JP2016503353A5 - - Google Patents

Download PDF

Info

Publication number
JP2016503353A5
JP2016503353A5 JP2015537667A JP2015537667A JP2016503353A5 JP 2016503353 A5 JP2016503353 A5 JP 2016503353A5 JP 2015537667 A JP2015537667 A JP 2015537667A JP 2015537667 A JP2015537667 A JP 2015537667A JP 2016503353 A5 JP2016503353 A5 JP 2016503353A5
Authority
JP
Japan
Prior art keywords
barrier stack
nanoparticles
encapsulation
encapsulated
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015537667A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016503353A (ja
JP6534932B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/SG2013/000448 external-priority patent/WO2014062135A1/en
Publication of JP2016503353A publication Critical patent/JP2016503353A/ja
Publication of JP2016503353A5 publication Critical patent/JP2016503353A5/ja
Application granted granted Critical
Publication of JP6534932B2 publication Critical patent/JP6534932B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2015537667A 2012-10-18 2013-10-18 カプセル化バリアスタック Expired - Fee Related JP6534932B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261715420P 2012-10-18 2012-10-18
US61/715,420 2012-10-18
PCT/SG2013/000448 WO2014062135A1 (en) 2012-10-18 2013-10-18 Encapsulation barrier stack

Publications (3)

Publication Number Publication Date
JP2016503353A JP2016503353A (ja) 2016-02-04
JP2016503353A5 true JP2016503353A5 (https=) 2016-12-08
JP6534932B2 JP6534932B2 (ja) 2019-06-26

Family

ID=50488575

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015537667A Expired - Fee Related JP6534932B2 (ja) 2012-10-18 2013-10-18 カプセル化バリアスタック

Country Status (12)

Country Link
US (1) US20150314941A1 (https=)
EP (1) EP2909027B1 (https=)
JP (1) JP6534932B2 (https=)
KR (1) KR20150109325A (https=)
CN (1) CN105189103A (https=)
AU (1) AU2013332493B2 (https=)
CA (1) CA2888049A1 (https=)
DK (1) DK2909027T3 (https=)
IN (1) IN2015DN03156A (https=)
SG (2) SG11201502946YA (https=)
TW (1) TWI617453B (https=)
WO (1) WO2014062135A1 (https=)

