JP2016221620A - 防水パン - Google Patents
防水パン Download PDFInfo
- Publication number
- JP2016221620A JP2016221620A JP2015109801A JP2015109801A JP2016221620A JP 2016221620 A JP2016221620 A JP 2016221620A JP 2015109801 A JP2015109801 A JP 2015109801A JP 2015109801 A JP2015109801 A JP 2015109801A JP 2016221620 A JP2016221620 A JP 2016221620A
- Authority
- JP
- Japan
- Prior art keywords
- waterproof pan
- waterproof
- side wall
- waterproof sheet
- floor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000002093 peripheral effect Effects 0.000 claims description 24
- 238000009434 installation Methods 0.000 abstract description 5
- 238000010276 construction Methods 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 22
- 238000005520 cutting process Methods 0.000 description 21
- 239000004065 semiconductor Substances 0.000 description 17
- 238000004140 cleaning Methods 0.000 description 5
- 238000000227 grinding Methods 0.000 description 4
- 238000004078 waterproofing Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920002943 EPDM rubber Polymers 0.000 description 1
- 229920002430 Fibre-reinforced plastic Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 235000008429 bread Nutrition 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- 239000011151 fibre-reinforced plastic Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16M—FRAMES, CASINGS OR BEDS OF ENGINES, MACHINES OR APPARATUS, NOT SPECIFIC TO ENGINES, MACHINES OR APPARATUS PROVIDED FOR ELSEWHERE; STANDS; SUPPORTS
- F16M1/00—Frames or casings of engines, machines or apparatus; Frames serving as machinery beds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Abstract
Description
11:カセット
12:搬出入手段
13:第1の搬送手段
14:洗浄領域
15:スピンナーテーブル
16:チャックテーブル
17:回転ブレード
18:第2の搬送手段
30、40:防水パン
31:防水シート
32:枠体
33:固定部材
41:コーナー部材(枠体)
42:直線部材(枠体)
Claims (3)
- 床に設置される装置の下面に配設され、当該装置からの漏液を受け止める防水パンであって、床に敷設される柔軟性を有する防水シートと、該防水シートの外周を折り曲げ立ち上げた外周側壁を支持する剛性を有する複数の枠体と、該枠体の上辺部と立ち上げた該外周側壁の上部とを固定する固定部材と、から少なくとも構成される防水パン。
- 前記複数の枠体の各々は直接連結されず、前記防水シートおよび固定部材のうち少なくともいずれかを介して連結される、請求項1に記載の防水パン。
- 前記枠体は、前記防水シート上面に配設される床部と、前記外周側壁に沿って延在し、該外周側壁を支持する側壁部と、から構成される請求項1又は2に記載された防水パン。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015109801A JP6566729B2 (ja) | 2015-05-29 | 2015-05-29 | 防水パン |
TW105111682A TWI670144B (zh) | 2015-05-29 | 2016-04-14 | 防水盤 |
CN201610312332.2A CN106206364B (zh) | 2015-05-29 | 2016-05-12 | 防水盘 |
KR1020160060702A KR102449023B1 (ko) | 2015-05-29 | 2016-05-18 | 방수팬 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015109801A JP6566729B2 (ja) | 2015-05-29 | 2015-05-29 | 防水パン |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016221620A true JP2016221620A (ja) | 2016-12-28 |
JP6566729B2 JP6566729B2 (ja) | 2019-08-28 |
Family
ID=57453325
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015109801A Active JP6566729B2 (ja) | 2015-05-29 | 2015-05-29 | 防水パン |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6566729B2 (ja) |
KR (1) | KR102449023B1 (ja) |
CN (1) | CN106206364B (ja) |
TW (1) | TWI670144B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20200238570A1 (en) * | 2019-01-30 | 2020-07-30 | Disco Corporation | Processing apparatus |
Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4948214U (ja) * | 1972-07-31 | 1974-04-26 | ||
JPS517714U (ja) * | 1974-07-03 | 1976-01-20 | ||
JPS52116816U (ja) * | 1976-03-02 | 1977-09-05 | ||
JPS54177136U (ja) * | 1978-06-05 | 1979-12-14 | ||
JPS59199457A (ja) * | 1983-04-11 | 1984-11-12 | 株式会社日立製作所 | 電子機器用防水シ−ト |
JPH05318663A (ja) * | 1992-05-19 | 1993-12-03 | Mitsui Toatsu Chem Inc | 床用シートの製造法及び床の施工法 |
JPH08309089A (ja) * | 1995-05-17 | 1996-11-26 | Mayumi Morimoto | 洗濯機トレー |
JPH09131834A (ja) * | 1995-11-09 | 1997-05-20 | Mitsui Toatsu Chem Inc | ウレタンマット及びそれを用いた施工方法 |
JP3051144U (ja) * | 1998-02-03 | 1998-08-11 | 羽立化工株式会社 | 折畳み介護入浴浴槽 |
