US20200313089A1 - Crosslinked nanoparticle thin film, preparation method thereof, and thin film optoelectronic device having the same - Google Patents

Crosslinked nanoparticle thin film, preparation method thereof, and thin film optoelectronic device having the same Download PDF

Info

Publication number
US20200313089A1
US20200313089A1 US16/603,772 US201816603772A US2020313089A1 US 20200313089 A1 US20200313089 A1 US 20200313089A1 US 201816603772 A US201816603772 A US 201816603772A US 2020313089 A1 US2020313089 A1 US 2020313089A1
Authority
US
United States
Prior art keywords
thin film
nanoparticle
nanoparticles
electrode
crosslinked
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US16/603,772
Inventor
Song Chen
Lei Qian
Yixing Yang
Weiran Cao
Chaoyu XIANG
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL Technology Group Co Ltd
Original Assignee
TCL Technology Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201710232910.6A external-priority patent/CN108695405B/en
Priority claimed from CN201710232650.2A external-priority patent/CN108695376B/en
Priority claimed from CN201710233270.0A external-priority patent/CN108695137B/en
Priority claimed from CN201710232916.3A external-priority patent/CN108695413B/en
Priority claimed from CN201710232917.8A external-priority patent/CN108695406B/en
Application filed by TCL Technology Group Co Ltd filed Critical TCL Technology Group Co Ltd
Assigned to TCL CORPORATION reassignment TCL CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, SONG, XIANG, CHAOYU, YANG, Yixing, QIAN, LEI, CAO, WEIRAN
Assigned to TCL TECHNOLOGY GROUP CORPORATION reassignment TCL TECHNOLOGY GROUP CORPORATION CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: TCL CORPORATION
Publication of US20200313089A1 publication Critical patent/US20200313089A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • H01L51/0003
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1828Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIBVI compounds, e.g. CdS, ZnS, CdTe
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • H01L29/0665Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02587Structure
    • H01L21/0259Microstructure
    • H01L21/02601Nanoparticles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/30Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation comprising bulk heterojunctions, e.g. interpenetrating networks of donor and acceptor material domains
    • H10K30/35Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation comprising bulk heterojunctions, e.g. interpenetrating networks of donor and acceptor material domains comprising inorganic nanostructures, e.g. CdSe nanoparticles
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/12Deposition of organic active material using liquid deposition, e.g. spin coating
    • H01L51/5072
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having a potential-jump barrier or a surface barrier
    • H10K10/40Organic transistors
    • H10K10/46Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462Insulated gate field-effect transistors [IGFETs]
    • H10K10/484Insulated gate field-effect transistors [IGFETs] characterised by the channel regions
    • H10K10/488Insulated gate field-effect transistors [IGFETs] characterised by the channel regions the channel region comprising a layer of composite material having interpenetrating or embedded materials, e.g. a mixture of donor and acceptor moieties, that form a bulk heterojunction
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/50Photovoltaic [PV] devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14Carrier transporting layers
    • H10K50/16Electron transporting layers

