JP2016175065A - スリットノズル - Google Patents
スリットノズル Download PDFInfo
- Publication number
- JP2016175065A JP2016175065A JP2016023204A JP2016023204A JP2016175065A JP 2016175065 A JP2016175065 A JP 2016175065A JP 2016023204 A JP2016023204 A JP 2016023204A JP 2016023204 A JP2016023204 A JP 2016023204A JP 2016175065 A JP2016175065 A JP 2016175065A
- Authority
- JP
- Japan
- Prior art keywords
- slit nozzle
- distribution chamber
- chamber
- nozzle according
- discharge port
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007788 liquid Substances 0.000 claims abstract description 84
- 238000009826 distribution Methods 0.000 claims abstract description 52
- 230000009467 reduction Effects 0.000 claims abstract description 15
- 238000011144 upstream manufacturing Methods 0.000 claims abstract description 7
- 230000007704 transition Effects 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 abstract description 9
- 238000007599 discharging Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 26
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 230000008602 contraction Effects 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0254—Coating heads with slot-shaped outlet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
- B05B1/04—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape in flat form, e.g. fan-like, sheet-like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
- B05B1/04—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape in flat form, e.g. fan-like, sheet-like
- B05B1/044—Slits, i.e. narrow openings defined by two straight and parallel lips; Elongated outlets for producing very wide discharges, e.g. fluid curtains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/28—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with integral means for shielding the discharged liquid or other fluent material, e.g. to limit area of spray; with integral means for catching drips or collecting surplus liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
- B05B15/40—Filters located upstream of the spraying outlets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Nozzles (AREA)
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Automatic Analysis And Handling Materials Therefor (AREA)
Abstract
Description
Claims (20)
- ウェハ表面上に液体を分注するためのスリットノズルであって、
ノズル本体を備え、該ノズル本体は、
その長さが10〜100mm、その幅が0.5〜5mmである吐出口と、
前記吐出口の上流に位置して前記吐出口まで及ぶ分注室と、
前記分注室の上流に位置する液分配室と、を有し、
前記分注室と前記液分配室とは、相互に流体連通しており、そして、前記吐出口および前記液分配室のそれぞれの断面積よりもその断面積が少なくとも20%小さい該ノズル本体の縮小部によって隔てられている、スリットノズル。 - 前記分注室は、前記吐出口の形状に対応する断面形状を有し、前記吐出口のノズルの断面積とは10%未満の差異で異なる断面積を有する、請求項1に記載のスリットノズル。
- 前記液分配室は、前記吐出口の形状に対応する断面形状を有し、前記吐出口のノズルの断面積とは10%未満の差異で異なる断面積を有する、請求項1に記載のスリットノズル。