JPH10289345A (ja) * | 1997-04-11 | 1998-10-27 | Oki Electric Ind Co Ltd | 現金自動取引装置の浸水防止機構 |
JPH11127685A (ja) * | 1997-10-31 | 1999-05-18 | Tsutsunaka Sheet Bosui Kk | 屋上緑化用仕切構造 |
JPH11277048A (ja) * | 1998-03-31 | 1999-10-12 | Japan Organo Co Ltd | 水処理装置用水飛散防止ケース、水処理装置用水飛散防止装置及びキャビネット型水処理装置 |
JP2000199265A (ja) * | 1999-01-05 | 2000-07-18 | Daiwa Danchi Kk | ガ―デン用区画防水構造及びガ―デン構造 |
JP2003129616A (ja) * | 2001-07-31 | 2003-05-08 | Asahi Glass Polyurethane Material Co Ltd | 防水工法およびそれに用いるポリウレタン樹脂製マット |
JP2003180538A (ja) * | 2001-12-13 | 2003-07-02 | Ginraku Kogyo Kk | 折り畳み式防水シート水槽とfrpまたはポリプロピレン製等の化学樹脂からなる分割された側壁を組み合わせた簡易型の多目的水槽。 |
JP2009185481A (ja) * | 2008-02-05 | 2009-08-20 | Noritz Corp | 浴室ユニット |
JP2013162039A (ja) * | 2012-02-07 | 2013-08-19 | Disco Abrasive Syst Ltd | 浸水防止方法および浸水防止具 |
KR200485083Y1 (ko) * | 2016-08-23 | 2017-11-27 | 신은호 | 층간소음방지를 위한 바닥의 구조 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0824790B2 (ja) * | 1988-02-17 | 1996-03-13 | 松下電器産業株式会社 | 洗濯機用防水パン |
JP3051144B2 (ja) | 1990-08-09 | 2000-06-12 | 松下電送システム株式会社 | 中間調画像処理装置 |
JP3993219B1 (ja) * | 2006-03-30 | 2007-10-17 | 株式会社 ナンワ | 簡易浴槽用シート及びそのシートを用いた簡易浴槽 |
CN202963011U (zh) * | 2012-12-07 | 2013-06-05 | 李永诗 | 一种空调清洗专用防护罩 |
CN203266427U (zh) * | 2013-06-22 | 2013-11-06 | 宇骏(潍坊)新能源科技有限公司 | 硅片抛光机冷凝水盛接托盘 |
-
2015
- 2015-05-29 JP JP2015109801A patent/JP6566729B2/ja active Active
-
2016
- 2016-04-14 TW TW105111682A patent/TWI670144B/zh active
- 2016-05-12 CN CN201610312332.2A patent/CN106206364B/zh active Active
- 2016-05-18 KR KR1020160060702A patent/KR102449023B1/ko active IP Right Grant
Patent Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4948214U (ja) * | 1972-07-31 | 1974-04-26 | ||
JPS517714U (ja) * | 1974-07-03 | 1976-01-20 | ||
JPS52116816U (ja) * | 1976-03-02 | 1977-09-05 | ||
JPS54177136U (ja) * | 1978-06-05 | 1979-12-14 | ||
JPS59199457A (ja) * | 1983-04-11 | 1984-11-12 | 株式会社日立製作所 | 電子機器用防水シ−ト |
JPH05318663A (ja) * | 1992-05-19 | 1993-12-03 | Mitsui Toatsu Chem Inc | 床用シートの製造法及び床の施工法 |
JPH08309089A (ja) * | 1995-05-17 | 1996-11-26 | Mayumi Morimoto | 洗濯機トレー |
JPH09131834A (ja) * | 1995-11-09 | 1997-05-20 | Mitsui Toatsu Chem Inc | ウレタンマット及びそれを用いた施工方法 |
JPH10289345A (ja) * | 1997-04-11 | 1998-10-27 | Oki Electric Ind Co Ltd | 現金自動取引装置の浸水防止機構 |
JPH11127685A (ja) * | 1997-10-31 | 1999-05-18 | Tsutsunaka Sheet Bosui Kk | 屋上緑化用仕切構造 |
JP3051144U (ja) * | 1998-02-03 | 1998-08-11 | 羽立化工株式会社 | 折畳み介護入浴浴槽 |
JPH11277048A (ja) * | 1998-03-31 | 1999-10-12 | Japan Organo Co Ltd | 水処理装置用水飛散防止ケース、水処理装置用水飛散防止装置及びキャビネット型水処理装置 |
JP2000199265A (ja) * | 1999-01-05 | 2000-07-18 | Daiwa Danchi Kk | ガ―デン用区画防水構造及びガ―デン構造 |
JP2003129616A (ja) * | 2001-07-31 | 2003-05-08 | Asahi Glass Polyurethane Material Co Ltd | 防水工法およびそれに用いるポリウレタン樹脂製マット |
JP2003180538A (ja) * | 2001-12-13 | 2003-07-02 | Ginraku Kogyo Kk | 折り畳み式防水シート水槽とfrpまたはポリプロピレン製等の化学樹脂からなる分割された側壁を組み合わせた簡易型の多目的水槽。 |
JP2009185481A (ja) * | 2008-02-05 | 2009-08-20 | Noritz Corp | 浴室ユニット |
JP2013162039A (ja) * | 2012-02-07 | 2013-08-19 | Disco Abrasive Syst Ltd | 浸水防止方法および浸水防止具 |
KR200485083Y1 (ko) * | 2016-08-23 | 2017-11-27 | 신은호 | 층간소음방지를 위한 바닥의 구조 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20200238570A1 (en) * | 2019-01-30 | 2020-07-30 | Disco Corporation | Processing apparatus |
KR20200094634A (ko) | 2019-01-30 | 2020-08-07 | 가부시기가이샤 디스코 | 가공 장치 |
US11691313B2 (en) | 2019-01-30 | 2023-07-04 | Disco Corporation | Processing apparatus including a water collection pan |
Also Published As
Publication number | Publication date |
---|---|
CN106206364A (zh) | 2016-12-07 |
KR102449023B1 (ko) | 2022-09-28 |
TW201707859A (zh) | 2017-03-01 |
TWI670144B (zh) | 2019-09-01 |
JP6566729B2 (ja) | 2019-08-28 |
CN106206364B (zh) | 2021-06-18 |
KR20160140392A (ko) | 2016-12-07 |
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