Definitions

  • the present disclosure relates to the field of device film preparation, and in particular relates to a crosslinked nanoparticle film, a preparation method thereof and a film optoelectronic device.
  • Oxide nanoparticles (or spherical oxide nanocrystals) have a good crystallization, which ensures their optical and electrical properties to be similar to the bulk materials (i.e., low-dimensional materials).
  • the self-assembled thin films derived from nanoparticles show good performance, which allows the application of coating preparation at low cost.
  • the preparation of nanoparticles is one of the important processes for corresponding oxide films to be formed.
  • Common examples include semiconductor materials such as zinc oxide (ZnOx) nanoparticles, thin films derived from titanium oxide (TiOx) particles, which transport electrons in light-emitting diodes, thin film solar cells, thin film transistors; and semiconductor materials such as nickel oxide (NiOx) nanoparticles, which transport holes in the same device.
  • semiconductor materials such as zinc oxide (ZnOx) nanoparticles, thin films derived from titanium oxide (TiOx) particles, which transport electrons in light-emitting diodes, thin film solar cells, thin film transistors; and semiconductor materials such as nickel oxide (NiOx) nanoparticles, which transport holes in the same device.
  • the present disclosure aims to provide a crosslinked nanoparticle thin film, a preparation method thereof and a thin film optoelectronic device, which aims to solve the problems of high transport barriers for carriers and low carrier mobility in thin films for existing devices.
  • a method for preparing a crosslinked nanoparticle film comprising:
  • Step A Dispersing the nanoparticles in a solvent and uniformly mixing to obtain a nanoparticle solution
  • Step B Forming a nanoparticle film by a solution method, and introducing a gas mixture to promote crosslinking reactions to obtain a crosslinked nanoparticle thin film.
  • the method for preparing a crosslinked nanoparticle thin film wherein the gas mixture comprises a reduced gas, oxygen, water vapor, and carbon dioxide.
  • the method for preparing a crosslinked nanoparticle thin film wherein the reduced gas bias is controlled between 1 and 100 Pa, the oxygen bias is controlled between 0 and 2 ⁇ 10 4 Pa, and the water vapor bias is controlled between 0 and 2 ⁇ 10 3 Pa, the carbon dioxide bias is controlled between 0 and 100 Pa.
  • the method for preparing a crosslinked nanoparticle thin film wherein the mass concentration of the nanoparticle solution in the step A is 1 to 100 mg/ml.
  • the method for preparing a crosslinked nanoparticle thin film wherein the nanoparticle is one or more of: an oxide nanoparticle, a sulfide nanoparticle, a selenide nanoparticle, a nitride nanoparticle, and a fluoride nanoparticle.
  • the method for preparing a crosslinked nanoparticle thin film wherein the solvent is an alcohol solvent.
  • step B specifically comprises:
  • Step B 1 First, placing the nanoparticle solution in a closed environment, and preparing nanoparticle thin films from the nanoparticle solution by a solution method;
  • Step B 2 Introducing a gas mixture into the closed environment to promote crosslinking reactions, thereby obtaining a crosslinked nanoparticle thin film.
  • step B specifically comprises:
  • Step B 1 ′ First placing the nanoparticle solution in an inert atmosphere, and preparing the nanoparticle thin film from the nanoparticle solution by a solution method;
  • Step B 2 ′ Placing the nanoparticle thin film in a closed environment, and introducing a gas mixture into the closed environment to promote crosslinking reactions, thereby obtaining a crosslinked nanoparticle thin film.
  • the method for preparing a crosslinked nanoparticle thin film wherein the reduced gas is one of: carbon monoxide, hydrogen, and ammonia.
  • Step B The method for preparing a crosslinked nanoparticle thin film, wherein in Step B, the crosslinked nanoparticle thin film has a thickness of 15 to 60 nm.
  • a crosslinked nanoparticle thin film prepared by the method for preparing a crosslinked nanoparticle thin film as described above.
  • a thin film optoelectronic device comprising a crosslinked nanoparticle thin film as described above.
  • the thin film optoelectronic device wherein the thin film optoelectronic device is any one of: an electroluminescent device, a thin film photovoltaic, a thin film photodetector, and a thin film transistor.
  • the thin film optoelectronic device wherein the electroluminescent device comprises: a first electrode, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and a second electrode.
  • the material for the electron transport layer is a crosslinked nanoparticle thin film formed by the cross-linking treatment of the nanoparticle thin film.
  • the thin film optoelectronic device wherein the thin film photovoltaic device comprises: a first electrode, a light-emitting layer, an electron extraction layer, and a second electrode.
  • the material for the electron extraction layer is a crosslinked nanoparticle thin film formed by the cross-linking treatment of the nanoparticle thin film.
  • the thin film optoelectronic device wherein the thin film light detector comprises: an anode, an electron blocking layer, a light absorbing layer, a hole blocking layer and a cathode.
  • the material for the hole blocking layer is a crosslinked nanoparticle thin film formed by the cross-linking treatment of the nanoparticle thin film.
  • the thin film optoelectronic device wherein the material for the semiconductor layer of the thin film transistor is a crosslinked nanoparticle thin film formed by cross-linking treatment of the nanoparticle thin film.
  • the present disclosure has the beneficial effects:
  • the nanoparticles are crosslinked when the nanoparticle thin film is formed, so as to increase the electrical coupling among the particles, reduce the transport barrier of carriers, increase the carrier mobility, and greatly improve the electrical performance. Accordingly, the nanoparticle thin film prepared thereof can significantly improve the performance of the thin film optoelectronic device.
  • FIG. 1 is a schematic diagram showing the structure of an existing crosslinked zinc oxide nanoparticle thin film
  • FIG. 2 is a schematic diagram showing the structure of a crosslinked zinc oxide nanoparticle thin film prepared by the method of the present disclosure
  • FIG. 3 is a diagram showing the current-voltage curves for devices composed of ITO/NPB/MoOx/Al with different thin films;
  • FIG. 4 is a schematic structural diagram of an embodiment of a thin film electroluminescent device among the embodiments of the thin film optoelectronic devices of the present disclosure
  • FIG. 5 is a schematic structural diagram of an embodiment of a thin film photovoltaic device among the embodiments of the thin film optoelectronic devices of the present disclosure
  • FIG. 6 is a schematic structural diagram of an embodiment of a thin film light detector device among the embodiments of the thin film optoelectronic devices of the present disclosure
  • FIG. 7 a is a first schematic structural diagram of an embodiment of a thin film transistor among the embodiments of the thin film optoelectronic devices of the present disclosure
  • FIG. 7 b is a second schematic structural diagram of an embodiment of a thin film transistor among the embodiments of the thin film optoelectronic devices of the present disclosure
  • FIG. 8 is a third schematic structural diagram of an embodiment of a thin film transistor among the embodiments of the thin film optoelectronic devices of the present disclosure.
  • FIG. 9 is a fourth schematic structural diagram of an embodiment of a thin film transistor among the embodiments of the thin film optoelectronic devices of the present disclosure.
  • the present disclosure provides a crosslinked nanoparticle film, a preparation method thereof and a thin film optoelectronic device.
  • the present disclosure will be further described in detail below in order to make the objects, technical solutions and effects of the present disclosure clear. It is understood that the specific embodiments described herein are merely illustrative examples of the present disclosure and do not limit the present disclosure.
  • An embodiment of the present disclosure provides a method for preparing a crosslinked nanoparticle thin film, wherein the method includes:
  • Step A Dispersing nanoparticles in a solvent and uniformly mix the nanoparticles and the solvent, to obtain a nanoparticle solution.
  • the step A includes: Dispersing the nanoparticles in a solvent at a mass concentration of 1 to 100 mg/ml, mix uniformly, to obtain a nanoparticle solution used for film formation by solution methods.
  • the nanoparticles may be one or more of wide band-gap oxide nanoparticles, sulfide nanoparticles, selenide nanoparticles, nitride nanoparticles, and fluoride nanoparticles.
  • the oxide nanoparticles may be, but not limited to one of ZnOx (e.g., ZnO), TiOx (e.g., TiO 2 ), etc.
  • the sulfide nanoparticles may be, but not limited to, one of zinc sulfides and molybdenum sulfides.
  • the selenide nanoparticles may be, but are not limited to, one of zinc selenides and lead selenides.
  • the nitride nanoparticles may be, but not limited to, one of silicon nitrides and aluminum nitrides.
  • the fluoride nanoparticles may be, but not limited to, one of lanthanum fluorides and sodium fluorides. In the present disclosure, the dimension of the nanoparticles may be controlled.
  • the average diameter of the spherical nanoparticles may be limited to within 5 nm, to ensure that a sufficient amount of surface state metal atoms can participate in the reactions.
  • the solvent may be an alcohol solvent such as a methanol, an ethanol, etc.
  • Step B Preparing nanoparticle thin films by a solution method; and introducing a gas mixture to promote cross-linking reactions to obtain crosslinked nanoparticle thin films.
  • a solution method to deposit thin films is provided, the solution method may be spin coating, ink jet printing, spray coating, or blade coating, etc.
  • the gas mixture includes: a reduced gas, an oxygen, water vapor, and carbon dioxide.
  • the reduced gas e.g., carbon monoxide, hydrogen or ammonia
  • the oxygen bias pressure is controlled between 0 and 2 ⁇ 10 4 Pa
  • the water vapor bias pressure is controlled between 0 and 2 ⁇ 10 3 Pa
  • the carbon dioxide bias pressure is controlled between 0 and 100 Pa.
  • the bias pressure of the gas mixture in contact with thin films is controlled.
  • such bias pressure of each gas is controlled within the above-described ranges, because the density of thin film prepared under such bias pressure ranges is higher, and accordingly, the carrier mobility in the thin films is also higher.
  • the reduced gas e.g., carbon monoxide, hydrogen or ammonia
  • the oxygen bias pressure is controlled between 0 and 1 ⁇ 10 3 Pa
  • the water vapor bias pressure is controlled between 0 and 2 ⁇ 10 3 Pa
  • the carbon dioxide bias pressure is controlled between 0 and 100 Pa.
  • the density of thin films prepared under such bias pressure ranges is higher, and accordingly, the carrier electron mobility in the thin films is also higher.
  • the reduced gas e.g., carbon monoxide, hydrogen or ammonia
  • the oxygen bias pressure is controlled between 0 and 1 ⁇ 10 4 Pa
  • the water vapor bias pressure is controlled between 0 and 2 ⁇ 10 3 Pa
  • the carbon dioxide bias pressure is controlled between 0 and 100 Pa.
  • the density of thin films prepared under such bias ranges is higher, and accordingly, the carrier electron mobility in the thin films is also higher.
  • the reduced gas e.g., carbon monoxide, hydrogen or ammonia
  • the oxygen bias pressure is controlled between 0 and 5 ⁇ 10 3 Pa
  • the water vapor bias pressure is controlled between 0 and 2 ⁇ 10 3 P
  • the carbon dioxide bias pressure is controlled between 0 and 100 Pa.
  • the density of thin films prepared under such bias pressure ranges is higher, and accordingly, the carrier electron mobility in the thin films is also higher.
  • the reduced gas e.g., carbon monoxide, hydrogen or ammonia
  • the oxygen bias pressure is controlled to be less than 0.1 Pa
  • the water vapor bias pressure is controlled between 0 and 2 ⁇ 10 3 Pa
  • the carbon dioxide bias pressure is controlled between 0 and 100 Pa.
  • the density of thin films prepared under such bias pressure ranges is higher, and accordingly, the carrier electron mobility in the thin films is also higher.
  • the reduced gas e.g., carbon monoxide, hydrogen or ammonia
  • the oxygen bias pressure is controlled to be less than 0.1 Pa
  • the water vapor bias pressure is controlled between 0 and 2 ⁇ 10 3 Pa
  • the carbon dioxide bias pressure is controlled between 0 and 100 Pa.
  • the density of thin film under such bias pressure ranges is higher, and accordingly, the carrier electron mobility in the thin films is also higher.
  • the reduced gas e.g., carbon monoxide, hydrogen or ammonia
  • the oxygen bias pressure is controlled to be less than 0.1 Pa
  • the water vapor bias pressure is controlled between 0 and 1 ⁇ 10 2 Pa
  • the carbon dioxide bias pressure is controlled between 0 and 10 Pa.
  • the density of thin films produced under this bias pressure ranges is higher, and accordingly, the carrier electron mobility in the thin films is also higher.
  • the reduced gas e.g., carbon monoxide, hydrogen or ammonia
  • the oxygen bias pressure is controlled to be less than 0.1 Pa
  • the water vapor bias pressure is controlled to be less than 0.1 Pa
  • carbon dioxide bias pressure is controlled between 0 and 100 Pa.
  • the density of thin films produced under such bias pressure ranges is higher, and accordingly, the carrier electron mobility in the thin films is also higher.
  • the reduced gas e.g., carbon monoxide, hydrogen or ammonia
  • the oxygen bias pressure is controlled at 0.1 and 1 Pa
  • the water vapor bias pressure is controlled between 0 and 2 ⁇ 10 3 Pa
  • the carbon dioxide bias pressure is controlled between 0 and 100 Pa.
  • the nitrogen gas bias pressure is maintained at about 1 ⁇ 10 5 Pa.
  • the reduced gas e.g., carbon monoxide, hydrogen or ammonia
  • the oxygen bias pressure is controlled to be less than 0.1 Pa
  • the water vapor bias pressure is controlled between 0 and 2 ⁇ 10 3 Pa
  • the carbon dioxide bias pressure is controlled between 10 and 100 Pa.
  • the nitrogen gas bias pressure is maintained at about 1 ⁇ 10 5 Pa.
  • the density of thin film prepared under such bias pressure ranges is higher, and accordingly, the carrier electron mobility in the thin films is also higher.
  • the reduced gas e.g., carbon monoxide, hydrogen or ammonia
  • the oxygen bias pressure is controlled to be less than 0.1 Pa
  • the water vapor bias pressure is controlled between 0 and 1 ⁇ 10 2 Pa