Families Citing this family (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10103297B2 (en) * 2012-12-10 2018-10-16 Daktronics, Inc. Encapsulation of light-emitting elements on a display module
JP6523252B2 (ja) * 2013-05-02 2019-05-29 テラ‐バリア フィルムズ プライベート リミテッド デンドリマーでカプセル化されたナノ粒子を含むカプセル化バリアスタック
US20150351167A1 (en) * 2014-05-30 2015-12-03 Samsung Sdi Co., Ltd. Encapsulated device having edge seal and methods of making the same
JP5901808B2 (ja) 2014-08-05 2016-04-13 古河電気工業株式会社 電子デバイス封止用硬化性吸湿性樹脂組成物、封止樹脂および電子デバイス
CN105331932B (zh) * 2014-08-12 2017-12-01 湖南元素密码石墨烯高科技有限公司 一种耐冲击三维石墨烯薄膜的制作方法
DE102014222946A1 (de) * 2014-11-11 2016-05-12 Osram Oled Gmbh Licht emittierendes Bauelement und Verfahren zur Herstellung eines Licht emittierenden Bauelements
DE102014222920A1 (de) * 2014-11-11 2016-05-12 Osram Oled Gmbh Licht emittierendes Bauelement und Verfahren zur Herstellung eines Licht emittierenden Bauelements
EP3241244B1 (en) * 2014-12-30 2019-09-11 Flisom AG Apparatus for supporting and transporting a photovoltaic sub-module during processing
CN104659066B (zh) * 2015-02-05 2018-02-13 京东方科技集团股份有限公司 一种显示面板及其制作方法和显示装置
US9773931B2 (en) 2015-05-20 2017-09-26 King Fahd University Of Petroleum And Minerals Silver nanoparticles on conducting electrode as plasmonic scattering nanomaterial and related photovoltaic cells
CN104979492B (zh) * 2015-05-28 2017-11-28 京东方科技集团股份有限公司 封装薄膜及其制作方法、发光器件、显示面板和显示装置
US10581015B2 (en) 2015-08-17 2020-03-03 3M Innovative Properties Company Barrier film constructions
JP6771140B2 (ja) * 2016-03-18 2020-10-21 パナソニックIpマネジメント株式会社 真空断熱材およびそれを備える家電製品、住宅壁または輸送機器
CN105810796A (zh) * 2016-04-21 2016-07-27 深圳市华星光电技术有限公司 一种量子点材料玻璃板及其制作方法
US11679412B2 (en) 2016-06-13 2023-06-20 Gvd Corporation Methods for plasma depositing polymers comprising cyclic siloxanes and related compositions and articles
US20170358445A1 (en) 2016-06-13 2017-12-14 Gvd Corporation Methods for plasma depositing polymers comprising cyclic siloxanes and related compositions and articles
WO2017218638A1 (en) * 2016-06-14 2017-12-21 Jianjun Chen Methods for treating subjects suffering from acute myeloid leukemia with flt3 ligand-targeted mir-150 nanoparticles
KR102586045B1 (ko) * 2016-07-12 2023-10-10 삼성디스플레이 주식회사 디스플레이 장치 및 이의 제조 방법
US11118048B2 (en) 2016-09-21 2021-09-14 Massachusetts Institute Of Technology Nanostructures for the assembly of materials
US11753717B2 (en) 2016-11-11 2023-09-12 The Regents Of The University Of Colorado Stability of refractory materials in high temperature steam
TWI670819B (zh) * 2016-11-29 2019-09-01 新加坡商Pep創新私人有限公司 晶片封裝方法及封裝結構
US11127590B2 (en) 2016-12-05 2021-09-21 The Regents Of The University Of California Method for ALD deposition on inert surfaces via Al2O3 nanoparticles
US20200313089A1 (en) 2017-04-11 2020-10-01 Tcl Technology Group Corporation Crosslinked nanoparticle thin film, preparation method thereof, and thin film optoelectronic device having the same
CN107366181A (zh) * 2017-07-11 2017-11-21 滁州海川印刷包装有限公司 一种添加复合导电纤维的抗静电瓦楞纸的制备方法
CN107565052B (zh) * 2017-08-25 2020-04-17 京东方科技集团股份有限公司 封装结构及其制造方法、显示装置
CN107599575A (zh) * 2017-09-07 2018-01-19 于盟盟 一种气体阻隔膜
CN107760232B (zh) * 2017-09-27 2019-12-17 苏州星烁纳米科技有限公司 树脂组合物、光转换元件及光源组件
US10897824B2 (en) * 2017-10-30 2021-01-19 Baker Hughes, A Ge Company, Llc Encapsulation of downhole microelectronics and method the same
US11114315B2 (en) 2017-11-29 2021-09-07 Pep Innovation Pte. Ltd. Chip packaging method and package structure
US11232957B2 (en) 2017-11-29 2022-01-25 Pep Inovation Pte. Ltd. Chip packaging method and package structure
US12506055B2 (en) 2017-11-29 2025-12-23 Pep Innovation Pte. Ltd. Chip packaging method and chip structure
US11610855B2 (en) 2017-11-29 2023-03-21 Pep Innovation Pte. Ltd. Chip packaging method and package structure
US11233028B2 (en) 2017-11-29 2022-01-25 Pep Inovation Pte. Ltd. Chip packaging method and chip structure
CN108126746A (zh) * 2017-12-14 2018-06-08 浙江大学 一种用于杀菌消毒的玻璃窗光热催化涂膜及其制备和应用
JP2019188783A (ja) * 2018-04-27 2019-10-31 凸版印刷株式会社 ガスバリア性フィルム
