JP2016127227A5 - - Google Patents

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Publication number
JP2016127227A5
JP2016127227A5 JP2015002101A JP2015002101A JP2016127227A5 JP 2016127227 A5 JP2016127227 A5 JP 2016127227A5 JP 2015002101 A JP2015002101 A JP 2015002101A JP 2015002101 A JP2015002101 A JP 2015002101A JP 2016127227 A5 JP2016127227 A5 JP 2016127227A5
Authority
JP
Japan
Prior art keywords
electronic components
microcomputers
transistor
logic
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015002101A
Other languages
English (en)
Japanese (ja)
Other versions
JP6421601B2 (ja
JP2016127227A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2015002101A priority Critical patent/JP6421601B2/ja
Priority claimed from JP2015002101A external-priority patent/JP6421601B2/ja
Priority to PCT/JP2015/085650 priority patent/WO2016111154A1/ja
Priority to CN201580071054.XA priority patent/CN107112141B/zh
Priority to US15/541,779 priority patent/US20170352495A1/en
Publication of JP2016127227A publication Critical patent/JP2016127227A/ja
Publication of JP2016127227A5 publication Critical patent/JP2016127227A5/ja
Application granted granted Critical
Publication of JP6421601B2 publication Critical patent/JP6421601B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2015002101A 2015-01-08 2015-01-08 キャパシタモジュール Expired - Fee Related JP6421601B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2015002101A JP6421601B2 (ja) 2015-01-08 2015-01-08 キャパシタモジュール
PCT/JP2015/085650 WO2016111154A1 (ja) 2015-01-08 2015-12-21 キャパシタモジュール
CN201580071054.XA CN107112141B (zh) 2015-01-08 2015-12-21 电容器模块
US15/541,779 US20170352495A1 (en) 2015-01-08 2015-12-21 Capacitor module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015002101A JP6421601B2 (ja) 2015-01-08 2015-01-08 キャパシタモジュール

Publications (3)

Publication Number Publication Date
JP2016127227A JP2016127227A (ja) 2016-07-11
JP2016127227A5 true JP2016127227A5 (enExample) 2017-06-15
JP6421601B2 JP6421601B2 (ja) 2018-11-14

Family

ID=56355854

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015002101A Expired - Fee Related JP6421601B2 (ja) 2015-01-08 2015-01-08 キャパシタモジュール

Country Status (4)

Country Link
US (1) US20170352495A1 (enExample)
JP (1) JP6421601B2 (enExample)
CN (1) CN107112141B (enExample)
WO (1) WO2016111154A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7336637B2 (ja) * 2018-05-25 2023-09-01 パナソニックＩｐマネジメント株式会社 コンデンサ
EP3982384B1 (en) * 2020-10-06 2023-07-26 Veoneer Passive Co. AB Electronic control unit
CN112768228B (zh) * 2020-12-18 2023-04-07 东佳电子（郴州）有限公司 一种具有断电保护功能的电容器
JP7491242B2 (ja) * 2021-03-09 2024-05-28 住友電装株式会社 電子機器
JPWO2022202579A1 (enExample) * 2021-03-25 2022-09-29
US11839035B2 (en) * 2021-12-20 2023-12-05 Veoneer Us Safety Systems, Llc Electronic control unit housing with electronic component holder
US11804336B2 (en) * 2022-03-11 2023-10-31 General Electric Company Ultracapacitor module with integrated bypass diode and related systems
EP4312240A1 (en) * 2022-07-27 2024-01-31 Veoneer Sweden Safety Systems AB Mounting structure for a capacitor in a housing part of a housing