  • the carbon dioxide bias pressure is controlled between 0 and 10 Pa.
  • the density of thin films prepared under such bias pressure ranges is higher, and accordingly, the carrier electron mobility in the thin films is also higher.
  • the reduced gas e.g., carbon monoxide, hydrogen or ammonia
  • the oxygen bias pressure is controlled to be less than 0.1 Pa
  • the water vapor bias pressure is controlled between 0 and 2 ⁇ 10 3 Pa
  • the carbon dioxide bias is controlled between 10 and 100 Pa.
  • the density of thin films prepared under such bias pressure ranges is higher, and accordingly, the carrier electron mobility in the thin films is also higher.
  • the nanoparticles are crosslinked during thin film formation.
  • Cross-links are chemical bonds that connect nanoparticles, among which there are fillers.
  • the crosslinking method of the present disclosure can increase the density and carrier mobility in the corresponding thin films.
  • nanoparticle films can be prepared directly from a nanoparticle solution under a non-vacuum condition.
  • the step B includes:
  • Step B 1 Placing a nanoparticle solution in a closed environment, and preparing nanoparticle thin films by a solution method
  • Step B 2 Introducing a gas mixture into the closed environment, to promote crosslinking reactions, to obtain crosslinked nanoparticles.
  • nanoparticle thin films are prepared from a nanoparticle solution under a closed non-vacuum condition.
  • the above-mentioned gas mixture is then introduced to the closed environment, to promote crosslinking reactions, to obtain crosslinked nanoparticle thin films.
  • the preparation of crosslinked nanoparticle thin films of the present disclosure is not limited to the above-mentioned environment.
  • the nanoparticle thin films can be prepared under an inert atmosphere, and then be placed in a closed environment. The closed environment is then introduced a gas mixture, to promote the crosslinking reactions, to obtain nanoparticle thin films.
  • the Step B includes:
  • Step B 1 ′ Placing the nanoparticle solution in an inert atmosphere and preparing nanoparticle thin films by a solution method
  • Step B 2 ′ Placing the nanoparticle thin film in a closed environment, and introducing a gas mixture into the closed environment, to promote crosslinking reactions, to obtain crosslinked nanoparticle thin films.
  • the crosslinked nanoparticle thin films are dried to finally obtain crosslinked nanoparticle thin film having a thickness of 15 to 60 nm.
  • the drying temperature is higher than the boiling point of the solvent in the nanoparticle solution; according to the thickness of the film, the drying time is more than 15 minutes per 50 nm.
  • the present disclosure also provides a crosslinked nanoparticle thin films prepared by any of the above methods for preparing crosslinked nanoparticle thin films.
  • a nanoparticle thin film is self-assembled from nanoparticles that are not crosslinked to each other.
  • a gas mixture is introduced to promote crosslinking among the particles, thereby increasing electrical coupling between the particles, reducing the transport barrier of carriers, increasing carrier mobility, and accordingly, improving the electrical performance.
  • the application of the obtained crosslinked nanoparticle thin films in light-emitting diodes, thin film solar cells, light detectors, and thin film transistors prepared by solution methods can significantly improve the performance of these devices.
  • FIG. 1 is a schematic diagram of the structure of an existing uncrosslinked zinc oxide nanoparticle thin film
  • FIG. 2 is a schematic diagram of the structure of a crosslinked zinc oxide nanoparticle thin film prepared by a method of the present disclosure
  • FIG. 3 is a diagram showing the current-voltage curves for ITO/NPB/MoOx/Al devices with different thin films. As shown in FIG. 1 , there is no substance connected by chemical bonds between the uncrosslinked nanoparticles 1 .
  • the current of the crosslinked ZnO nanoparticle thin film is kept at a low value regardless of whether it is soaked in an alcohol solvent (e.g., ethanol), which indicates that ZnO nanoparticle thin film does not detach during soaking, which results in an apparent inhibitory effect on the current of the ITO/NPB/MoOx/A 1 structure by ZnO.
  • the current is significantly increased when the uncrosslinked ZnO nanoparticle thin film is soaked in an alcohol solvent (e.g., ethanol), which indicates that the uncrosslinked ZnO nanoparticle thin film detaches during soaking, so that the current of the responsive devices is significantly increased, very close to the current of the devices without adding ZnO nanoparticle thin film.
  • the crosslinked zinc oxide nanoparticle thin film obtained by crosslinking reactions does not dissolve or have any detachment after soaking in the original solvent (e.g., a solvent used for dispersing zinc oxide nanoparticles, usually, i.e., an alcohol solvent).
  • the uncrosslinked nanoparticle thin film can easily detach after soaking.
  • the present disclosure also provides a thin film optoelectronic device, wherein, the thin film optoelectronic device includes a crosslinked nanoparticle thin film.
  • the thin film optoelectronic device is any one of: an electroluminescent device, a thin film photovoltaic device, a thin film light detector, and a thin film transistor.
  • an electroluminescent device includes sequentially: a first electrode 10 , a hole injection layer 20 , a hole transport layer 30 , a light emitting layer 40 , an electron transport layer 50 , and the second electrode 60 .
  • the material of the electron transport layer 50 is a crosslinked nanoparticle thin film formed from crosslinking reactions.
  • the material for the first electrode is selected from one or more of: indium-doped tin oxide (ITO), fluorine-doped tin oxide (FTO), antimony doped tin oxide (ATO), aluminum-doped zinc oxide (AZO); preferably, the first electrode is an ITO electrode.
  • the material for the hole transport layer 430 is selected from the materials or the materials with the chemical groups: poly[bis(4-phenyl)(4-butylphenyl)amine], 4-butyl-N,N-diphenylaniline homopolymer, aniline, 4-butyl-N,N-diphenyl, homopolymer (poly-TPD), poly(9,9-dioctylfluorene-CO-N-(4-butylphenyl)-diphenylamine) (TFB), poly(9-vinylcarbazole) (PVK), TPD, Spiro-TPD, LG101, HAT-CN, PEDOT: PSS, TAPC, a-NPB, m-MTDATA, NiO x O, MoO x , VO x , WO x and a mixture thereof; preferably, the hole transport layer 30 is a poly-TPD layer and has a thickness of 10 to 100 nm
  • the material for the quantum dot light-emitting layer includes but not limited to: nanocrystals of II-VI semiconductor, for example, CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, HgS, HgSe, HgTe, PbS, Pb Se, PbTe and other binary, ternary, or quaternary II-VI compounds; III-V semiconductor nanocrystals, for example, GaP, GaAs, InP, InAs or other binary, ternary, or quaternary III-V compounds.
  • the quantum dot luminescent material for electroluminescence is not limited to II-V compounds, III-VI compounds, IV-VI compounds, I-III-IV compounds, II-IV-VI compound, or group IV elements.
  • the material for the second electrode is selected from: Al, Ag, Cu, Mo, Au, or an alloy thereof; preferably, the material for the second electrode is Au.
  • the second electrode has a thickness of 50 to 500 nm; preferably, the second electrode has a thickness of 100 to 200 nm.
  • the thin film photovoltaic device includes: a first electrode 10 , a light absorbing layer 20 , an electron extraction layer 30 , and a second electrode 40 .
  • the material for the electron extraction layer 30 is a crosslinked nanoparticle thin film formed by crosslinking reactions in a nanoparticle thin film.
  • the first electrode and the second electrode has high sunlight transmittance.
  • the first electrode is selected from one or more of: indium-doped tin oxide (ITO), fluorine-doped tin oxide (FTO), antimony-doped tin oxide (ATO), and aluminum-doped zinc oxide (AZO); preferably, the material for the first electrode is ITO.
  • the light absorbing layer may be a semiconductor homojunction or a heterojunction.
  • the material for the light absorbing layer is a light absorbing material in a solar spectrum, and may include: polymer photovoltaic material; organic small molecule photovoltaic material; halogen-containing perovskite photovoltaic material; chalcopyrite structural material (e.g., copper indium gallium selenide); II-VI compound material (e.g., thin films and nanocrystals); single crystal, polycrystalline, or amorphous silicon. If the light absorbing layer is a homojunction, the light absorbing layer includes a specific material of one material category from above; if the light absorbing layer is a heterojunction, the light absorbing layer includes two specific materials from one or two material categories from above.
  • the material for the second electrode is selected from: Al, Ag, Cu, Mo, Au, or an alloy thereof; preferably, the material for the second electrode is Au.
  • the second electrode has a thickness of 50 to 500 nm; preferably, the second electrode has a thickness of 100 to 200 nm.
  • the thin film light detector includes sequentially: an anode 4 , an electron blocking layer 5 , a light absorbing layer 6 , a hole blocking layer 7 , and a cathode 8 .
  • the material of the hole blocking layer 7 is a crosslinked nanoparticle thin film obtained by crosslinking reactions in a nanoparticle thin film.
  • At least one of the anode and the cathode has high transmittance for the detection band.
  • the material for the anode is selected one or more of indium-doped tin oxide (ITO), fluorine-doped tin oxide (FTO), antimony-doped tin oxide (ATO), and aluminum-doped zinc oxide (AZO); preferably, the material for the anode is ITO.
  • ITO indium-doped tin oxide
  • FTO fluorine-doped tin oxide
  • ATO antimony-doped tin oxide
  • AZO aluminum-doped zinc oxide
  • the material for the electron blocking layer is selected from: poly(9,9-dioctylfluorene-CO-N-(4-butylphenyl)-diphenylamine) (TFB), polyvinylcarbazole (PVK), poly(N,N′ bis(4-butylphenyl)-N,N′-bis(phenyl)benzidine) (poly-TPD), poly(9,9-dioctylfluorene-co-bis-N,N-phenyl-1,4-phenylenediamine) (PFB), 4,4′, 4′′-tris(carbazol-9-yl)-triphenylamine (TCTA), 4, 4′-bis(9-carbazole)-biphenyl (CBP), N,N′-diphenyl-N,N′-bis(3-methylphenyl)-1,1′-biphenyl-4, 4′-diamine (TPD), N
  • the material for the light absorbing layer is one or more of: a binary III-V compound (e.g., GaN, GaAs or InGaAs); a multinary III-V compound; a nanocrystal of a II-VI compound material, an organic semiconductor material; a halogen-containing perovskite material; a chalcopyrite structural material (e.g., copper indium gallium selenide); a single crystal, polycrystalline, or amorphous silicon.
  • the light absorbing layer may be a semiconductor homojunction or a semiconductor heterojunction.
  • the material for the light absorbing layer is one specific material of a material category from above.
  • the material for the light absorbing layer are two specific materials of one or two material category from above.
  • the cathode material is selected from: Al, Ag, Cu, Mo, Au, or an alloy thereof; preferably, the cathode material is Au.
  • the cathode has a thickness of 50 to 500 nm. In some embodiments, the cathode has a thickness of 100 to 200 nm; preferably, the thin film light detector is partially packaged, fully packaged, or unpackaged.
  • the semiconductor layer material of the thin film transistor is a crosslinked nanoparticle thin film formed by crosslinking reactions in a nanoparticle thin film.
  • the thin film transistor includes: a substrate 10 , a source electrode 20 disposed on the substrate 10 , a drain electrode 30 , an insulating layer 40 disposed on the source electrode 20 and the drain electrode 30 , a gate electrode 50 disposed on the insulating layer 40 , and a semiconductor layer 60 disposed on the substrate 10 .
  • the source electrode 20 and the drain electrode 30 are separated by the semiconductor layer 60 .
  • the semiconductor layer 60 has a thickness greater than a thickness of the source electrode or a thickness of the drain electrode (as shown in FIG. 7 a ); the semiconductor layer 60 has a thickness consistent with the thickness of the source electrode 20 or the thickness of the drain electrode 30 (as shown in FIG. 7 b ).
  • the thin film transistor may also be configured to include: a substrate, a gate electrode, an insulating layer and a semiconductor layer, which are sequentially stacked from bottom to top.
  • the semiconductor layer is configured to include a source electrode and a drain electrode; the source electrode and the drain electrode are separated from each other.
  • the thin film transistor may be configured to include: a substrate, a gate electrode, an insulating layer and a semiconductor layer, which are sequentially stacked from bottom to top.
  • the insulating layer is configured to include a source electrode and a drain electrode; the source electrode and the drain electrode are disposed in the interior of the semiconductor layer, and are separated by the semiconductor layer.
  • the material for the source electrode, the drain electrode, and the gate electrode may be a metal or a semiconductor having high conductivity.
  • the material for the insulating layer may be a dielectric material, for example, an oxide, or a nitride.
  • the present disclosure provides a crosslinked nanoparticle thin film, a preparation method thereof and a thin film optoelectronic device.
  • a gas mixture is introduced during the nanoparticle thin film formation, to promote crosslinking among the particles, which increases the electrical coupling between the particles, reduces the transport barrier of carriers, increases the carrier mobility, and accordingly, greatly improves the electrical performance.
  • the application of the obtained crosslinked nanoparticle thin films in electroluminescent device prepared by solution methods, as electron transport layer, can apparently improve carrier balance, luminous efficiency and lifetime of the device.
  • the application of the obtained crosslinked nanoparticle thin films in photovoltaic devices prepared by solution methods, as electron transport layer, can significantly reduce the linear resistance of the device, improve the parallel resistance, and improve the energy conversion efficiency of the device.
  • the application of the obtained crosslinked nanoparticle thin films in thin film light detector prepared by solution methods, as electron extraction layer and hole blocking layer can reduce the current and improve the detection rate.
  • the application of the obtained crosslinked nanoparticle thin films in thin film transistor prepared by solution methods can improve the carrier mobility of the semiconductor layer, increase the source-drain current, and increase the response frequency.

