JP2016084342A5 - - Google Patents
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- Publication number
- JP2016084342A5 JP2016084342A5 JP2015207460A JP2015207460A JP2016084342A5 JP 2016084342 A5 JP2016084342 A5 JP 2016084342A5 JP 2015207460 A JP2015207460 A JP 2015207460A JP 2015207460 A JP2015207460 A JP 2015207460A JP 2016084342 A5 JP2016084342 A5 JP 2016084342A5
- Authority
- JP
- Japan
- Prior art keywords
- carbon atoms
- group
- substituted
- epoxy resin
- unsubstituted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 125000004432 carbon atom Chemical group C* 0.000 claims 49
- 239000003822 epoxy resin Substances 0.000 claims 33
- 229920000647 polyepoxide Polymers 0.000 claims 33
- 239000000203 mixture Substances 0.000 claims 18
- -1 phosphonium compound Chemical class 0.000 claims 11
- 239000005011 phenolic resin Substances 0.000 claims 10
- 229910052799 carbon Inorganic materials 0.000 claims 7
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 7
- 150000001721 carbon Chemical class 0.000 claims 6
- 150000001875 compounds Chemical class 0.000 claims 6
- 229920002545 silicone oil Polymers 0.000 claims 6
- 125000000217 alkyl group Chemical group 0.000 claims 5
- 125000003118 aryl group Chemical group 0.000 claims 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 5
- 229920003986 novolac Polymers 0.000 claims 5
- 125000001931 aliphatic group Chemical group 0.000 claims 4
- 125000002947 alkylene group Chemical group 0.000 claims 4
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 claims 4
- 125000003710 aryl alkyl group Chemical group 0.000 claims 4
- 125000000732 arylene group Chemical group 0.000 claims 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 4
- 239000003054 catalyst Substances 0.000 claims 4
- 125000000753 cycloalkyl group Chemical group 0.000 claims 4
- 125000002993 cycloalkylene group Chemical group 0.000 claims 4
- 125000004404 heteroalkyl group Chemical group 0.000 claims 4
- 125000001072 heteroaryl group Chemical group 0.000 claims 4
- 125000005842 heteroatom Chemical group 0.000 claims 4
- 150000002430 hydrocarbons Chemical group 0.000 claims 4
- 229910052739 hydrogen Inorganic materials 0.000 claims 4
- 239000001257 hydrogen Substances 0.000 claims 4
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 4
- 239000003795 chemical substances by application Substances 0.000 claims 3
- 125000000592 heterocycloalkyl group Chemical group 0.000 claims 3
- XYFCBTPGUUZFHI-UHFFFAOYSA-O phosphonium Chemical compound [PH4+] XYFCBTPGUUZFHI-UHFFFAOYSA-O 0.000 claims 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 2
- 229910052783 alkali metal Inorganic materials 0.000 claims 2
- 150000001340 alkali metals Chemical class 0.000 claims 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims 2
- 229930003836 cresol Natural products 0.000 claims 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims 2
- 125000000524 functional group Chemical group 0.000 claims 2
- 229910052736 halogen Inorganic materials 0.000 claims 2
- 150000002367 halogens Chemical class 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 238000001721 transfer moulding Methods 0.000 claims 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 claims 1
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 claims 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims 1
- LJBWJFWNFUKAGS-UHFFFAOYSA-N 2-[bis(2-hydroxyphenyl)methyl]phenol Chemical compound OC1=CC=CC=C1C(C=1C(=CC=CC=1)O)C1=CC=CC=C1O LJBWJFWNFUKAGS-UHFFFAOYSA-N 0.000 claims 1
- JIGUICYYOYEXFS-UHFFFAOYSA-N 3-tert-butylbenzene-1,2-diol Chemical compound CC(C)(C)C1=CC=CC(O)=C1O JIGUICYYOYEXFS-UHFFFAOYSA-N 0.000 claims 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 claims 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 claims 1
- 150000008065 acid anhydrides Chemical class 0.000 claims 1
- 125000002723 alicyclic group Chemical group 0.000 claims 1
- 239000004844 aliphatic epoxy resin Substances 0.000 claims 1
- 125000003277 amino group Chemical group 0.000 claims 1
- 239000004305 biphenyl Substances 0.000 claims 1
- 235000010290 biphenyl Nutrition 0.000 claims 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 claims 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 claims 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 1
- 238000001816 cooling Methods 0.000 claims 1