- 前記縮小部の断面積は、前記吐出口、前記分注室、前記液分配室のそれぞれの断面積よりも少なくとも50%小さい、請求項1に記載のスリットノズル。
- 前記縮小部の断面積は、前記吐出口、前記分注室、前記液分配室のそれぞれの断面積よりも少なくとも70%小さい、請求項1に記載のスリットノズル。
- 前記吐出口の長さは、20〜50mmである、請求項1に記載のスリットノズル。
- 前記ノズル本体は、前記液分配室に少なくとも1つの第1の吸引口を有する、請求項1に記載のスリットノズル。
- 前記ノズル本体は、前記縮小部から5mm以下の距離で、前記液分配室に少なくとも1つの第1の吸引口を有する、請求項1に記載のスリットノズル。
- 前記少なくとも1つの第1の吸引口は、前記縮小部に平行かつ前記液分配室の長手方向に細長い、請求項7に記載のスリットノズル。
- 前記分注室に少なくとも1つの第2の吸引口をさらに備える、請求項7に記載のスリットノズル。
- 前記吐出口から10mm以下の距離で、前記分注室に少なくとも1つの第2の吸引口をさらに備える、請求項7に記載のスリットノズル。
- 前記少なくとも1つの第2の吸引口は、前記吐出口に平行かつ前記吐出口の長手方向に細長い、請求項10に記載のスリットノズル。
- 前記分注室の両側に1つずつ、少なくとも2つの第2の吸引口を備える、請求項10に記載のスリットノズル。
- 前記縮小部の幅は、前記分注室の幅よりも小さく、前記縮小部の長さは、前記分注室の長さと30%未満の差異で異なる、請求項1に記載のスリットノズル。
- 前記液分配室は、前記ノズル本体に対して45〜90°の角度をなして給液管に接続するように構成された液入口を有する、請求項1に記載のスリットノズル。
- 前記液分配室は、その上部においてテーパ状である、請求項1に記載のスリットノズル(好ましくは、前記分配室は、R形状である。好ましくは、前記分配室は、該分配室の広がりbの50%以下かつ該分配室の幅以上の大きさの半径で、R形状である)。
- 前記ノズル本体は、10〜100mmの範囲内の、前記縮小部の最狭領域から前記吐出口までの垂直方向の広がりh1を有する、請求項1に記載のスリットノズル。
- 前記分注室は、該分注室の幅が前記縮小部の幅から前記吐出口の幅へと徐々に増加する遷移領域を有する、請求項1に記載のスリットノズル(前記遷移領域は、距離h1の10%〜100%の範囲内である)。
- 前記縮小部は、0〜100mmの垂直方向の広がりh2を有する、請求項1に記載のスリットノズル。
- 前記液分配室は、該分配室の幅以上の大きさの、前記縮小部から該液分配室の上端までの垂直方向の広がりh3を有する、請求項1に記載のスリットノズル。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/625,353 US9597703B2 (en) | 2015-02-18 | 2015-02-18 | Slit nozzle |
US14/625,353 | 2015-02-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016175065A true JP2016175065A (ja) | 2016-10-06 |
JP6710533B2 JP6710533B2 (ja) | 2020-06-17 |
Family
ID=56621786
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016023204A Active JP6710533B2 (ja) | 2015-02-18 | 2016-02-10 | スリットノズル |
Country Status (6)
Country | Link |
---|---|
US (1) | US9597703B2 (ja) |
JP (1) | JP6710533B2 (ja) |
KR (1) | KR102495481B1 (ja) |
CN (1) | CN105880050B (ja) |
SG (1) | SG10201601088PA (ja) |
TW (1) | TWI674925B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101952703B1 (ko) * | 2019-01-11 | 2019-02-27 | 이영식 | 디스플레이 글래스 표면 도포용 인샤워 나이프 |
KR20190078384A (ko) * | 2017-12-26 | 2019-07-04 | 주식회사 포스코 | 용사 코팅 장치 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200133877A (ko) | 2019-05-20 | 2020-12-01 | 삼성전자주식회사 | 포토 레지스트 제거 장치 및 반도체 소자 제조 장치 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08274014A (ja) * | 1995-03-29 | 1996-10-18 | Tokyo Ohka Kogyo Co Ltd | 塗布ノズル、この塗布ノズルを用いた塗布方法及びこの塗布ノズルを組み込んだ塗布装置 |
JPH10323603A (ja) * | 1997-05-26 | 1998-12-08 | Fukuda Eng:Kk | 流動材料の幕状垂れ流し装置 |
JP2000201837A (ja) * | 1999-01-20 | 2000-07-25 | Sanyo Electric Co Ltd | 電動調理機 |
JP2013099738A (ja) * | 2011-11-09 | 2013-05-23 | Andritz Kuesters Gmbh | カーテンコーター |
Family Cites Families (14)
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JPS54127940A (en) * | 1978-03-29 | 1979-10-04 | Fujitsu Ltd | Coating blade |