Abstract

Disclosed are a crosslinked nanoparticle film and a preparation method therefor, and a thin film optoelectronic device. The preparation method comprises: dispersing nanoparticles in a solvent and uniformly mixing same, so as to obtain a nanoparticle solution; and using the nanoparticle solution to prepare a nanoparticle thin film by means of a solution method, and introducing a gas combination to promote a crosslinking reaction, so as to obtain a crosslinked nanoparticle thin film. By introducing a gas combination during film formation of nanoparticles, the present disclosure promotes the crosslinking among particles, and thus increases the electrical coupling among particles, lowers the potential barrier of carrier transmission, and increases the carrier mobility, thereby greatly improving the electrical properties of the thin film.

Description

    TECHNICAL FIELD
  • The present disclosure relates to the field of device film preparation, and in particular relates to a crosslinked nanoparticle film, a preparation method thereof and a film optoelectronic device.
  • BACKGROUND TECHNIQUE
  • Oxide nanoparticles (or spherical oxide nanocrystals) have a good crystallization, which ensures their optical and electrical properties to be similar to the bulk materials (i.e., low-dimensional materials). On the other hand, the self-assembled thin films derived from nanoparticles show good performance, which allows the application of coating preparation at low cost. In the process of fabricating optoelectronic devices by solution methods, the preparation of nanoparticles is one of the important processes for corresponding oxide films to be formed. Common examples include semiconductor materials such as zinc oxide (ZnOx) nanoparticles, thin films derived from titanium oxide (TiOx) particles, which transport electrons in light-emitting diodes, thin film solar cells, thin film transistors; and semiconductor materials such as nickel oxide (NiOx) nanoparticles, which transport holes in the same device.
  • Regardless, there is still a difference between thin films formed by nanoparticle deposition and thin films formed by the bulk material, which is mainly reflected on the transport properties of the carriers. Despite the good crystallinity of the interior of nanoparticles, such a structure is limited to a nanoscale; and even in the case of close-packing, nanoparticles are often filled with an insulating surface ligand or even without any fillers. Accordingly, there is a relatively high carrier transport barrier among nanoparticles, and the transport of carriers inside nanoparticle thin films can only follow the pattern of hopping transport. As a result, the carrier mobility in the dimension of thin films is much smaller than the carrier mobility in the bulk material.
  • Therefore, the prior art has yet to be improved and developed.
  • SUMMARY OF THE INVENTION
  • In view of the above deficiencies of the prior art, the present disclosure aims to provide a crosslinked nanoparticle thin film, a preparation method thereof and a thin film optoelectronic device, which aims to solve the problems of high transport barriers for carriers and low carrier mobility in thin films for existing devices.
  • The technical solution of the present invention is as follows:
  • A method for preparing a crosslinked nanoparticle film, comprising:
  • Step A: Dispersing the nanoparticles in a solvent and uniformly mixing to obtain a nanoparticle solution;
  • Step B: Forming a nanoparticle film by a solution method, and introducing a gas mixture to promote crosslinking reactions to obtain a crosslinked nanoparticle thin film.
  • The method for preparing a crosslinked nanoparticle thin film, wherein the gas mixture comprises a reduced gas, oxygen, water vapor, and carbon dioxide.
  • The method for preparing a crosslinked nanoparticle thin film, wherein the reduced gas bias is controlled between 1 and 100 Pa, the oxygen bias is controlled between 0 and 2×104 Pa, and the water vapor bias is controlled between 0 and 2×103 Pa, the carbon dioxide bias is controlled between 0 and 100 Pa.
  • The method for preparing a crosslinked nanoparticle thin film, wherein the mass concentration of the nanoparticle solution in the step A is 1 to 100 mg/ml.
  • The method for preparing a crosslinked nanoparticle thin film, wherein the nanoparticle is one or more of: an oxide nanoparticle, a sulfide nanoparticle, a selenide nanoparticle, a nitride nanoparticle, and a fluoride nanoparticle.
  • The method for preparing a crosslinked nanoparticle thin film, wherein the average diameter of the nanoparticles is controlled within 5 nm.
  • The method for preparing a crosslinked nanoparticle thin film, wherein the solvent is an alcohol solvent.
  • The method for preparing a crosslinked nanoparticle thin film, wherein the step B specifically comprises:
  • Step B1: First, placing the nanoparticle solution in a closed environment, and preparing nanoparticle thin films from the nanoparticle solution by a solution method;
  • Step B2: Introducing a gas mixture into the closed environment to promote crosslinking reactions, thereby obtaining a crosslinked nanoparticle thin film.
  • The method for preparing a crosslinked nanoparticle film, wherein the step B specifically comprises:
  • Step B1′: First placing the nanoparticle solution in an inert atmosphere, and preparing the nanoparticle thin film from the nanoparticle solution by a solution method;
  • Step B2′: Placing the nanoparticle thin film in a closed environment, and introducing a gas mixture into the closed environment to promote crosslinking reactions, thereby obtaining a crosslinked nanoparticle thin film.
  • The method for preparing a crosslinked nanoparticle thin film, wherein the reduced gas is one of: carbon monoxide, hydrogen, and ammonia.
  • The method for preparing a crosslinked nanoparticle thin film, wherein in Step B, the crosslinked nanoparticle thin film has a thickness of 15 to 60 nm.
  • A crosslinked nanoparticle thin film prepared by the method for preparing a crosslinked nanoparticle thin film as described above.
  • A thin film optoelectronic device comprising a crosslinked nanoparticle thin film as described above.
  • The thin film optoelectronic device, wherein the thin film optoelectronic device is any one of: an electroluminescent device, a thin film photovoltaic, a thin film photodetector, and a thin film transistor.
  • The thin film optoelectronic device, wherein the electroluminescent device comprises: a first electrode, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and a second electrode. The material for the electron transport layer is a crosslinked nanoparticle thin film formed by the cross-linking treatment of the nanoparticle thin film.
  • The thin film optoelectronic device, wherein the thin film photovoltaic device comprises: a first electrode, a light-emitting layer, an electron extraction layer, and a second electrode. The material for the electron extraction layer is a crosslinked nanoparticle thin film formed by the cross-linking treatment of the nanoparticle thin film.
  • The thin film optoelectronic device, wherein the thin film light detector comprises: an anode, an electron blocking layer, a light absorbing layer, a hole blocking layer and a cathode. The material for the hole blocking layer is a crosslinked nanoparticle thin film formed by the cross-linking treatment of the nanoparticle thin film.
  • The thin film optoelectronic device, wherein the material for the semiconductor layer of the thin film transistor is a crosslinked nanoparticle thin film formed by cross-linking treatment of the nanoparticle thin film. The present disclosure has the beneficial effects: In the present disclosure, the nanoparticles are crosslinked when the nanoparticle thin film is formed, so as to increase the electrical coupling among the particles, reduce the transport barrier of carriers, increase the carrier mobility, and greatly improve the electrical performance. Accordingly, the nanoparticle thin film prepared thereof can significantly improve the performance of the thin film optoelectronic device.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a schematic diagram showing the structure of an existing crosslinked zinc oxide nanoparticle thin film;
  • FIG. 2 is a schematic diagram showing the structure of a crosslinked zinc oxide nanoparticle thin film prepared by the method of the present disclosure;
  • FIG. 3 is a diagram showing the current-voltage curves for devices composed of ITO/NPB/MoOx/Al with different thin films;
  • FIG. 4 is a schematic structural diagram of an embodiment of a thin film electroluminescent device among the embodiments of the thin film optoelectronic devices of the present disclosure;
  • FIG. 5 is a schematic structural diagram of an embodiment of a thin film photovoltaic device among the embodiments of the thin film optoelectronic devices of the present disclosure;
  • FIG. 6 is a schematic structural diagram of an embodiment of a thin film light detector device among the embodiments of the thin film optoelectronic devices of the present disclosure;
  • FIG. 7a is a first schematic structural diagram of an embodiment of a thin film transistor among the embodiments of the thin film optoelectronic devices of the present disclosure;
  • FIG. 7b is a second schematic structural diagram of an embodiment of a thin film transistor among the embodiments of the thin film optoelectronic devices of the present disclosure;
  • FIG. 8 is a third schematic structural diagram of an embodiment of a thin film transistor among the embodiments of the thin film optoelectronic devices of the present disclosure; and
  • FIG. 9 is a fourth schematic structural diagram of an embodiment of a thin film transistor among the embodiments of the thin film optoelectronic devices of the present disclosure.
  • DETAILED DESCRIPTION OF THE EMBODIMENTS
  • The present disclosure provides a crosslinked nanoparticle film, a preparation method thereof and a thin film optoelectronic device. The present disclosure will be further described in detail below in order to make the objects, technical solutions and effects of the present disclosure clear. It is understood that the specific embodiments described herein are merely illustrative examples of the present disclosure and do not limit the present disclosure.
  • An embodiment of the present disclosure provides a method for preparing a crosslinked nanoparticle thin film, wherein the method includes:
  • Step A: Dispersing nanoparticles in a solvent and uniformly mix the nanoparticles and the solvent, to obtain a nanoparticle solution.
  • Specifically, the step A includes: Dispersing the nanoparticles in a solvent at a mass concentration of 1 to 100 mg/ml, mix uniformly, to obtain a nanoparticle solution used for film formation by solution methods. The nanoparticles may be one or more of wide band-gap oxide nanoparticles, sulfide nanoparticles, selenide nanoparticles, nitride nanoparticles, and fluoride nanoparticles. The oxide nanoparticles may be, but not limited to one of ZnOx (e.g., ZnO), TiOx (e.g., TiO2), etc. The sulfide nanoparticles may be, but not limited to, one of zinc sulfides and molybdenum sulfides. The selenide nanoparticles may be, but are not limited to, one of zinc selenides and lead selenides. The nitride nanoparticles may be, but not limited to, one of silicon nitrides and aluminum nitrides. The fluoride nanoparticles may be, but not limited to, one of lanthanum fluorides and sodium fluorides. In the present disclosure, the dimension of the nanoparticles may be controlled. The average diameter of the spherical nanoparticles may be limited to within 5 nm, to ensure that a sufficient amount of surface state metal atoms can participate in the reactions. The solvent may be an alcohol solvent such as a methanol, an ethanol, etc.
  • Step B: Preparing nanoparticle thin films by a solution method; and introducing a gas mixture to promote cross-linking reactions to obtain crosslinked nanoparticle thin films. In the present disclosure, a solution method to deposit thin films is provided, the solution method may be spin coating, ink jet printing, spray coating, or blade coating, etc.
