JP2016131217A - 半導体装置とその製造方法 - Google Patents
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 204
- 238000004519 manufacturing process Methods 0.000 title claims description 32
- 239000012535 impurity Substances 0.000 claims abstract description 49
- 238000009792 diffusion process Methods 0.000 claims abstract description 29
- 238000000034 method Methods 0.000 claims description 21
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 229910052796 boron Inorganic materials 0.000 abstract description 21
- 229910052782 aluminium Inorganic materials 0.000 abstract description 15
- 230000015556 catabolic process Effects 0.000 abstract description 10
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 abstract description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 6
- 239000010410 layer Substances 0.000 description 32
- -1 boron ions Chemical class 0.000 description 24
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 10
- 210000000746 body region Anatomy 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 4
- 239000002344 surface layer Substances 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- 230000004913 activation Effects 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 238000002513 implantation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Abstract
Description
Claims (8)
- 半導体層の一方の主面から深さ方向に伸びるトレンチゲートと、
前記トレンチゲートの底面に接するp型半導体領域と、を備え、
前記p型半導体領域は、第1種類のp型不純物を含む第1p型半導体領域と第2種類のp型不純物を含む第2p型半導体領域を有し、
前記第1p型半導体領域は、前記第2p型半導体領域よりも前記トレンチゲート側に配置されており、
前記第2p型半導体領域は、前記深さ方向に沿って観測したときに、前記第1p型半導体領域の存在範囲の一部に収まるように配置されており、
前記第2種類のp型不純物の拡散係数は、前記第1種類のp型不純物の拡散係数よりも小さい、半導体装置。 - 前記第1p型半導体領域は、前記トレンチゲートの底面に接しており、前記トレンチゲートの底面の端部よりも側方に突出する、請求項1に記載の半導体装置。
- 前記第1p型半導体領域が前記トレンチゲートの底面の端部から側方に突出する長さが、2.0μm以下である、請求項2に記載の半導体装置。
- 前記第1p型半導体領域は、前記トレンチゲートの側面に接していない、請求項2又は3に記載の半導体装置。
- 前記第2p型半導体領域は、前記深さ方向に沿って観測したときに、前記トレンチゲートの存在範囲の一部に収まるように配置されている、請求項1〜4のいずれか一項に記載の半導体装置。
- 開口が形成されているマスクを半導体層の一方の主面に形成するマスク形成工程と、
前記マスクの開口において露出する前記半導体層の前記一方の主面から深さ方向に伸びるトレンチを形成するトレンチ形成工程と、
前記マスクの開口を通過して前記トレンチ内に向けて第1種類のp型不純物を照射する第1照射工程と、
前記マスクの開口を通過して前記トレンチ内に向けて第2種類のp型不純物を照射する第2照射工程と、を備え、
前記第2種類のp型不純物が、前記トレンチの底面の下方において、前記第1種類のp型不純物よりも深い位置に導入され、
前記第2種類のp型不純物の拡散係数は、前記第1種類のp型不純物の拡散係数よりも小さい、半導体装置の製造方法。 - 前記第1照射工程が、前記第2照射工程よりも先に実施される、請求項6に記載の半導体装置の製造方法。
- 前記第1照射工程と前記第2照射工程の間に、前記マスクを残した状態で、前記トレンチの底面の下方に導入された前記第1種類のp型不純物が残るように、前記トレンチの側面及び底面を除去する除去工程をさらに備える、請求項7に記載の製造方法。
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JP2021002597A (ja) * | 2019-06-21 | 2021-01-07 | 富士電機株式会社 | 半導体装置 |
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DE102018211825A1 (de) * | 2018-07-17 | 2020-01-23 | Robert Bosch Gmbh | Vertikaler Leistungstransistor und Verfahren zur Herstellung des vertikalen Leistungstransistors |
CN110212019A (zh) * | 2019-05-29 | 2019-09-06 | 西安电子科技大学 | 一种具有t型掩蔽层结构的碳化硅mosfet器件 |
US20220052152A1 (en) * | 2020-08-14 | 2022-02-17 | Cree, Inc. | Sidewall dopant shielding methods and approaches for trenched semiconductor device structures |
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CN111834462A (zh) * | 2018-06-28 | 2020-10-27 | 华为技术有限公司 | 一种半导体器件及制造方法 |
CN111834462B (zh) * | 2018-06-28 | 2024-02-09 | 华为技术有限公司 | 一种半导体器件及制造方法 |
JP2021002597A (ja) * | 2019-06-21 | 2021-01-07 | 富士電機株式会社 | 半導体装置 |
JP7379880B2 (ja) | 2019-06-21 | 2023-11-15 | 富士電機株式会社 | 半導体装置 |
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US20170317162A1 (en) | 2017-11-02 |
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