US11802204B2 (en) 2018-08-10 2023-10-31 Board Of Trustees Of Michigan State University Thermoset omniphobic compositions with improved barrier properties, related articles, and related methods
WO2020040507A1 (ko) * 2018-08-22 2020-02-27 고려대학교 세종산학협력단 양자점 나노캡슐 및 그 제조 방법
US11697762B2 (en) 2018-08-22 2023-07-11 Korea University Research And Business Foundation, Sejong Campus Organic-inorganic hybrid coating layer, quantum dot nanocapsule, quantum dot light emitting diode package, and method of fabricating the same
US12576619B2 (en) 2018-10-22 2026-03-17 Double Double D, Llc Layered containment features
US11702239B2 (en) * 2018-10-22 2023-07-18 Double Double D, Llc Degradable containment features
CN109616582A (zh) * 2018-11-30 2019-04-12 云谷(固安)科技有限公司 一种柔性显示面板及其制备方法、柔性显示装置
US11158339B2 (en) * 2019-08-20 2021-10-26 International Business Machines Corporation Magnetic recording layer formulation for tape media
TWI803699B (zh) * 2019-09-25 2023-06-01 南亞塑膠工業股份有限公司 蔬果保鮮用的膜狀材料
CN110835463B (zh) * 2019-11-20 2021-09-24 东莞市雄林新材料科技股份有限公司 一种高疏水角tpu薄膜及其制备方法
CN111146360A (zh) * 2019-12-27 2020-05-12 福建华佳彩有限公司 一种薄膜封装结构及其制作方法
CN111806030B (zh) * 2020-07-07 2022-02-08 厦门长塑实业有限公司 一种涂布型高阻隔双向拉伸聚酰胺薄膜及其制备方法
US12351377B2 (en) 2020-07-30 2025-07-08 The Procter & Gamble Company Biodegradable paper barrier laminate
CN111921500B (zh) * 2020-08-04 2023-04-07 国网湖南省电力有限公司 一种吸附剂的制备方法和应用
CN111977155A (zh) * 2020-09-19 2020-11-24 长沙市众邦彩印包装有限公司 一种抗氧化、耐高温煮、延长食品保鲜度食品包装袋
KR102584458B1 (ko) * 2020-10-20 2023-10-06 한국과학기술연구원 필름 구조체 및 이를 포함하는 표시 장치
CN112698530B (zh) * 2021-01-04 2024-07-02 东莞市光志光电有限公司 一种使用寿命长的量子点膜、其制备方法及在液晶显示器中的应用
KR102486050B1 (ko) * 2021-03-31 2023-01-09 동원시스템즈 주식회사 친환경 적층필름 및 이를 포함하는 친환경 포장재
KR102805924B1 (ko) * 2021-04-22 2025-05-09 유브라이트 옵트로닉스 코포레이션 퀀텀닷 광학 필름 및 그의 제조 방법
CN116265236B (zh) * 2021-12-17 2025-10-14 纳晶科技股份有限公司 量子点复合材料、显示装置
US20230312217A1 (en) * 2022-04-05 2023-10-05 F&S Tool, Inc. Contaminant-resistant packaging
KR102924901B1 (ko) 2022-05-31 2026-02-11 한국전자통신연구원 봉지 구조체를 포함하는 유연 유기 발광 소자
CN117799248A (zh) * 2022-09-30 2024-04-02 北京小米移动软件有限公司 一种封装膜及其制备方法和电化学装置、终端设备
CN116165401B (zh) * 2023-02-21 2025-06-17 厦门大学 一种适用于stm-bj的低漏电流针尖及其制备方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3332605B2 (ja) * 1993-12-02 2002-10-07 大日本印刷株式会社 機能性超微粒子を含む透明機能性膜、透明機能性フィルム及びその製造方法
US5747152A (en) * 1993-12-02 1998-05-05 Dai Nippon Printing Co., Ltd. Transparent functional membrane containing functional ultrafine particles, transparent functional film, and process for producing the same
JP3329958B2 (ja) * 1994-10-20 2002-09-30 大日本印刷株式会社 機能性超微粒子を含む透明機能性膜、透明機能性フィルム及びその製造方法
AU2020900A (en) * 1998-12-30 2000-07-24 Mobil Oil Corporation Coated films with improved barrier properties
US6465953B1 (en) * 2000-06-12 2002-10-15 General Electric Company Plastic substrates with improved barrier properties for devices sensitive to water and/or oxygen, such as organic electroluminescent devices
US7781034B2 (en) * 2004-05-04 2010-08-24 Sigma Laboratories Of Arizona, Llc Composite modular barrier structures and packages
DE102005047739B3 (de) * 2005-09-29 2007-02-08 Siemens Ag Substrat mit aufgebrachter Beschichtung, und Herstellungsverfahren
EP1925732A1 (de) * 2006-09-29 2008-05-28 Mondi Packaging AG Verpackungsmaterial mit Barriereschicht
EP2082619B1 (en) * 2006-11-06 2022-10-12 Agency for Science, Technology And Research Nanoparticulate encapsulation barrier stack
JP5263849B2 (ja) * 2008-04-09 2013-08-14 エージェンシー フォー サイエンス,テクノロジー アンド リサーチ 酸素及び/又は水分に敏感な電子デバイスをカプセル封じするための多層膜
EP2112201A1 (en) * 2008-04-25 2009-10-28 INEOS Manufacturing Belgium NV Oxygen Barrier Composition
JP5714481B2 (ja) * 2008-04-29 2015-05-07 エージェンシー フォー サイエンス,テクノロジー アンド リサーチ 無機傾斜バリア膜及びそれらの製造方法
US20100167914A1 (en) * 2008-12-29 2010-07-01 Vive Nano, Inc. Nano-scale catalysts
CN102458852B (zh) * 2009-06-02 2015-10-14 新加坡科技研究局 多层阻障膜
JP5419081B2 (ja) * 2009-08-07 2014-02-19 旭化成ケミカルズ株式会社 熱可塑性複合材料
JP2012031290A (ja) * 2010-07-30 2012-02-16 Nitto Denko Corp 相分離構造体およびその製造方法
SG11201401022SA (en) * 2011-10-24 2014-04-28 Tera Barrier Films Pte Ltd Encapsulation barrier stack