  • Specifically, the gas mixture includes: a reduced gas, an oxygen, water vapor, and carbon dioxide. Preferably, the reduced gas (e.g., carbon monoxide, hydrogen or ammonia) bias pressure is controlled between 1 and 100 Pa; the oxygen bias pressure is controlled between 0 and 2×104 Pa; the water vapor bias pressure is controlled between 0 and 2×103 Pa; and the carbon dioxide bias pressure is controlled between 0 and 100 Pa. According to the present disclosure, the bias pressure of the gas mixture in contact with thin films is controlled. Preferably, such bias pressure of each gas is controlled within the above-described ranges, because the density of thin film prepared under such bias pressure ranges is higher, and accordingly, the carrier mobility in the thin films is also higher.
  • The conditions for crosslinking reactions for each of the above type of nanoparticles will be described in detail below.
  • 1. Oxide Nanoparticle
  • When the nanoparticles are zinc oxide nanoparticles, the reduced gas (e.g., carbon monoxide, hydrogen or ammonia) bias pressure is controlled between 1 and 100 Pa; the oxygen bias pressure is controlled between 0 and 1×103 Pa; the water vapor bias pressure is controlled between 0 and 2×103 Pa; and the carbon dioxide bias pressure is controlled between 0 and 100 Pa. The density of thin films prepared under such bias pressure ranges is higher, and accordingly, the carrier electron mobility in the thin films is also higher.
  • When the nanoparticles are titanium oxide nanoparticles, the reduced gas (e.g., carbon monoxide, hydrogen or ammonia) bias pressure is controlled between 1 and 100 Pa; the oxygen bias pressure is controlled between 0 and 1×104 Pa; the water vapor bias pressure is controlled between 0 and 2×103 Pa; and the carbon dioxide bias pressure is controlled between 0 and 100 Pa. The density of thin films prepared under such bias ranges is higher, and accordingly, the carrier electron mobility in the thin films is also higher.
  • When the nanoparticles are nickel oxide nanoparticles, the reduced gas (e.g., carbon monoxide, hydrogen or ammonia) bias pressure is controlled between 1 and 100 Pa; and the oxygen bias pressure is controlled between 0 and 5×103 Pa; the water vapor bias pressure is controlled between 0 and 2×103 P; and the carbon dioxide bias pressure is controlled between 0 and 100 Pa. The density of thin films prepared under such bias pressure ranges is higher, and accordingly, the carrier electron mobility in the thin films is also higher.
  • 2. Sulfide Nanoparticles
  • When the nanoparticles are zinc sulfide nanoparticles, the reduced gas (e.g., carbon monoxide, hydrogen or ammonia) bias pressure is controlled between 1 and 100 Pa; the oxygen bias pressure is controlled to be less than 0.1 Pa; the water vapor bias pressure is controlled between 0 and 2×103 Pa; and the carbon dioxide bias pressure is controlled between 0 and 100 Pa. The density of thin films prepared under such bias pressure ranges is higher, and accordingly, the carrier electron mobility in the thin films is also higher.
  • When the nanoparticles are molybdenum sulfide nanoparticles, the reduced gas (e.g., carbon monoxide, hydrogen or ammonia) bias pressure is controlled between 1 and 100 Pa; the oxygen bias pressure is controlled to be less than 0.1 Pa; the water vapor bias pressure is controlled between 0 and 2×103 Pa; and the carbon dioxide bias pressure is controlled between 0 and 100 Pa. The density of thin film under such bias pressure ranges is higher, and accordingly, the carrier electron mobility in the thin films is also higher.
  • 3. Selenide Nanoparticles
  • When the nanoparticles are zinc selenide nanoparticles, the reduced gas (e.g., carbon monoxide, hydrogen or ammonia) bias pressure is controlled between 1 and 100 Pa; the oxygen bias pressure is controlled to be less than 0.1 Pa; the water vapor bias pressure is controlled between 0 and 1×102 Pa; and the carbon dioxide bias pressure is controlled between 0 and 10 Pa. The density of thin films produced under this bias pressure ranges is higher, and accordingly, the carrier electron mobility in the thin films is also higher.
  • When the nanoparticles are lead selenide nanoparticles, the reduced gas (e.g., carbon monoxide, hydrogen or ammonia) bias pressure is controlled between 1 and 100 Pa; the oxygen bias pressure is controlled to be less than 0.1 Pa; the water vapor bias pressure is controlled to be less than 0.1 Pa, carbon dioxide bias pressure is controlled between 0 and 100 Pa. The density of thin films produced under such bias pressure ranges is higher, and accordingly, the carrier electron mobility in the thin films is also higher.
  • 4. Nitride Nanoparticles
  • When the nanoparticles are silicon nitride nanoparticles, the reduced gas (e.g., carbon monoxide, hydrogen or ammonia) bias pressure is controlled between 1 and 100 Pa; the oxygen bias pressure is controlled at 0.1 and 1 Pa; the water vapor bias pressure is controlled between 0 and 2×103Pa; and the carbon dioxide bias pressure is controlled between 0 and 100 Pa. Additionally, the nitrogen gas bias pressure is maintained at about 1×105 Pa. The density of thin films prepared under such bias pressure ranges is higher, and accordingly, the carrier electron mobility in thin films is also higher.
  • When the nanoparticles are aluminum nitride nanoparticles, the reduced gas (e.g., carbon monoxide, hydrogen or ammonia) bias pressure is controlled between 1 and 100 Pa; the oxygen bias pressure is controlled to be less than 0.1 Pa; the water vapor bias pressure is controlled between 0 and 2×103Pa; and the carbon dioxide bias pressure is controlled between 10 and 100 Pa. Additionally, the nitrogen gas bias pressure is maintained at about 1×10 5 Pa. The density of thin film prepared under such bias pressure ranges is higher, and accordingly, the carrier electron mobility in the thin films is also higher.
  • 5. Fluoride Nanoparticles
  • When the nanoparticles are lanthanum fluoride nanoparticles, the reduced gas (e.g., carbon monoxide, hydrogen or ammonia) bias pressure is controlled between 1 and 100 Pa; the oxygen bias pressure is controlled to be less than 0.1 Pa; the water vapor bias pressure is controlled between 0 and 1×102 Pa; and the carbon dioxide bias pressure is controlled between 0 and 10 Pa. The density of thin films prepared under such bias pressure ranges is higher, and accordingly, the carrier electron mobility in the thin films is also higher.
  • When the nanoparticles are sodium fluoride nanoparticles, the reduced gas (e.g., carbon monoxide, hydrogen or ammonia) bias pressure is controlled between 1 and 100 Pa; the oxygen bias pressure is controlled to be less than 0.1 Pa; the water vapor bias pressure is controlled between 0 and 2×103 Pa; and the carbon dioxide bias is controlled between 10 and 100 Pa. The density of thin films prepared under such bias pressure ranges is higher, and accordingly, the carrier electron mobility in the thin films is also higher.
  • In the present disclosure, the nanoparticles are crosslinked during thin film formation. Cross-links are chemical bonds that connect nanoparticles, among which there are fillers. In contrast, there is no material linked by chemical bonds between the uncrosslinked nanoparticles. The crosslinking method of the present disclosure can increase the density and carrier mobility in the corresponding thin films.
  • In the present disclosure, nanoparticle films can be prepared directly from a nanoparticle solution under a non-vacuum condition. Specifically, the step B includes:
  • Step B1: Placing a nanoparticle solution in a closed environment, and preparing nanoparticle thin films by a solution method; and
  • Step B2: Introducing a gas mixture into the closed environment, to promote crosslinking reactions, to obtain crosslinked nanoparticles.
  • In the foregoing described embodiments, nanoparticle thin films are prepared from a nanoparticle solution under a closed non-vacuum condition. The above-mentioned gas mixture is then introduced to the closed environment, to promote crosslinking reactions, to obtain crosslinked nanoparticle thin films.
  • The preparation of crosslinked nanoparticle thin films of the present disclosure is not limited to the above-mentioned environment. The nanoparticle thin films can be prepared under an inert atmosphere, and then be placed in a closed environment. The closed environment is then introduced a gas mixture, to promote the crosslinking reactions, to obtain nanoparticle thin films. Specifically, the Step B includes:
  • Step B1′: Placing the nanoparticle solution in an inert atmosphere and preparing nanoparticle thin films by a solution method; and
  • Step B2′: Placing the nanoparticle thin film in a closed environment, and introducing a gas mixture into the closed environment, to promote crosslinking reactions, to obtain crosslinked nanoparticle thin films.
  • In the present disclosure, after the crosslinking reactions, the crosslinked nanoparticle thin films are dried to finally obtain crosslinked nanoparticle thin film having a thickness of 15 to 60 nm. The drying temperature is higher than the boiling point of the solvent in the nanoparticle solution; according to the thickness of the film, the drying time is more than 15 minutes per 50 nm.
  • The present disclosure also provides a crosslinked nanoparticle thin films prepared by any of the above methods for preparing crosslinked nanoparticle thin films.
  • Usually, a nanoparticle thin film is self-assembled from nanoparticles that are not crosslinked to each other. In the present disclosure, during thin film formation of the nanoparticles, a gas mixture is introduced to promote crosslinking among the particles, thereby increasing electrical coupling between the particles, reducing the transport barrier of carriers, increasing carrier mobility, and accordingly, improving the electrical performance. The application of the obtained crosslinked nanoparticle thin films in light-emitting diodes, thin film solar cells, light detectors, and thin film transistors prepared by solution methods can significantly improve the performance of these devices.
  • Below is an illustrative example of zinc oxide nanoparticles, and the properties of the existing uncrosslinked zinc oxide nanoparticle thin films and the properties of the crosslinked zinc oxide nanoparticle thin films prepared by the methods of the present disclosure are tested. Referring to FIGS. 1-3, FIG. 1 is a schematic diagram of the structure of an existing uncrosslinked zinc oxide nanoparticle thin film, FIG. 2 is a schematic diagram of the structure of a crosslinked zinc oxide nanoparticle thin film prepared by a method of the present disclosure, FIG. 3 is a diagram showing the current-voltage curves for ITO/NPB/MoOx/Al devices with different thin films. As shown in FIG. 1, there is no substance connected by chemical bonds between the uncrosslinked nanoparticles 1. It can be seen in FIG. 2, there are fillers 3 among nanoparticles 2, and nanoparticles 2 are connected by chemical bonds. Since the added zinc oxide has an effective inhibition on the current of the devices composed of ITO/NPB/MoOx/Al structure, it can be determined whether the ZnO nanoparticle thin film may detach during the soaking process by observing whether the current is increased. As shown in FIG. 3, the current of the crosslinked ZnO nanoparticle thin film is kept at a low value regardless of whether it is soaked in an alcohol solvent (e.g., ethanol), which indicates that ZnO nanoparticle thin film does not detach during soaking, which results in an apparent inhibitory effect on the current of the ITO/NPB/MoOx/A1 structure by ZnO. However, the current is significantly increased when the uncrosslinked ZnO nanoparticle thin film is soaked in an alcohol solvent (e.g., ethanol), which indicates that the uncrosslinked ZnO nanoparticle thin film detaches during soaking, so that the current of the responsive devices is significantly increased, very close to the current of the devices without adding ZnO nanoparticle thin film. Therefore, the crosslinked zinc oxide nanoparticle thin film obtained by crosslinking reactions does not dissolve or have any detachment after soaking in the original solvent (e.g., a solvent used for dispersing zinc oxide nanoparticles, usually, i.e., an alcohol solvent). On the contrary, the uncrosslinked nanoparticle thin film can easily detach after soaking.
