JP2016201532A - 回路基板 - Google Patents
回路基板 Download PDFInfo
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- JP2016201532A JP2016201532A JP2016018930A JP2016018930A JP2016201532A JP 2016201532 A JP2016201532 A JP 2016201532A JP 2016018930 A JP2016018930 A JP 2016018930A JP 2016018930 A JP2016018930 A JP 2016018930A JP 2016201532 A JP2016201532 A JP 2016201532A
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- 230000000149 penetrating effect Effects 0.000 claims abstract description 7
- 239000004020 conductor Substances 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims description 77
- 229910052751 metal Inorganic materials 0.000 claims description 77
- 230000008878 coupling Effects 0.000 claims description 20
- 238000010168 coupling process Methods 0.000 claims description 20
- 238000005859 coupling reaction Methods 0.000 claims description 20
- 239000011810 insulating material Substances 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 claims 1
- 230000001965 increasing effect Effects 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 46
- 239000012792 core layer Substances 0.000 description 17
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 16
- 239000000758 substrate Substances 0.000 description 16
- 229910000679 solder Inorganic materials 0.000 description 13
- 238000000034 method Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- 230000008569 process Effects 0.000 description 11
- 229910002804 graphite Inorganic materials 0.000 description 10
- 239000010439 graphite Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 7
- 230000009467 reduction Effects 0.000 description 7
- 230000008054 signal transmission Effects 0.000 description 7
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 239000003990 capacitor Substances 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000009413 insulation Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 229910021389 graphene Inorganic materials 0.000 description 5
- 239000007769 metal material Substances 0.000 description 5
- 229910000077 silane Inorganic materials 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 3
- 229910001374 Invar Inorganic materials 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- ZDDUSDYMEXVQNJ-UHFFFAOYSA-N 1H-imidazole silane Chemical compound [SiH4].N1C=NC=C1 ZDDUSDYMEXVQNJ-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 102100039856 Histone H1.1 Human genes 0.000 description 1
- 102100039855 Histone H1.2 Human genes 0.000 description 1
- 101001035402 Homo sapiens Histone H1.1 Proteins 0.000 description 1
- 101001035375 Homo sapiens Histone H1.2 Proteins 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 239000002335 surface treatment layer Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
- H05K3/4608—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated comprising an electrically conductive base or core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Structure Of Printed Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
110 第1熱伝達用構造体
TH 機能孔
111 プライマー層
120 絶縁部
121 第1上部絶縁層
121' 第1下部絶縁層
122 第2上部絶縁層
122' 第2下部絶縁層
131 第1金属パターン
133 第3金属パターン
134 第7金属パターン
141 第2金属パターン
142 第4金属パターン
143 第5金属パターン
144 第6金属パターン
S ソルダ
200 第2電子部品
V1 第1ビア
V2 第2ビア