Similar Documents

Publication Publication Date Title
JP2016503353A5 (https=)
JP2016526251A5 (https=)
RU2014111285A (ru) Инкапсулирующая барьерная многослойная структура
EP2909027B1 (en) Encapsulation barrier stack
AU2011220397B2 (en) Structures with surface-embedded additives and related manufacturing methods
US10103359B2 (en) Multilayer film for encapsulating oxygen and/or moisture sensitive electronic devices
KR101130199B1 (ko) 나노입자 캡슐 배리어 스택
JP6755259B2 (ja) バリア膜積層体およびそのような積層体を備える電子デバイス
US9544999B2 (en) Transparent electrodes and electronic devices including the same
CN105552248A (zh) 一种电致发光器件的封装结构及其封装方法
CN112203839A (zh) 阻水性层叠体
WO2008018030B1 (en) Multilayer photovoltaic device and process for its preparation and application
EP3352238B1 (en) Method for preparing uneven particle layer, organic electroluminescent device, and display device
KR20150029903A (ko) 고저항성 봉지재와 유기 발광 다이오드 장치 및 이들의 제조 방법
JP5928634B2 (ja) ガスバリア性フィルムおよび電子デバイス
CN1302530C (zh) 电子元件的封装方法
US9843012B2 (en) Top emitting organic electroluminescent devices
TW201941952A (zh) 電子器件用阻隔膜
JP2016065981A (ja) 凹凸パターンを有する部材の製造方法
HK1181063A (en) Sealing material having high barrier property