  • The present disclosure also provides a thin film optoelectronic device, wherein, the thin film optoelectronic device includes a crosslinked nanoparticle thin film. Specifically, the thin film optoelectronic device is any one of: an electroluminescent device, a thin film photovoltaic device, a thin film light detector, and a thin film transistor.
  • As a specific embodiment of the optoelectronic thin film device, as shown in FIG. 4, an electroluminescent device includes sequentially: a first electrode 10, a hole injection layer 20, a hole transport layer 30, a light emitting layer 40, an electron transport layer 50, and the second electrode 60. The material of the electron transport layer 50 is a crosslinked nanoparticle thin film formed from crosslinking reactions.
  • In the electroluminescent device of the present embodiment, at least one of the first electrode and the second electrode has high light transmittance for a light band emitted by the light emitting layer. Specifically, the material for the first electrode is selected from one or more of: indium-doped tin oxide (ITO), fluorine-doped tin oxide (FTO), antimony doped tin oxide (ATO), aluminum-doped zinc oxide (AZO); preferably, the first electrode is an ITO electrode.
  • Further, in the present embodiment, the material for the hole transport layer 430 is selected from the materials or the materials with the chemical groups: poly[bis(4-phenyl)(4-butylphenyl)amine], 4-butyl-N,N-diphenylaniline homopolymer, aniline, 4-butyl-N,N-diphenyl, homopolymer (poly-TPD), poly(9,9-dioctylfluorene-CO-N-(4-butylphenyl)-diphenylamine) (TFB), poly(9-vinylcarbazole) (PVK), TPD, Spiro-TPD, LG101, HAT-CN, PEDOT: PSS, TAPC, a-NPB, m-MTDATA, NiOxO, MoOx, VOx, WOx and a mixture thereof; preferably, the hole transport layer 30 is a poly-TPD layer and has a thickness of 10 to 100 nm.
  • Further, in the present embodiment, the material for the quantum dot light-emitting layer includes but not limited to: nanocrystals of II-VI semiconductor, for example, CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, HgS, HgSe, HgTe, PbS, Pb Se, PbTe and other binary, ternary, or quaternary II-VI compounds; III-V semiconductor nanocrystals, for example, GaP, GaAs, InP, InAs or other binary, ternary, or quaternary III-V compounds. The quantum dot luminescent material for electroluminescence is not limited to II-V compounds, III-VI compounds, IV-VI compounds, I-III-IV compounds, II-IV-VI compound, or group IV elements.
  • Further, in the present embodiment, the material for the second electrode is selected from: Al, Ag, Cu, Mo, Au, or an alloy thereof; preferably, the material for the second electrode is Au. The second electrode has a thickness of 50 to 500 nm; preferably, the second electrode has a thickness of 100 to 200 nm.
  • As a specific embodiment of the thin film optoelectronic device, as shown in FIG. 5, the thin film photovoltaic device includes: a first electrode 10, a light absorbing layer 20, an electron extraction layer 30, and a second electrode 40. The material for the electron extraction layer 30 is a crosslinked nanoparticle thin film formed by crosslinking reactions in a nanoparticle thin film.
  • In the present embodiment of the thin film photovoltaic device, at least one of the first electrode and the second electrode has high sunlight transmittance. Specifically, the first electrode is selected from one or more of: indium-doped tin oxide (ITO), fluorine-doped tin oxide (FTO), antimony-doped tin oxide (ATO), and aluminum-doped zinc oxide (AZO); preferably, the material for the first electrode is ITO.
  • Further, according to the present embodiment, the light absorbing layer may be a semiconductor homojunction or a heterojunction. The material for the light absorbing layer is a light absorbing material in a solar spectrum, and may include: polymer photovoltaic material; organic small molecule photovoltaic material; halogen-containing perovskite photovoltaic material; chalcopyrite structural material (e.g., copper indium gallium selenide); II-VI compound material (e.g., thin films and nanocrystals); single crystal, polycrystalline, or amorphous silicon. If the light absorbing layer is a homojunction, the light absorbing layer includes a specific material of one material category from above; if the light absorbing layer is a heterojunction, the light absorbing layer includes two specific materials from one or two material categories from above.
  • Further, in the present embodiment, the material for the second electrode is selected from: Al, Ag, Cu, Mo, Au, or an alloy thereof; preferably, the material for the second electrode is Au. The second electrode has a thickness of 50 to 500 nm; preferably, the second electrode has a thickness of 100 to 200 nm.
  • As a specific embodiment of the thin film optoelectronic device, as shown in FIG. 6, the thin film light detector includes sequentially: an anode 4, an electron blocking layer 5, a light absorbing layer 6, a hole blocking layer 7, and a cathode 8. The material of the hole blocking layer 7 is a crosslinked nanoparticle thin film obtained by crosslinking reactions in a nanoparticle thin film.
  • According to the present embodiment of the thin film light detector, at least one of the anode and the cathode has high transmittance for the detection band.
  • Further, in the present embodiment, the material for the anode is selected one or more of indium-doped tin oxide (ITO), fluorine-doped tin oxide (FTO), antimony-doped tin oxide (ATO), and aluminum-doped zinc oxide (AZO); preferably, the material for the anode is ITO.
  • Further, in the present embodiment, the material for the electron blocking layer is selected from: poly(9,9-dioctylfluorene-CO-N-(4-butylphenyl)-diphenylamine) (TFB), polyvinylcarbazole (PVK), poly(N,N′ bis(4-butylphenyl)-N,N′-bis(phenyl)benzidine) (poly-TPD), poly(9,9-dioctylfluorene-co-bis-N,N-phenyl-1,4-phenylenediamine) (PFB), 4,4′, 4″-tris(carbazol-9-yl)-triphenylamine (TCTA), 4, 4′-bis(9-carbazole)-biphenyl (CBP), N,N′-diphenyl-N,N′-bis(3-methylphenyl)-1,1′-biphenyl-4, 4′-diamine (TPD), N,N′-diphenyl-N,N′-(1-naphthyl)-1,1′-biphenyl-4,4′-diamine (NPB), doped graphene, undoped graphene, C60, or a mixture thereof; preferably, the material for the electron blocking layer 5 is poly-TPD. The electron blocking layer 620 has a thickness of 10 to 100 nm.
  • Further, in the present embodiment, the material for the light absorbing layer is one or more of: a binary III-V compound (e.g., GaN, GaAs or InGaAs); a multinary III-V compound; a nanocrystal of a II-VI compound material, an organic semiconductor material; a halogen-containing perovskite material; a chalcopyrite structural material (e.g., copper indium gallium selenide); a single crystal, polycrystalline, or amorphous silicon. The light absorbing layer (photoelectron generating layer) may be a semiconductor homojunction or a semiconductor heterojunction. Specifically, in some embodiments, if the light absorbing layer is a homojunction, the material for the light absorbing layer is one specific material of a material category from above. Specifically, if the light absorbing layer is a heterojunction, the material for the light absorbing layer are two specific materials of one or two material category from above.
  • Further, in the present embodiment, the cathode material is selected from: Al, Ag, Cu, Mo, Au, or an alloy thereof; preferably, the cathode material is Au. The cathode has a thickness of 50 to 500 nm. In some embodiments, the cathode has a thickness of 100 to 200 nm; preferably, the thin film light detector is partially packaged, fully packaged, or unpackaged.
  • As a specific embodiment of the thin film optoelectronic device, as shown in FIG. 7a , the semiconductor layer material of the thin film transistor is a crosslinked nanoparticle thin film formed by crosslinking reactions in a nanoparticle thin film. The thin film transistor includes: a substrate 10, a source electrode 20 disposed on the substrate 10, a drain electrode 30, an insulating layer 40 disposed on the source electrode 20 and the drain electrode 30, a gate electrode 50 disposed on the insulating layer 40, and a semiconductor layer 60 disposed on the substrate 10. The source electrode 20 and the drain electrode 30 are separated by the semiconductor layer 60. Specifically, the semiconductor layer 60 has a thickness greater than a thickness of the source electrode or a thickness of the drain electrode (as shown in FIG. 7a ); the semiconductor layer 60 has a thickness consistent with the thickness of the source electrode 20 or the thickness of the drain electrode 30 (as shown in FIG. 7b ).
  • Further, as shown in FIG. 8, the thin film transistor may also be configured to include: a substrate, a gate electrode, an insulating layer and a semiconductor layer, which are sequentially stacked from bottom to top. The semiconductor layer is configured to include a source electrode and a drain electrode; the source electrode and the drain electrode are separated from each other.
  • Or, as shown in FIG. 9, the thin film transistor may be configured to include: a substrate, a gate electrode, an insulating layer and a semiconductor layer, which are sequentially stacked from bottom to top. The insulating layer is configured to include a source electrode and a drain electrode; the source electrode and the drain electrode are disposed in the interior of the semiconductor layer, and are separated by the semiconductor layer.
  • In the present embodiment of the thin film transistor, the material for the source electrode, the drain electrode, and the gate electrode may be a metal or a semiconductor having high conductivity. The material for the insulating layer may be a dielectric material, for example, an oxide, or a nitride.
  • In summary, the present disclosure provides a crosslinked nanoparticle thin film, a preparation method thereof and a thin film optoelectronic device. In the present disclosure, a gas mixture is introduced during the nanoparticle thin film formation, to promote crosslinking among the particles, which increases the electrical coupling between the particles, reduces the transport barrier of carriers, increases the carrier mobility, and accordingly, greatly improves the electrical performance. The application of the obtained crosslinked nanoparticle thin films in electroluminescent device prepared by solution methods, as electron transport layer, can apparently improve carrier balance, luminous efficiency and lifetime of the device. The application of the obtained crosslinked nanoparticle thin films in photovoltaic devices prepared by solution methods, as electron transport layer, can significantly reduce the linear resistance of the device, improve the parallel resistance, and improve the energy conversion efficiency of the device. The application of the obtained crosslinked nanoparticle thin films in thin film light detector prepared by solution methods, as electron extraction layer and hole blocking layer, can reduce the current and improve the detection rate. The application of the obtained crosslinked nanoparticle thin films in thin film transistor prepared by solution methods, can improve the carrier mobility of the semiconductor layer, increase the source-drain current, and increase the response frequency.
  • It is to be understood that the application of the present disclosure is not limited to the foregoing described examples, and those skilled in the art can make modifications and variations in accordance with the above descriptions, all of which are within the scope of the appended claims.

