JP2016076620A - 被処理体を処理する方法 - Google Patents
被処理体を処理する方法 Download PDFInfo
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Abstract
【解決手段】一実施形態の方法では、第1マスク及び反射防止膜上にシリコン酸化膜を形成する工程が実行される。この工程では、ハロゲン化ケイ素ガスを含む第1のガスのプラズマと酸素ガスを含む第2のガスのプラズマが交互に生成される。次いで、第1マスクの側面上に形成された領域のみが残るようにシリコン酸化膜の他の領域が除去される。次いで、第1マスクが除去される。しかる後に、反射防止膜及び有機膜がエッチングされる。
【選択図】図1
Description
W4=W2−2×W3 …(1)
ここで、W2は、マスクMK1によって提供されていた開口の幅(図3の(a)を参照)であり、W3は、領域R3の膜厚(図3の(b)を参照)、即ち、マスクMK2の水平方向の幅(図4の(b)を参照)である。上記の関係式(1)から分かるように、幅W4は、領域R3の膜厚によって調整することができ、領域R3の膜厚はシーケンスSQ1の実行回数によって任意に調整可能である。即ち、マスクMK2の幅W3は、シーケンスSQ1の実行回数によって任意に調整可能である。したがって、方法MT1によれば、幅W4を任意に調整することが可能である。例えば、方法MT1によれば、マスクMK2によって提供される全ての開口の幅を略等しくすることが可能である。また、例えば、方法MT1によれば、全てのスペースの幅が略同一のライン・アンド・スペースパターンを有するマスクMK2を作成することが可能である。さらに、マスクMK1の幅、及び、マスクMK1によって提供される開口の幅を調整し、領域R3の膜厚をシーケンスSQ1の実行回数によって調整することにより、任意の寸法のマスク幅及び開口幅を有するマスクMK2を形成することが可能である。このように、方法MT1によれば、マスクMK2の寸法の制御性が高められる。さらに、方法MT1では、マスクMK2のパターンが有機膜OLに転写されるので、当該有機膜OLから形成されるマスクMK3についても、マスクMK2と同様に、寸法の制御性が高められる。
W21=W22−2×W23=W24 …(2)
方法MT2では、幅W23は領域R6の膜厚に相当するので、シーケンスSQ2の実行回数により設定可能である。したがって、方法MT2によれば、上記の関係式(2)を容易に満たすことができる。このように、方法MT2は、マスクMK4の寸法の制御性に優れている。
W3=W21=W22−2×W23 …(3)
この関係式(3)から分かるように、マスクMK4によって提供される全ての開口の幅を同一とするためには、マスクMK4の幅W23は、マスクMK2の幅よりも小さくなければならない。このように、クアドロパターニング法では、作成するマスクの設計によって、マスクMK2の幅とマスクMK4の幅、即ち、シリコン酸化膜SX1の膜厚とシリコン酸化膜SX2の膜厚とが異なることがある。方法MT2によれば、シリコン酸化膜SX1の膜厚はシーケンスSQ1の実行回数によって調整可能であり、シリコン酸化膜SX2の膜厚はシーケンスSQ2の実行回数によって調整可能であるので、クアドロパターニング法によって作成するマスクの設計に応じた膜厚制御が可能である。
・処理容器内圧力:50mTorr(6.66Pa)
・水素ガス流量:100sccm
・Arガス流量:800sccm
・第1の高周波電源62の高周波電力(上部電極30に供給):60MHz、300W
・第2の高周波電源64の高周波バイアス電力:13MHz、0W
・電源70の印加電圧:−1000V
・処理時間:60秒
<工程ST3の条件>
・処理容器内圧力:200mTorr(26.66Pa)
・SiCl4ガス流量:20sccm
・Arガス流量:200sccm
・第1の高周波電源62の高周波電力(上部電極30に供給):60MHz、100W
・第2の高周波電源64の高周波バイアス電力:13MHz、0W
・処理時間:5秒
<工程ST5の条件>
・処理容器内圧力:200mTorr(26.66Pa)
・酸素ガス流量:200sccm
・Arガス流量:200sccm
・第1の高周波電源62の高周波電力(上部電極30に供給):60MHz、500W
・第2の高周波電源64の高周波バイアス電力:13MHz、0W
・処理時間:5秒
・処理容器内圧力:50mTorr(6.66Pa)
・水素ガス流量:100sccm
・Arガス流量:800sccm
・第1の高周波電源62の高周波電力(上部電極30に供給):60MHz、300W
・第2の高周波電源64の高周波バイアス電力:13MHz、0W
・電源70の印加電圧:−1000V
・処理時間:60秒
<工程ST3の条件>
・処理容器内圧力:200mTorr(26.66Pa)
・SiCl4ガス流量:20sccm
・Arガス流量:200sccm
・第1の高周波電源62の高周波電力(上部電極30に供給):60MHz、100W
・第2の高周波電源64の高周波バイアス電力:13MHz、0W
・処理時間:5秒
<工程ST5の条件>
・処理容器内圧力:200mTorr(26.66Pa)
・酸素ガス流量:200sccm
・Arガス流量:200sccm
・第1の高周波電源62の高周波電力(上部電極30に供給):60MHz、500W
・第2の高周波電源64の高周波バイアス電力:13MHz、0W
・処理時間:5秒
Claims (12)
- 被処理体を処理する方法であって、