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3087982A (en) * 1959-12-01 1963-04-30 Northrop Corp Vacuum tube mounts
JPH0530381Y2 (enExample) * 1985-06-12 1993-08-03
US5204498A (en) * 1991-12-30 1993-04-20 Therm-O-Disc, Incorporated Packaging assembly
CN1104184C (zh) * 1996-08-29 2003-03-26 松下电器产业株式会社 振动器夹持装置
EP0909120B1 (de) * 1997-10-11 2005-06-08 Conti Temic microelectronic GmbH Gehäuse zur Aufnahme elektronischer Bauelemente
DE19813639A1 (de) * 1998-03-27 1999-11-25 Danfoss As Leistungsmodul für einen Stromrichter
CN1171255C (zh) * 1998-09-16 2004-10-13 开利公司 电控制箱中电容器的安装装置
JP4038899B2 (ja) * 1998-11-04 2008-01-30 株式会社デンソー 電源平滑用コンデンサ搭載型インバータ装置
US6354674B1 (en) * 1998-12-11 2002-03-12 Denso Corporation Hydraulic control apparatus integrated with motor driving circuit unit
DE19857840C2 (de) * 1998-12-15 2003-10-02 Siemens Ag Elektronische Einrichtung
JP2000340920A (ja) * 1999-05-31 2000-12-08 Kyocera Corp 回路基板および集積回路装置
DE19941690C2 (de) * 1999-09-01 2001-12-06 Siemens Ag Steuergerät und Lötverfahren
JP2003031449A (ja) * 2001-07-11 2003-01-31 Casio Comput Co Ltd 蓄電構造およびそれを備えた電子機器
DE10162600A1 (de) * 2001-12-20 2003-07-10 Bosch Gmbh Robert Gehäuseanordnung für ein elektrisches Gerät
JP3864873B2 (ja) * 2002-08-09 2007-01-10 株式会社デンソー 電子制御装置
US6717797B1 (en) * 2002-11-22 2004-04-06 Tyco Electronics Corporation Apparatus, methods and articles of manufacture for a module box with integrated components
JP2005026270A (ja) * 2003-06-30 2005-01-27 Murata Mfg Co Ltd 高圧用可変抵抗器
EP1589547A4 (en) * 2003-09-18 2009-11-25 Panasonic Corp CAPACITOR UNIT
ITTO20030754A1 (it) * 2003-09-29 2005-03-30 Gate Srl Unita' elettronica di controllo, in particolare unita'
JP4859443B2 (ja) * 2005-11-17 2012-01-25 日立オートモティブシステムズ株式会社 電力変換装置
JP4853077B2 (ja) * 2006-03-29 2012-01-11 株式会社豊田自動織機 電動コンプレッサ
JP2007281127A (ja) * 2006-04-05 2007-10-25 Shindengen Electric Mfg Co Ltd コンデンサを備える回路装置及びコンデンサモジュール
US8149567B2 (en) * 2006-04-27 2012-04-03 Komatsu Ltd. Capacitor module
US7903417B2 (en) * 2006-10-10 2011-03-08 Deere & Company Electrical circuit assembly for high-power electronics
JP4751810B2 (ja) * 2006-11-02 2011-08-17 日立オートモティブシステムズ株式会社 電力変換装置
JP4702311B2 (ja) * 2007-03-19 2011-06-15 トヨタ自動車株式会社 コンデンサを備えた電気ユニット
US8134343B2 (en) * 2007-04-27 2012-03-13 Flextronics International Kft Energy storage device for starting engines of motor vehicles and other transportation systems
DE112008002534T5 (de) * 2007-09-20 2010-08-26 Panasonic Electric Works Co., Ltd., Kadoma-shi Detektor für Näherungssensor und Näherungssensor
JP5095459B2 (ja) * 2008-03-25 2012-12-12 株式会社小松製作所 キャパシタモジュール
JP4638923B2 (ja) * 2008-03-31 2011-02-23 日立オートモティブシステムズ株式会社 制御装置
DE102008023714B4 (de) * 2008-05-15 2011-01-20 Semikron Elektronik Gmbh & Co. Kg Anordnung mit einem Hauptträger und einer Leiterplatte mit Bauelementen
JP4657329B2 (ja) * 2008-07-29 2011-03-23 日立オートモティブシステムズ株式会社 電力変換装置および電動車両
JP5232047B2 (ja) * 2009-03-10 2013-07-10 矢崎総業株式会社 コンデンサの取り付け構造
ITTO20100064U1 (it) * 2010-04-13 2011-10-14 Gate Srl Unita' elettronica di controllo, in particolare unita' di controllo della velocita' di un elettroventilatore
US8149589B2 (en) * 2010-08-19 2012-04-03 Lien Chang Electronic Enterprise Co., Ltd. Capacitor holder
CN202221699U (zh) * 2011-08-16 2012-05-16 许文豪 一种电容固定装置及应用该电容固定装置的线路板结构
JP5945710B2 (ja) * 2011-10-28 2016-07-05 パナソニックＩｐマネジメント株式会社 キャパシタモジュール
CN106716723B (zh) * 2014-09-11 2018-04-10 日本精工株式会社 多极引线部件及基板的连接装置

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