Claims (22)

1. A method for preparing crosslinked nanoparticle thin film,
comprising:
mixing nanoparticles with a solvent to form a mixture;
obtaining a nanoparticle solution by stirring the mixture to uniformly disperse the nanoparticles in the mixture;
preparing a nanoparticle thin film from the nanoparticle solution by a solution method; and
introducing a gas mixture into an environment having the nanoparticle thin film to obtain a crosslinked nanoparticle thin film, the gas mixture promoting the crosslinking reactions of the nanoparticles.
2. The method for preparing crosslinked nanoparticle thin film according to claim 1, wherein the gas mixture comprises a reduced gas, oxygen, water vapor and carbon dioxide.
3. The method for preparing crosslinked nanoparticle thin film according to claim 2, wherein a bias pressure for the reduced gas is between 1 and 100 Pa, a bias pressure for the oxygen is between 0 and 2×104 Pa, a bias pressure for the water vapor is between 0 and 2×103 Pa, and a bias pressure for the carbon dioxide is between 0 and 100 Pa.
4. The method for preparing crosslinked nanoparticle thin film according to claim 1, wherein the nanoparticle solution has a mass concentration of 1 to 100 mg/ml.
5. The method for preparing crosslinked nanoparticle thin film according to claim 1, wherein the nanoparticles are one or more of: oxide nanoparticles, sulfide nanoparticles, selenide nanoparticles, nitride nanoparticles, and fluoride nanoparticles.
6. The method for preparing crosslinked nanoparticle thin film according to claim 1, wherein an average diameter of the nanoparticles is within 5 nm.
7. The method for preparing crosslinked nanoparticle thin film according to claim 1, wherein the solvent is an alcohol solvent.
8-9. (canceled)
10. The method for preparing crosslinked nanoparticle thin film according to claim 2, wherein the reduced gas is one of: carbon monoxide, hydrogen, and ammonia.
11. The method for preparing crosslinked nanoparticle thin film according to claim 1, wherein the crosslinked nanoparticle film has a thickness of 15 to 60 nm.
12. (canceled)
13. A thin film optoelectronic device, comprising a crosslinked nanoparticle thin film prepared by the method according to claim 1.
14. The thin film optoelectronic device according to claim 13, wherein the thin film optoelectronic device is any one of: an electroluminescent device, a thin film photovoltaic, a thin film light detector, and a thin film transistor.
15. The thin film optoelectronic device according to claim 14, wherein the thin film optoelectronic device is an electroluminescent device, the electroluminescent device comprising: a first electrode, a hole injection layer, a hole transport layer, a light emitting layer, a second electrode and an electron transport layer formed by the crosslinked nanoparticle thin film.
16. The thin film optoelectronic device according to claim 14, wherein the thin film optoelectronic device is a photovoltaic device, the thin film photovoltaic device comprising: a first electrode, a light absorbing layer, a second electrode and an electron extraction layer formed by the crosslinked nanoparticle thin film.
17. The thin film optoelectronic device according to claim 14, wherein the thin film optoelectronic device is a light detector device, the light detector device comprising: an anode, an electron blocking layer, a cathode and a hole blocking layer formed by the crosslinked nanoparticle thin film.
18. The thin film optoelectronic device according to claim 14, wherein the thin film optoelectronic device is a thin film transistor, a semiconductor layer of the thin film transistor formed by the crosslinked nanoparticle thin film.
19. The method for preparing crosslinked nanoparticle thin film according to claim 1, wherein the nanoparticle thin film is prepared from the nanoparticle solution by a solution method in a closed environment or an inert atmosphere and the environment having the nanoparticle thin film is a closed environment.
20. The method for preparing crosslinked nanoparticle thin film according to claim 1, wherein the solution method is a chemical solution deposition for fabricating thin films,
wherein a solution is deposited on a substrate via spin coating, ink jet printing, spray coating, or blade coating.
21. The thin film electroluminescent device according to claim 15, wherein at least one of the first electrode and the second electrode has high light transmittance with respect to a light band emitted by the light emitting layer, and the second electrode is made from Al, Ag, Cu, Mo, Au or an alloy thereof.
22. A crosslinked nanoparticle thin film, comprising: nanoparticles, connected to each other via cross-links formed by chemical bonds, and fillers, in spaces among the nanoparticles,
wherein the formation of the cross-links of the nanoparticles is promoted by a gas mixture, the gas mixture being introduced into an environment having the thin film.
23. A thin film transistor, comprising:
a source electrode,
a drain electrode,
a gate electrode,
a semiconductor layer connected to the source electrode on a first side of the semiconductor layer and the drain electrode on a second side of the semiconductor layer,
an insulating layer connected to the gate electrode on a first side of the insulating layer and the semiconductor layer on a second side of the insulating layer, and
a substrate disposed on a bottom of the thin film transistor,
wherein the source electrode and the drain electrode are separated by the semiconductor layer.
US16/603,772 2017-04-11 2018-03-14 Crosslinked nanoparticle thin film, preparation method thereof, and thin film optoelectronic device having the same Abandoned US20200313089A1 (en)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
CN201710232650.2 2017-04-11
CN201710232910.6A CN108695405B (en) 2017-04-11 2017-04-11 thin film photovoltaic device and preparation method thereof
CN201710232917.8 2017-04-11
CN201710233270.0 2017-04-11
CN201710232650.2A CN108695376B (en) 2017-04-11 2017-04-11 A kind of thin film transistor (TFT) and preparation method thereof
CN201710233270.0A CN108695137B (en) 2017-04-11 2017-04-11 Cross-linked nano-particle film, preparation method thereof and film optoelectronic device
CN201710232910.6 2017-04-11
CN201710232916.3A CN108695413B (en) 2017-04-11 2017-04-11 A kind of electroluminescent device and preparation method thereof
CN201710232916.3 2017-04-11
CN201710232917.8A CN108695406B (en) 2017-04-11 2017-04-11 A kind of thin-film photodetector and preparation method thereof
PCT/CN2018/079025 WO2018188448A1 (en) 2017-04-11 2018-03-14 Crosslinked nanoparticle thin film and preparation method therefor, and thin film optoelectronic device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/079025 A-371-Of-International WO2018188448A1 (en) 2017-04-11 2018-03-14 Crosslinked nanoparticle thin film and preparation method therefor, and thin film optoelectronic device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US17/874,934 Division US11778891B2 (en) 2017-04-11 2022-07-27 Crosslinked nanoparticle thin film, preparation method thereof, and thin film optoelectronic device having the same