US4962891A (en) * | 1988-12-06 | 1990-10-16 | The Boc Group, Inc. | Apparatus for removing small particles from a substrate |
JPH05104053A (ja) * | 1991-10-11 | 1993-04-27 | Konica Corp | 塗布装置 |
JP2572325B2 (ja) * | 1991-11-26 | 1997-01-16 | 富士写真フイルム株式会社 | 塗布方法及び装置 |
JP2572325Y2 (ja) * | 1993-08-19 | 1998-05-20 | 株式会社ゼクセル | 車両用空調装置の吹出モード切換装置 |
FI107278B (fi) * | 1996-02-28 | 2001-06-29 | Metso Paper Inc | Sovitelma päällystesuuttimen tukkeutumisen estämiseksi |
US6602382B1 (en) | 1999-10-26 | 2003-08-05 | Tokyo Electron Limited | Solution processing apparatus |
US6394369B2 (en) * | 1999-12-22 | 2002-05-28 | Visteon Global Tech., Inc. | Nozzle |
JP3647735B2 (ja) * | 2000-09-26 | 2005-05-18 | 株式会社ミツバ | ウォッシャ液噴射装置におけるノズル構造 |
JP3808792B2 (ja) | 2002-03-28 | 2006-08-16 | 大日本スクリーン製造株式会社 | 基板処理装置およびスリットノズル |
JP2004148167A (ja) * | 2002-10-29 | 2004-05-27 | Nordson Corp | 粘性流体材料の塗布方法及び装置 |
JP4369325B2 (ja) | 2003-12-26 | 2009-11-18 | 東京エレクトロン株式会社 | 現像装置及び現像処理方法 |
JP2011134797A (ja) | 2009-12-22 | 2011-07-07 | Sumco Corp | 枚葉式エッチング装置及び方法 |
KR101229347B1 (ko) * | 2012-09-05 | 2013-02-05 | 일성기계공업 주식회사 | 텐터기의 열풍분사노즐 및 이를 이용한 텐터기의 열풍분사장치 |
-
2015
- 2015-02-18 US US14/625,353 patent/US9597703B2/en active Active
-
2016
- 2016-02-10 JP JP2016023204A patent/JP6710533B2/ja active Active
- 2016-02-15 SG SG10201601088PA patent/SG10201601088PA/en unknown
- 2016-02-16 TW TW105104395A patent/TWI674925B/zh active
- 2016-02-16 CN CN201610087398.6A patent/CN105880050B/zh active Active
- 2016-02-17 KR KR1020160018440A patent/KR102495481B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08274014A (ja) * | 1995-03-29 | 1996-10-18 | Tokyo Ohka Kogyo Co Ltd | 塗布ノズル、この塗布ノズルを用いた塗布方法及びこの塗布ノズルを組み込んだ塗布装置 |
JPH10323603A (ja) * | 1997-05-26 | 1998-12-08 | Fukuda Eng:Kk | 流動材料の幕状垂れ流し装置 |
JP2000201837A (ja) * | 1999-01-20 | 2000-07-25 | Sanyo Electric Co Ltd | 電動調理機 |
JP2013099738A (ja) * | 2011-11-09 | 2013-05-23 | Andritz Kuesters Gmbh | カーテンコーター |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190078384A (ko) * | 2017-12-26 | 2019-07-04 | 주식회사 포스코 | 용사 코팅 장치 |
KR102044333B1 (ko) * | 2017-12-26 | 2019-11-13 | 주식회사 포스코 | 용사 코팅 장치 |
KR101952703B1 (ko) * | 2019-01-11 | 2019-02-27 | 이영식 | 디스플레이 글래스 표면 도포용 인샤워 나이프 |
TWI721714B (zh) * | 2019-01-11 | 2021-03-11 | 李榮植 | 一種用於在顯示屏表面塗布的噴淋刀 |
Also Published As
Publication number | Publication date |
---|---|
TWI674925B (zh) | 2019-10-21 |
US9597703B2 (en) | 2017-03-21 |
TW201701956A (zh) | 2017-01-16 |
US20160236227A1 (en) | 2016-08-18 |
CN105880050A (zh) | 2016-08-24 |
JP6710533B2 (ja) | 2020-06-17 |
KR20160101877A (ko) | 2016-08-26 |
KR102495481B1 (ko) | 2023-02-02 |
SG10201601088PA (en) | 2016-09-29 |
CN105880050B (zh) | 2018-07-20 |
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