- VEIOBOXBGYWJIT-UHFFFAOYSA-N cyclohexane;methanol Chemical compound OC.OC.C1CCCCC1 VEIOBOXBGYWJIT-UHFFFAOYSA-N 0.000 claims 1
- IMHDGJOMLMDPJN-UHFFFAOYSA-N dihydroxybiphenyl Natural products OC1=CC=CC=C1C1=CC=CC=C1O IMHDGJOMLMDPJN-UHFFFAOYSA-N 0.000 claims 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 claims 1
- 125000000623 heterocyclic group Chemical group 0.000 claims 1
- 239000011256 inorganic filler Substances 0.000 claims 1
- 229910003475 inorganic filler Inorganic materials 0.000 claims 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 229920003987 resole Polymers 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 125000003003 spiro group Chemical group 0.000 claims 1
- 238000003860 storage Methods 0.000 claims 1
- 150000003505 terpenes Chemical class 0.000 claims 1
- 235000007586 terpenes Nutrition 0.000 claims 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2014-0143638 | 2014-10-22 | ||
| KR1020140143638A KR101768281B1 (ko) | 2014-10-22 | 2014-10-22 | 포스포늄계 화합물, 이를 포함하는 에폭시수지 조성물, 및 이를 사용하여 제조된 반도체 장치 |
| KR10-2015-0058072 | 2015-04-24 | ||
| KR1020150058072A KR101802577B1 (ko) | 2015-04-24 | 2015-04-24 | 포스포늄계 화합물, 이를 포함하는 에폭시수지 조성물, 및 이를 사용하여 제조된 반도체 장치 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016084342A JP2016084342A (ja) | 2016-05-19 |
| JP2016084342A5 true JP2016084342A5 (OSRAM) | 2016-10-13 |
| JP6803138B2 JP6803138B2 (ja) | 2020-12-23 |
Family
ID=55791451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015207460A Active JP6803138B2 (ja) | 2014-10-22 | 2015-10-21 | ホスホニウム系化合物、それを含むエポキシ樹脂組成物、およびそれを用いて製造された半導体装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9868751B2 (OSRAM) |
| JP (1) | JP6803138B2 (OSRAM) |
| CN (1) | CN105541914A (OSRAM) |
| TW (1) | TWI580687B (OSRAM) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101802583B1 (ko) * | 2015-06-23 | 2017-12-29 | 삼성에스디아이 주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물, 및 이를 사용하여 제조된 반도체 소자 |
| KR101922288B1 (ko) * | 2015-11-26 | 2018-11-27 | 삼성에스디아이 주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자 |
| WO2018083885A1 (ja) | 2016-11-02 | 2018-05-11 | 住友ベークライト株式会社 | エポキシ樹脂組成物および構造体 |
| JP7087797B2 (ja) * | 2018-08-01 | 2022-06-21 | Dic株式会社 | インク組成物、光変換層及びカラーフィルタ |
| EP4400525A1 (en) * | 2023-01-12 | 2024-07-17 | Henkel AG & Co. KGaA | One component liquid epoxy resin composition |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5055679B2 (ja) * | 2000-09-29 | 2012-10-24 | 住友ベークライト株式会社 | 熱硬化性樹脂組成物およびそれを用いたエポキシ樹脂成形材料ならびに半導体装置 |
| JP2002105171A (ja) * | 2000-09-29 | 2002-04-10 | Sumitomo Bakelite Co Ltd | 積層板用エポキシ樹脂組成物、並びにこれを用いたプリプレグおよび積層板 |
| JP2003292584A (ja) * | 2002-04-02 | 2003-10-15 | Sumitomo Bakelite Co Ltd | 熱硬化性樹脂組成物およびそれを用いたエポキシ樹脂成形材料ならびに半導体装置 |
| JP4569076B2 (ja) | 2002-06-05 | 2010-10-27 | 住友ベークライト株式会社 | 硬化促進剤、エポキシ樹脂組成物および半導体装置 |
| WO2005113496A1 (de) * | 2004-05-21 | 2005-12-01 | Sanofi-Aventis Deutschland Gmbh | Verfahren zur herstellung von 1,4-diphenylazetidinon-derivaten |
| MY144047A (en) | 2005-01-20 | 2011-07-29 | Sumitomo Bakelite Co | Epoxy resin composition, process for providing latency to the composition and a semiconductor device |
| JP4720357B2 (ja) | 2005-03-28 | 2011-07-13 | 住友ベークライト株式会社 | 潜伏性触媒の製造方法およびエポキシ樹脂組成物 |
| JP5340558B2 (ja) | 2007-05-17 | 2013-11-13 | 日東電工株式会社 | 半導体封止用エポキシ樹脂組成物およびそれを用いて得られる半導体装置 |
| US9278134B2 (en) | 2008-12-29 | 2016-03-08 | The Board Of Trustees Of The University Of Alabama | Dual functioning ionic liquids and salts thereof |
| CN102918106B (zh) * | 2010-05-28 | 2015-09-16 | 住友电木株式会社 | 半导体封装用环氧树脂组合物和使用它的半导体装置 |
| KR101593731B1 (ko) | 2012-12-24 | 2016-02-12 | 제일모직주식회사 | 4가 포스포늄염, 이를 포함하는 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자 |
| KR101813758B1 (ko) * | 2015-06-22 | 2018-01-31 | 삼성에스디아이 주식회사 | 포스포늄계 화합물, 이를 포함하는 에폭시 수지 조성물, 및 이를 사용하여 제조된 반도체 소자 |
| KR101802583B1 (ko) * | 2015-06-23 | 2017-12-29 | 삼성에스디아이 주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물, 및 이를 사용하여 제조된 반도체 소자 |
| KR101835937B1 (ko) * | 2015-07-03 | 2018-04-20 | 삼성에스디아이 주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물, 및 이를 사용하여 제조된 반도체 소자 |
-
2015
- 2015-10-21 US US14/918,916 patent/US9868751B2/en active Active
- 2015-10-21 JP JP2015207460A patent/JP6803138B2/ja active Active
- 2015-10-22 CN CN201510695432.3A patent/CN105541914A/zh active Pending
- 2015-10-22 TW TW104134608A patent/TWI580687B/zh active
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