Publications (1)

Publication Number Publication Date
US20200313089A1 true US20200313089A1 (en) 2020-10-01

Family

ID=63793644

Family Applications (2)

Application Number Title Priority Date Filing Date
US16/603,772 Abandoned US20200313089A1 (en) 2017-04-11 2018-03-14 Crosslinked nanoparticle thin film, preparation method thereof, and thin film optoelectronic device having the same
US17/874,934 Active US11778891B2 (en) 2017-04-11 2022-07-27 Crosslinked nanoparticle thin film, preparation method thereof, and thin film optoelectronic device having the same

Family Applications After (1)

Application Number Title Priority Date Filing Date
US17/874,934 Active US11778891B2 (en) 2017-04-11 2022-07-27 Crosslinked nanoparticle thin film, preparation method thereof, and thin film optoelectronic device having the same

Country Status (5)

Country Link
US (2) US20200313089A1 (en)
EP (1) EP3611756A4 (en)
JP (1) JP7075476B2 (en)
KR (1) KR102260236B1 (en)
WO (1) WO2018188448A1 (en)

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005045188A (en) 2003-07-25 2005-02-17 Fuji Xerox Co Ltd Electronic element and integrated circuit, and manufacturing method therefor
KR101243917B1 (en) 2005-12-19 2013-03-14 삼성디스플레이 주식회사 A conducting polymer composition and an electrical device employing the layer obtained from the conducting polymer composition
JP4806320B2 (en) 2006-09-21 2011-11-02 株式会社神戸製鋼所 Substrate coating method and surface-coated substrate
JP5222486B2 (en) 2007-04-11 2013-06-26 株式会社アルバック Method for forming transparent conductive film
JP2010010175A (en) * 2008-06-24 2010-01-14 Konica Minolta Holdings Inc Thin film transistor, and method of manufacturing thin film transistor
US20100006837A1 (en) * 2008-07-09 2010-01-14 Electronics And Telecommunications Research Institute Composition for oxide semiconductor thin film, field effect transistor using the composition and method of fabricating the transistor
US20120153285A1 (en) 2009-09-05 2012-06-21 Merck Patent Gesellschaft Mit Beschrankter Haftung Solution processable passivation layers for organic electronic devices
EP2513952A1 (en) 2009-12-17 2012-10-24 Merck Patent GmbH Deposition of nanoparticles
KR101100959B1 (en) 2010-03-10 2011-12-29 삼성모바일디스플레이주식회사 Thin film transistor, method of manufacturing the same and display device having thin film transistor
US8536105B2 (en) 2010-06-08 2013-09-17 Innovation Services, Inc. Method of cleaning contaminated surfaces
CN103238221A (en) 2010-11-23 2013-08-07 佛罗里达大学研究基金会有限公司 IR photodetectors with high detectivity at low drive voltage
WO2012103528A2 (en) * 2011-01-28 2012-08-02 Northwestern University Low-temperature fabrication of metal oxide thin films and nanomaterial-derived metal composite thin films
JP2013062185A (en) 2011-09-14 2013-04-04 Ulvac Japan Ltd Transparent conductive film forming method
JP5900846B2 (en) 2011-11-18 2016-04-06 国立研究開発法人産業技術総合研究所 Nano ink applicator
AU2013315518B2 (en) * 2012-09-17 2017-11-09 Eastman Chemical Company Methods, materials and apparatus for improving control and efficiency of layer-by-layer processes
US9419174B2 (en) 2012-09-26 2016-08-16 University Of Florida Research Foundation, Inc. Transparent quantum dot light-emitting diodes with dielectric/metal/dielectric electrode
JP6534932B2 (en) * 2012-10-18 2019-06-26 テラ‐バリア フィルムズ プライベート リミテッド Encapsulated barrier stack
CN102909005B (en) * 2012-10-24 2014-02-05 中国科学院理化技术研究所 Graphene-based composite material with surface coated by mesoporous silica and loaded with noble metal nanoparticles, as well as preparation method and application of graphene-based composite material
CN102931289B (en) * 2012-11-28 2015-05-13 山东力诺太阳能电力股份有限公司 Preparation method of flower piece solar cell
WO2015031835A1 (en) * 2013-08-29 2015-03-05 University Of Florida Research Foundation, Inc. Air stable infrared photodetectors from solution-processed inorganic semiconductors
CN103681886B (en) * 2013-12-26 2017-09-22 中国科学院物理研究所 Shelf layer for perovskite-based thin film solar cell and preparation method thereof
JPWO2015190335A1 (en) 2014-06-11 2017-04-20 コニカミノルタ株式会社 Phototherapy device
JP6052326B2 (en) 2015-04-15 2016-12-27 コニカミノルタ株式会社 Organic electroluminescence element, display device and lighting device
EP3308113A4 (en) 2015-06-11 2019-03-20 University of Florida Research Foundation, Incorporated Monodisperse, ir-absorbing nanoparticles and related methods and devices
JP6074777B2 (en) 2015-07-06 2017-02-08 国立研究開発法人産業技術総合研究所 Nano ink applicator
CN108695413B (en) 2017-04-11 2019-11-12 Tcl集团股份有限公司 A kind of electroluminescent device and preparation method thereof

Also Published As

Publication number Publication date
US20220367812A1 (en) 2022-11-17
KR20190117778A (en) 2019-10-16
US11778891B2 (en) 2023-10-03
WO2018188448A1 (en) 2018-10-18
KR102260236B1 (en) 2021-06-03
JP2020516045A (en) 2020-05-28
EP3611756A4 (en) 2020-12-30
EP3611756A1 (en) 2020-02-19
JP7075476B2 (en) 2022-05-25

Similar Documents

Publication Publication Date Title
US11309138B2 (en) Contact passivation for perovskite optoelectronics
US8729528B2 (en) Quantum dot-fullerene junction optoelectronic devices
US20150263203A1 (en) Intermediate band semiconductors, heterojunctions, and optoelectronic devices utilizing solution processed quantum dots, and related methods
KR101916904B1 (en) Electronic device comprising interlayer with graphine quantum dot and method for fabricating the same
Voss et al. Hybrid LEDs based on ZnO nanowire structures
US9006931B2 (en) Static-electrical-field-enhanced semiconductor-based devices and methods of enhancing semiconductor-based device performance
CN108695413B (en) A kind of electroluminescent device and preparation method thereof
Ramar et al. Study of Schottky contact in binary and ternary hybrid CdSe quantum dot solar cells
CN110649168B (en) Quantum dot light-emitting diode and preparation method thereof
US11778891B2 (en) Crosslinked nanoparticle thin film, preparation method thereof, and thin film optoelectronic device having the same
US20120319083A1 (en) Nanorod semiconductor device having a contact structure, and method for manufacturing same
CN108695137B (en) Cross-linked nano-particle film, preparation method thereof and film optoelectronic device
CN113046077B (en) Composite material, quantum dot light-emitting diode and preparation method thereof
US20100101641A1 (en) Solar cell coating and method for manufacturing the same
CN108695406A (en) A kind of thin-film photodetector and preparation method thereof
CN112397660B (en) Nano material and preparation method and application thereof
CN112397673B (en) Quantum dot light-emitting diode and preparation method thereof
CN108695405B (en) thin film photovoltaic device and preparation method thereof
CN114267799A (en) Quantum dot light-emitting diode and preparation method thereof
CN115377300A (en) Electron transport material and preparation method thereof, and display device and preparation method thereof
CN117623369A (en) Symmetrical doping method of zinc-based oxide semiconductor nanocrystalline and application thereof
CN116615044A (en) Doped material, preparation method thereof, light emitting diode and display device
CN114497396A (en) Electronic functional layer, preparation method of electronic functional layer and photoelectric device
CN114695697A (en) Quantum dot light-emitting diode and preparation method thereof
CN113054143A (en) Nano material, preparation method thereof and quantum dot light-emitting diode

Legal Events

Date Code Title Description
AS Assignment

Owner name: TCL CORPORATION, CHINA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHEN, SONG;QIAN, LEI;YANG, YIXING;AND OTHERS;SIGNING DATES FROM 20160926 TO 20190927;REEL/FRAME:050657/0358

AS Assignment

Owner name: TCL TECHNOLOGY GROUP CORPORATION, CHINA

Free format text: CHANGE OF NAME;ASSIGNOR:TCL CORPORATION;REEL/FRAME:052494/0661

Effective date: 20200205

STPP Information on status: patent application and granting procedure in general

Free format text: APPLICATION DISPATCHED FROM PREEXAM, NOT YET DOCKETED

STPP Information on status: patent application and granting procedure in general

Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION