JP2016171143A - 電子部品封止用キャップ - Google Patents
電子部品封止用キャップ Download PDFInfo
- Publication number
- JP2016171143A JP2016171143A JP2015048786A JP2015048786A JP2016171143A JP 2016171143 A JP2016171143 A JP 2016171143A JP 2015048786 A JP2015048786 A JP 2015048786A JP 2015048786 A JP2015048786 A JP 2015048786A JP 2016171143 A JP2016171143 A JP 2016171143A
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- JP
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- Prior art keywords
- cap
- brazing material
- sealing
- shape
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000005538 encapsulation Methods 0.000 title abstract 8
- 238000005219 brazing Methods 0.000 claims abstract description 132
- 230000004927 fusion Effects 0.000 claims abstract description 53
- 238000004519 manufacturing process Methods 0.000 claims abstract description 14
- 239000002184 metal Substances 0.000 claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims abstract description 10
- 239000000945 filler Substances 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 134
- 238000007789 sealing Methods 0.000 claims description 55
- 238000003892 spreading Methods 0.000 abstract description 9
- 230000007480 spreading Effects 0.000 abstract description 9
- 239000010931 gold Substances 0.000 description 48
- 238000007747 plating Methods 0.000 description 41
- 238000000034 method Methods 0.000 description 20
- 230000008569 process Effects 0.000 description 19
- 238000009736 wetting Methods 0.000 description 10
- 238000012545 processing Methods 0.000 description 9
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000000465 moulding Methods 0.000 description 6
- 230000000452 restraining effect Effects 0.000 description 5
- 229910015363 Au—Sn Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 229910000833 kovar Inorganic materials 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- 229910017709 Ni Co Inorganic materials 0.000 description 2
- 229910003267 Ni-Co Inorganic materials 0.000 description 2
- 229910003262 Ni‐Co Inorganic materials 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910017401 Au—Ge Inorganic materials 0.000 description 1
- 229910015367 Au—Sb Inorganic materials 0.000 description 1
- 229910015365 Au—Si Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/298—Semiconductor material, e.g. amorphous silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
- H01L2924/16153—Cap enclosing a plurality of side-by-side cavities [e.g. E-shaped cap]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
Claims (9)
- ベースと接合することで、封止領域を有するパッケージを製造するための電子部品用のキャップにおいて、
ろう材を融着するろう材融着面と、前記封止領域に対応する封止面とを有し、
前記ろう材融着面は、塑性加工により形成された平坦ではない被加工面を有し、
前記ろう材融着面の単位面積当たりの表面積(Sc)と、前記封止面の単位面積当たりの表面積(Sf)との比(Sc/Sf)が、1<Sc/Sf≦1.6であることを特徴とする電子部品用のキャップ。 - 被加工面の断面形状が、平坦面から突出した溝を有する形状となっている請求項1記載の電子部品用のキャップ。
- 被加工面の断面形状が、両端から中央に向けて下方に下がる略V字形状となっている請求項1記載の電子部品用のキャップ。
- 被加工面の断面形状が、両端から中央に向けて下方に張り出した円弧形状となっている請求項1記載の電子部品用のキャップ。
- 被加工面として、上方に突出する凸部又は下方に突出する凹部の少なくともいずれかが1以上形成されている請求項1記載の電子部品用のキャップ。
- ろう材融着面にAu系ろう材を融着してなる請求項1〜請求項5のいずれかに記載の電子部品用のキャップ。
- 平板形状を有し、その4辺に沿って枠状のろう材融着面が設定されている請求項1〜請求項6のいずれかに記載の電子部品用のキャップ。
- キャビティが形成された箱形状を有し、その端面に沿って枠状のろう材融着面が設定されている請求項1〜請求項6のいずれかに記載の電子部品用のキャップ。
- キャビティを形成するキャップ本体と、その端部に形成されたフランジ部とからなり、前記フランジの端面に沿って枠状のろう材融着面が設定されている請求項8記載の電子部品用のキャップ。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015048786A JP6499886B2 (ja) | 2015-03-11 | 2015-03-11 | 電子部品封止用キャップ |
US15/549,271 US10103077B2 (en) | 2015-03-11 | 2016-03-10 | Sealing cap for electronic component |
CN201680013596.6A CN107408536B (zh) | 2015-03-11 | 2016-03-10 | 电子零件密封用帽盖 |
PCT/JP2016/057530 WO2016143845A1 (ja) | 2015-03-11 | 2016-03-10 | 電子部品封止用キャップ |
KR1020177023713A KR101962060B1 (ko) | 2015-03-11 | 2016-03-10 | 전자 부품 밀봉용 캡 |
TW105107594A TWI694554B (zh) | 2015-03-11 | 2016-03-11 | 電子元件密封用蓋板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015048786A JP6499886B2 (ja) | 2015-03-11 | 2015-03-11 | 電子部品封止用キャップ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016171143A true JP2016171143A (ja) | 2016-09-23 |
JP6499886B2 JP6499886B2 (ja) | 2019-04-10 |
Family
ID=56880056
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015048786A Active JP6499886B2 (ja) | 2015-03-11 | 2015-03-11 | 電子部品封止用キャップ |
Country Status (6)
Country | Link |
---|---|
US (1) | US10103077B2 (ja) |
JP (1) | JP6499886B2 (ja) |
KR (1) | KR101962060B1 (ja) |
CN (1) | CN107408536B (ja) |
TW (1) | TWI694554B (ja) |
WO (1) | WO2016143845A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11152912B2 (en) | 2017-09-01 | 2021-10-19 | Murata Manufacturing Co., Ltd. | Piezoelectric resonator unit |
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JP2006032492A (ja) * | 2004-07-13 | 2006-02-02 | Mitsubishi Electric Corp | 半導体装置 |
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2015
- 2015-03-11 JP JP2015048786A patent/JP6499886B2/ja active Active
-
2016
- 2016-03-10 KR KR1020177023713A patent/KR101962060B1/ko active IP Right Grant
- 2016-03-10 CN CN201680013596.6A patent/CN107408536B/zh active Active
- 2016-03-10 US US15/549,271 patent/US10103077B2/en active Active
- 2016-03-10 WO PCT/JP2016/057530 patent/WO2016143845A1/ja active Application Filing
- 2016-03-11 TW TW105107594A patent/TWI694554B/zh active
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JPH0590429A (ja) * | 1991-09-27 | 1993-04-09 | Nec Corp | 半導体装置 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11152912B2 (en) | 2017-09-01 | 2021-10-19 | Murata Manufacturing Co., Ltd. | Piezoelectric resonator unit |
Also Published As
Publication number | Publication date |
---|---|
CN107408536B (zh) | 2020-09-25 |
US10103077B2 (en) | 2018-10-16 |
US20180033706A1 (en) | 2018-02-01 |
WO2016143845A1 (ja) | 2016-09-15 |
KR20170106467A (ko) | 2017-09-20 |
JP6499886B2 (ja) | 2019-04-10 |
CN107408536A (zh) | 2017-11-28 |
KR101962060B1 (ko) | 2019-03-25 |
TWI694554B (zh) | 2020-05-21 |
TW201644011A (zh) | 2016-12-16 |
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