JP2016500477A5 - - Google Patents

Download PDF

Info

Publication number
JP2016500477A5
JP2016500477A5 JP2015546522A JP2015546522A JP2016500477A5 JP 2016500477 A5 JP2016500477 A5 JP 2016500477A5 JP 2015546522 A JP2015546522 A JP 2015546522A JP 2015546522 A JP2015546522 A JP 2015546522A JP 2016500477 A5 JP2016500477 A5 JP 2016500477A5
Authority
JP
Japan
Prior art keywords
mold
shield
circuit board
stencil
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015546522A
Other languages
English (en)
Japanese (ja)
Other versions
JP6373862B2 (ja
JP2016500477A (ja
Filing date
Publication date
Priority claimed from US14/038,633 external-priority patent/US10091918B2/en
Application filed filed Critical
Publication of JP2016500477A publication Critical patent/JP2016500477A/ja
Publication of JP2016500477A5 publication Critical patent/JP2016500477A5/ja
Application granted granted Critical
Publication of JP6373862B2 publication Critical patent/JP6373862B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2015546522A 2012-12-11 2013-11-29 コンフォーマルシールドのための方法および装置 Expired - Fee Related JP6373862B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261735699P 2012-12-11 2012-12-11
US61/735,699 2012-12-11
US14/038,633 2013-09-26
US14/038,633 US10091918B2 (en) 2012-12-11 2013-09-26 Methods and apparatus for conformal shielding
PCT/US2013/072478 WO2014093035A1 (en) 2012-12-11 2013-11-29 Methods and apparatus for conformal shielding

Publications (3)

Publication Number Publication Date
JP2016500477A JP2016500477A (ja) 2016-01-12
JP2016500477A5 true JP2016500477A5 (https=) 2016-12-22
JP6373862B2 JP6373862B2 (ja) 2018-08-15

Family

ID=50880758

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015546522A Expired - Fee Related JP6373862B2 (ja) 2012-12-11 2013-11-29 コンフォーマルシールドのための方法および装置

Country Status (6)

Country Link
US (1) US10091918B2 (https=)
EP (1) EP2932815B1 (https=)
JP (1) JP6373862B2 (https=)
KR (1) KR20150094669A (https=)
CN (1) CN104838737B (https=)
WO (1) WO2014093035A1 (https=)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9179530B2 (en) * 2010-07-02 2015-11-03 Thomson Licensing System for grounding in an electronic device
US9131037B2 (en) * 2012-10-18 2015-09-08 Apple Inc. Electronic device with conductive fabric shield wall
KR20160093403A (ko) * 2015-01-29 2016-08-08 엘지이노텍 주식회사 전자파차폐구조물
WO2016144039A1 (en) 2015-03-06 2016-09-15 Samsung Electronics Co., Ltd. Circuit element package, manufacturing method thereof, and manufacturing apparatus thereof
KR102377472B1 (ko) * 2015-03-10 2022-03-23 삼성전자주식회사 반도체 패키지 및 그 제조방법
WO2016181954A1 (ja) * 2015-05-11 2016-11-17 株式会社村田製作所 高周波モジュール
JP6414637B2 (ja) * 2015-06-04 2018-10-31 株式会社村田製作所 高周波モジュール
US20170176520A1 (en) * 2015-12-17 2017-06-22 Qualcomm Incorporated Tunable wavelength electro-optical analyzer
KR102615926B1 (ko) * 2016-04-08 2023-12-21 삼성전자주식회사 차폐 댐 조형용 노즐, 이를 이용하는 전자파 차폐구조 및 전자파 차폐구조의 제조방법
US10624248B2 (en) * 2016-04-08 2020-04-14 Samsung Electronics Co., Ltd. EMI shielding structure and manufacturing method therefor
US9999121B2 (en) * 2016-04-25 2018-06-12 Laird Technologies, Inc. Board level shields with virtual grounding capability
US10477737B2 (en) 2016-05-04 2019-11-12 Samsung Electronics Co., Ltd. Manufacturing method of a hollow shielding structure for circuit elements
US10477687B2 (en) 2016-08-04 2019-11-12 Samsung Electronics Co., Ltd. Manufacturing method for EMI shielding structure
KR102551657B1 (ko) * 2016-12-12 2023-07-06 삼성전자주식회사 전자파 차폐구조 및 그 제조방법
US11032454B2 (en) 2017-01-11 2021-06-08 Ningbo Sunny Opotech Co., Ltd. Circuit board, molded photosensitive assembly and manufacturing method therefor, photographing module, and electronic device
KR102324693B1 (ko) * 2017-03-06 2021-11-10 삼성전자주식회사 전자파 차폐구조 및 그 제조방법
US10418332B2 (en) * 2017-03-13 2019-09-17 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming partition fence and shielding layer around semiconductor components
US10490511B2 (en) 2017-06-01 2019-11-26 Mediatek Inc. Microelectronic assembly with electromagnetic shielding
US10594020B2 (en) 2017-07-19 2020-03-17 Samsung Electronics Co., Ltd. Electronic device having antenna element and method for manufacturing the same
KR102442623B1 (ko) * 2017-08-08 2022-09-13 삼성전자주식회사 반도체 패키지
KR102373931B1 (ko) 2017-09-08 2022-03-14 삼성전자주식회사 전자파 차폐구조
JP7111112B2 (ja) * 2018-01-05 2022-08-02 株式会社村田製作所 高周波モジュール
KR102531817B1 (ko) * 2018-03-28 2023-05-12 한미반도체 주식회사 반도체 자재의 부분 차폐방법
USD877732S1 (en) 2018-05-31 2020-03-10 Sensus Spectrum, Llc Potting cup
US10694617B2 (en) * 2018-07-31 2020-06-23 Sensus Spectrum, Llc Plastic injection molded potting cups and related methods
US10923435B2 (en) 2018-11-28 2021-02-16 Shiann-Tsong Tsai Semiconductor package with in-package compartmental shielding and improved heat-dissipation performance
TWI744572B (zh) 2018-11-28 2021-11-01 蔡憲聰 具有封裝內隔室屏蔽的半導體封裝及其製作方法
US11211340B2 (en) 2018-11-28 2021-12-28 Shiann-Tsong Tsai Semiconductor package with in-package compartmental shielding and active electro-magnetic compatibility shielding
US10896880B2 (en) 2018-11-28 2021-01-19 Shiann-Tsong Tsai Semiconductor package with in-package compartmental shielding and fabrication method thereof
TWI728604B (zh) * 2019-01-01 2021-05-21 蔡憲聰 具有封裝內隔室屏蔽及主動電磁相容屏蔽的半導體封裝及其製作方法
WO2020263018A1 (ko) * 2019-06-28 2020-12-30 주식회사 아모센스 전자 소자 어셈블리 패키지, 전자 소자 모듈용 회로 기판 및 이의 제조 방법
KR102796767B1 (ko) * 2019-07-10 2025-04-16 삼성전자주식회사 인터포저를 포함하는 전자 장치
FR3098646B1 (fr) 2019-07-11 2022-03-25 Thales Sa Composant electronique resistant a l'humidite et procede de realisation d'un tel composant
US11089673B2 (en) * 2019-07-19 2021-08-10 Raytheon Company Wall for isolation enhancement
US10925196B1 (en) * 2019-08-09 2021-02-16 Microsoft Technology Licensing, Llc Dimensionally-constrained device faraday cage
CN110676233B (zh) * 2019-09-10 2021-09-24 深圳第三代半导体研究院 一种压接式功率开关模块及其制备方法
US11515174B2 (en) * 2019-11-12 2022-11-29 Micron Technology, Inc. Semiconductor devices with package-level compartmental shielding and associated systems and methods
DE102020107131B4 (de) 2020-03-16 2024-01-11 Bayerische Motoren Werke Aktiengesellschaft Leistungselektronikeinheit und Kraftfahrzeug
CN114375111B (zh) * 2020-10-14 2023-06-02 华为技术有限公司 一种封装模块、封装方法及电子设备
JP7805739B2 (ja) * 2021-09-30 2026-01-26 芝浦メカトロニクス株式会社 成膜方法、樹脂層形成装置、成膜装置及び電磁波シールド付回路基板
CN114429911A (zh) * 2021-12-31 2022-05-03 青岛歌尔微电子研究院有限公司 一种模具以及电磁屏蔽封装方法
CN115023027B (zh) * 2022-05-07 2024-11-29 武汉芯宝科技有限公司 高压脉冲能量全吸收电路板及其制作方法
CN118102689B (zh) * 2024-01-23 2024-11-22 湖南协德科技有限公司 一种电磁屏蔽波导窗及其制造方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5153379A (en) 1990-10-09 1992-10-06 Motorola, Inc. Shielded low-profile electronic component assembly
US5354951A (en) * 1993-03-15 1994-10-11 Leader Tech, Inc. Circuit board component shielding enclosure and assembly
US5566052A (en) * 1995-06-08 1996-10-15 Northern Telecom Limited Electronic devices with electromagnetic radiation interference shields and heat sinks
US6121546A (en) * 1998-04-20 2000-09-19 Lucent Technologies Inc. RF shield
JP2003069196A (ja) 2001-08-30 2003-03-07 Rohm Co Ltd 実装基板に実装した電子部品の合成樹脂コーティング
US7005323B2 (en) 2001-09-27 2006-02-28 Rfstream Corporation Method and apparatus for shielding integrated circuits
US7005573B2 (en) 2003-02-13 2006-02-28 Parker-Hannifin Corporation Composite EMI shield
US7659604B2 (en) * 2004-03-30 2010-02-09 Panasonic Corporation Module component and method for manufacturing the same
KR100691629B1 (ko) 2006-04-21 2007-03-12 삼성전기주식회사 금속벽을 이용한 고주파 모듈 및 그 제조 방법
DE102007035181B4 (de) 2007-07-27 2011-11-10 Epcos Ag Verfahren zur Herstellung eines Moduls und Modul
US7971350B2 (en) 2007-08-01 2011-07-05 Flextronics Ap, Llc Method of providing a RF shield of an electronic device
US7772505B2 (en) * 2008-02-22 2010-08-10 Laird Technologies, Inc. Electromagnetic interference (EMI) shielding apparatus and related methods
US20100157566A1 (en) 2008-12-19 2010-06-24 Robert Bogursky Electronic shield assembly and methods
US9072204B2 (en) 2009-07-17 2015-06-30 Panasonic Intellectual Property Management Co., Ltd. Electronic module and production method therefor
US7876579B1 (en) * 2009-09-23 2011-01-25 Ezconn Corporation Anti-electromagnetic interference corner shield unit for a shielding device
US8199518B1 (en) * 2010-02-18 2012-06-12 Amkor Technology, Inc. Top feature package and method
US8105872B2 (en) 2010-06-02 2012-01-31 Stats Chippac, Ltd. Semiconductor device and method of forming prefabricated EMI shielding frame with cavities containing penetrable material over semiconductor die
US8279624B2 (en) * 2010-06-03 2012-10-02 Laird Technologies, Inc. Board level electromagnetic interference (EMI) shields with through hole latching mechanisms
JP2012019091A (ja) 2010-07-08 2012-01-26 Sony Corp モジュールおよび携帯端末
JP5861260B2 (ja) 2011-03-10 2016-02-16 日本電気株式会社 半導体装置の製造方法及び半導体装置
JP5686021B2 (ja) 2011-03-30 2015-03-18 株式会社村田製作所 電子部品の製造方法および電子部品