前記被処理体は、被エッチング層、該被エッチング層上に設けられた有機膜、該有機膜上に設けられたシリコン含有反射防止膜、及び、レジスト材料から構成された第1マスクであり前記反射防止膜上に設けられた該第1マスクを有し、
該方法は、
前記被処理体を収容したプラズマ処理装置の処理容器内で、前記第1マスク及び前記反射防止膜上にシリコン酸化膜を形成する工程であり、該シリコン酸化膜は、前記第1マスクの上面の上に形成された第1領域、前記反射防止膜上に形成された第2領域、及び、前記第1マスクの側面上に形成された第3領域を有する、該工程と、
前記処理容器内で発生させたプラズマにより、前記第1領域及び前記第2領域を除去する工程であり、前記第3領域に基づく第2マスクを形成する、該工程と、
前記処理容器内で発生させたプラズマにより、前記第1マスクを除去する工程と、
前記処理容器内で発生させたプラズマにより、前記反射防止膜をエッチングする工程と、
前記処理容器内で発生させたプラズマにより、前記有機膜をエッチングする工程であり、該有機膜から構成された第3マスクを形成する、該工程と、
を含み、
前記シリコン酸化膜を形成する前記工程は、
前記被処理体を収容した前記処理容器内で、ハロゲン化ケイ素ガスを含む第1のガスのプラズマを生成して反応前駆体を形成する第1工程と、
前記処理容器内の空間をパージする第2工程と、
前記処理容器内で酸素ガスを含む第2のガスのプラズマを生成してシリコン酸化膜を形成する第3工程と、
前記処理容器内の空間をパージする第4工程と、
を含むシーケンスの実行によりシリコン酸化膜を成膜する、方法。 - 前記シリコン酸化膜を形成する前記工程において、前記第1工程、前記第2工程、前記第3工程、及び前記第4工程を含む前記シーケンスが繰り返される、請求項1に記載の方法。
- 前記第1工程では、前記処理容器内の圧力が13.33Pa以上の圧力であり、プラズマ生成用の高周波電源の電力が100W以下である高圧低電力の条件に設定される、請求項1又は2に記載の方法。
- 前記第1工程では、イオンを引き込み用のバイアス電力が前記被処理体を支持する載置台に印加されない、請求項1〜3の何れか一項に記載の方法。
- 前記プラズマ処理装置は容量結合型のプラズマ処理装置であり、
前記シリコン酸化膜を形成する前記工程の実行の前に、前記処理容器内でプラズマを発生させて前記プラズマ処理装置の上部電極に負の直流電圧を印加することにより、前記第1マスクに二次電子を照射する工程を更に含む、請求項1〜4の何れか一項に記載の方法。 - 前記処理容器内で前記第3マスク及び前記被エッチング層上に別のシリコン酸化膜を形成する工程であり、該別のシリコン酸化膜は、前記第3マスクの上面の上に形成された第4領域、前記被エッチング層上に形成された第5領域、及び前記第3マスクの側面上に形成された第6領域を有する、該工程と、
前記処理容器内で発生させたプラズマにより、前記第4領域及び前記第5領域を除去する工程であり、前記第6領域から構成された第4マスクを形成する工程と、
前記処理容器内で発生させたプラズマにより、前記第3マスクを除去する工程と、
を含み、
前記別のシリコン酸化膜を形成する前記工程は、
前記被処理体を収容した前記処理容器内で、ハロゲン化ケイ素ガスを含む第3のガスのプラズマを生成して反応前駆体を形成する第5工程と、
前記処理容器内の空間をパージする第6工程と、
前記処理容器内で酸素ガスを含む第4のガスのプラズマを生成してシリコン酸化膜を形成する第7工程と、
前記処理容器内の空間をパージする第8工程と、
を含むシーケンスの実行によりシリコン酸化膜を成膜する、
請求項1〜5の何れか一項に記載の方法。 - 前記別のシリコン酸化膜を形成する前記工程において、前記第5工程、前記第6工程、前記第7工程、及び前記第8工程を含む前記シーケンスが繰り返される、請求項6に記載の方法。
- 前記第5工程では、前記処理容器内の圧力が13.33Pa以上の圧力であり、プラズマ生成用の高周波電源の電力が100W以下である高圧低電力の条件に設定される、請求項6又は7に記載の方法。
- 前記第5工程では、イオンを引き込み用のバイアス電力が前記被処理体を支持する載置台に印加されない、請求項6〜8の何れか一項に記載の方法。
- 前記プラズマ処理装置は容量結合型のプラズマ処理装置であり、
前記別のシリコン酸化膜を形成する前記工程の実行の前に、前記処理容器内でプラズマを発生させて前記プラズマ処理装置の上部電極に負の直流電圧を印加することにより、前記第3マスクに二次電子を照射する工程を更に含む、
請求項6〜9の何れか一項に記載の方法。 - 前記処理容器内で発生させたプラズマにより、前記被エッチング層をエッチングする工程を更に含む、請求項1〜10の何れか一項に記載の方法。
- 前記ハロゲン化ケイ素ガスは、SiCl4ガスである請求項1〜11の何れか一項に記載の方法。
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JP6770848B2 (ja) * | 2016-03-29 | 2020-10-21 | 東京エレクトロン株式会社 | 被処理体を処理する方法 |
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US20180158684A1 (en) | 2018-06-07 |
US20160099148A1 (en) | 2016-04-07 |
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CN105489485A (zh) | 2016-04-13 |
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