2727925B1 (en) * | 2007-04-17 | 2016-04-06 | Kaneka Corporation | Polyhedral polysiloxane modified product and composition using the modified product |
JP2010090363A (en) * | 2008-09-11 | 2010-04-22 | Shin-Etsu Chemical Co Ltd | Curable silicone resin composition, cured product thereof, and opaque silicone adhesive sheet formed from the composition |
JP5580800B2 (en) | 2010-10-29 | 2014-08-27 | 東京応化工業株式会社 | Laminated body and method for separating the laminated body |
JP6413796B2 (en) | 2015-01-26 | 2018-10-31 | 東洋インキScホールディングス株式会社 | Crosslinkable composition, method for producing cured product, and cured product |
JP6404723B2 (en) * | 2015-01-27 | 2018-10-17 | デンカ株式会社 | Temporary fixing adhesive composition, member temporary fixing method using the same, and method for removing cured body residue |
JP2017014309A (en) * | 2015-06-26 | 2017-01-19 | Dic株式会社 | Heat-peelable adhesive tape, image reader and method for dismantling same |
JP6582739B2 (en) * | 2015-08-26 | 2019-10-02 | 富士通株式会社 | Electronic composite part manufacturing method and electronic composite part |
JP6629554B2 (en) * | 2015-09-28 | 2020-01-15 | アイカ工業株式会社 | Release silicone resin composition and release film coated with the same |
EP3477685A4 (en) * | 2016-06-22 | 2020-07-01 | Nissan Chemical Corporation | Adhesive containing polydimethylsiloxane |
-
2019
- 2019-12-25 EP EP19905490.9A patent/EP3907074A4/en active Pending
- 2019-12-25 JP JP2020563389A patent/JP7486025B2/en active Active
- 2019-12-25 KR KR1020217023330A patent/KR20210107788A/en not_active Application Discontinuation
- 2019-12-25 CN CN201980085649.9A patent/CN113226743A/en active Pending
- 2019-12-25 WO PCT/JP2019/051020 patent/WO2020138240A1/en unknown
- 2019-12-25 US US17/417,967 patent/US20220073801A1/en active Pending
- 2019-12-25 SG SG11202107006XA patent/SG11202107006XA/en unknown
- 2019-12-26 TW TW108147935A patent/TW202026387A/en unknown
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2024
- 2024-03-06 JP JP2024033535A patent/JP2024072835A/en active Pending
Also Published As
Publication number | Publication date |
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US20220073801A1 (en) | 2022-03-10 |
TW202026387A (en) | 2020-07-16 |
WO2020138240A1 (en) | 2020-07-02 |
JP7486025B2 (en) | 2024-05-17 |
KR20210107788A (en) | 2021-09-01 |
JP2024072835A (en) | 2024-05-28 |
CN113226743A (en) | 2021-08-06 |
JPWO2020138240A1 (en) | 2021-11-18 |
EP3907074A1 (en) | 2021-11-10 |
EP3907074A4 (en) | 2022-09-14 |
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