Similar Documents

Publication Publication Date Title
JP2016500477A5 (https=)
JP6373862B2 (ja) コンフォーマルシールドのための方法および装置
JP2015109449A5 (https=)
CN104425461B (zh) 电路模块
KR101153570B1 (ko) 반도체 패키지 모듈
CN204408625U (zh) Mems麦克风
JP2009016715A5 (https=)
JP2010519780A5 (https=)
JP2016091812A5 (https=)
JPWO2021193622A5 (https=)
EP3334258A1 (en) Circuit board device
US9743507B2 (en) Radio frequency module
CN105555018A (zh) 一种印刷电路板及电子终端
JP2015053412A5 (https=)
US20160091991A1 (en) Electronic Devices With Molded Insulator and Via Structures
TW200744441A (en) Electromagnetic shielding device and method of fabricating the same
CN203658957U (zh) 一种低辐射鼠标
CN203072308U (zh) 一种屏蔽罩支架结构
JP2006286915A (ja) 回路モジュール
EP2086296A3 (en) Printed circuit board and method of manufacturing the same
CN104411108B (zh) 阻焊油墨线路板的制作方法
CN204090284U (zh) 导电碳油印制线路板
CN204377134U (zh) Mems麦克风
KR101288211B1 (ko) 전자 부품 모듈의 제조 방법
JP2018064060A5 (https=)