V4 第4ビア
V5 第5ビア
V6 第6ビア
V7 第7ビア
V8 第8 ビア
10 コア部
11 第1コア層
12 第2コア層
13 第3コア層
P1 第1回路パターン
P2 第2回路パターン
TV スルービア
500 第1電子部品
800 付加基板
810 接続パッド
L1 第3熱伝達用構造体
L2 放熱部
C1 第1キャビティ
C2 第2キャビティ
Claims (13)
- 上面と下面とを含む柱形状を有し、熱伝導性物質で形成され、前記上面から前記下面まで貫通する機能孔が備えられた熱伝達用構造体が絶縁部に挿入された回路基板。
- 前記機能孔に絶縁物質が充填された請求項1に記載の回路基板。
- 前記機能孔に充填された絶縁物質は、前記絶縁部と一体になるように形成される請求項2に記載の回路基板。
- 前記熱伝達用構造体の上面に一面が接触する第1ビアと、
前記第1ビアの他面に接触する第1金属パターンと、
前記第1金属パターンに接続する第1結合部材と、をさらに含む請求項3に記載の回路基板。 - 前記第1結合部材は、第1電子部品に接続可能に設けられ、
前記第1電子部品は、第1領域と、動作の際に前記第1領域よりも温度が高くなる第2領域とを含む請求項4に記載の回路基板。 - 前記熱伝達用構造体の少なくとも一部が前記第1電子部品の垂直下方に位置するように形成される請求項5に記載の回路基板。
- 前記熱伝達用構造体の下面に一面が接触する第2ビアと、
前記第2ビアの他面に接触する第2金属パターンと、
前記第2金属パターンに接続する第2結合部材と、をさらに含み、
前記熱伝達用構造体の熱が前記第2ビア及び前記第2金属パターンを経由して前記第2結合部材に移動する請求項6に記載の回路基板。 - 前記熱伝達用構造体の表面には、
前記熱伝達用構造体と前記絶縁部とが密着するように、プライマー層が備えられる請求項1から7のいずれか一項に記載の回路基板。 - 複数の絶縁層と、前記複数の絶縁層に形成される複数の金属層と、前記複数の絶縁層のうちの少なくとも一つの絶縁層を貫通し、前記複数の金属層のうちの少なくとも二つの金属層を接続させる複数のビアと、を含み、
第1領域と、動作の際に前記第1領域よりも温度が高くなる第2領域とを含む第1電子部品に接続可能な複数のパッドが最外層の表面の金属層に形成された回路基板において、
キャビティが備えられたコア部と、
前記キャビティに少なくとも一部が挿入され、熱伝導性物質で形成された熱伝達用構造体と、
前記熱伝達用構造体及び前記コア部を覆う絶縁層と、を含み、
前記熱伝達用構造体は、上面と下面とを含む柱形状を有し、前記上面から前記下面まで貫通する機能孔が備えられ、前記絶縁層を形成する物質が前記機能孔に充填される、回路基板。 - 前記熱伝達用構造体の上面に一面が接触する第1ビアと、
前記第1ビアの他面に接触する第1金属パターンと、
前記第1金属パターンに接続する第1結合部材と、をさらに含み、
前記第1結合部材は、前記第1電子部品に接続可能に設けられる請求項9に記載の回路基板。 - 前記熱伝達用構造体の下面に一面が接触する第2ビアと、
前記第2ビアの他面に接触する第2金属パターンと、
前記第2金属パターンに接続する第2結合部材と、をさらに含み、
前記第1電子部品の熱が前記第1結合部材、前記第1金属パターン、前記第1ビア、前記熱伝達用構造体、第2ビア及び前記第2金属パターンを経由して前記第2結合部材に移動する請求項10に記載の回路基板。 - 前記第2領域から前記第1結合部材までの距離が、前記第1領域から前記第1結合部材までの距離よりも小さい請求項11に記載の回路基板。
- 前記複数のパッドには熱が通過する第1パッド及び電気信号が通過する第2パッドが含まれ、前記第1結合部材は、前記第1パッドに接続可能に形成され、前記第2パッドに接続する導体は、前記熱伝達用構造体に接続しない請求項12に記載の回路基板。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2015-0049568 | 2015-04-08 | ||
KR1020150049568A KR102411999B1 (ko) | 2015-04-08 | 2015-04-08 | 회로기판 |
Publications (2)
Publication Number | Publication Date |
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JP2016201532A true JP2016201532A (ja) | 2016-12-01 |
JP6957801B2 JP6957801B2 (ja) | 2021-11-02 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2016018930A Active JP6957801B2 (ja) | 2015-04-08 | 2016-02-03 | 回路基板 |
Country Status (3)
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US (1) | US9832856B2 (ja) |
JP (1) | JP6957801B2 (ja) |
KR (1) | KR102411999B1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020174115A (ja) * | 2019-04-10 | 2020-10-22 | 株式会社フジクラ | 多層回路基板 |
WO2020250815A1 (ja) * | 2019-06-14 | 2020-12-17 | Tdk株式会社 | 電子部品内蔵基板及びこれを用いた回路モジュール |
WO2022004280A1 (ja) * | 2020-07-02 | 2022-01-06 | 株式会社村田製作所 | 多層回路基板および電子部品実装多層基板 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102295105B1 (ko) * | 2014-12-29 | 2021-08-31 | 삼성전기주식회사 | 회로기판 및 회로기판 제조방법 |
TWI579987B (zh) * | 2015-12-22 | 2017-04-21 | 財團法人工業技術研究院 | 散熱模組 |
JP6771308B2 (ja) * | 2016-05-02 | 2020-10-21 | 三菱電機株式会社 | 回路基板および半導体集積回路の実装構造 |
KR20200098179A (ko) * | 2019-02-12 | 2020-08-20 | 엘지이노텍 주식회사 | 회로기판 |
KR20210135107A (ko) | 2020-05-04 | 2021-11-12 | 삼성전자주식회사 | 반도체 패키지 |
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US9832856B2 (en) | 2017-11-28 |
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US20160302298A1 (en) | 2016-10-13 |
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