JP2016045371A - 表示装置 - Google Patents
表示装置 Download PDFInfo
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- JP2016045371A JP2016045371A JP2014169758A JP2014169758A JP2016045371A JP 2016045371 A JP2016045371 A JP 2016045371A JP 2014169758 A JP2014169758 A JP 2014169758A JP 2014169758 A JP2014169758 A JP 2014169758A JP 2016045371 A JP2016045371 A JP 2016045371A
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- 239000000758 substrate Substances 0.000 claims abstract description 55
- 239000000463 material Substances 0.000 claims abstract description 37
- 230000003014 reinforcing effect Effects 0.000 claims description 64
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 230000002787 reinforcement Effects 0.000 abstract description 10
- 239000010408 film Substances 0.000 description 53
- 238000007689 inspection Methods 0.000 description 20
- 239000011248 coating agent Substances 0.000 description 16
- 238000000576 coating method Methods 0.000 description 16
- 239000010410 layer Substances 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 239000011229 interlayer Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 229910052681 coesite Inorganic materials 0.000 description 4
- 229910052906 cristobalite Inorganic materials 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 229910052682 stishovite Inorganic materials 0.000 description 4
- 229910052905 tridymite Inorganic materials 0.000 description 4
- 239000012044 organic layer Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 240000006829 Ficus sundaica Species 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/28—Adhesive materials or arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
- H05K2201/10136—Liquid Crystal display [LCD]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
- H10K59/1315—Interconnections, e.g. wiring lines or terminals comprising structures specially adapted for lowering the resistance
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
- Liquid Crystal (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
【解決手段】基板10には端子11が形成されている。端子上には異方性導電フィルム13が配置されている。フレキシブルプリント基板20は異方性導電フィルム13を通して端子11に接続されている。端子11には開口が形成され、この開口の内側に接着補強部14が形成されている。接着補強部14は、異方性導電フィルム13との間での接着性が端子11の表面を構成する材料よりも高い材料で形成され、異方性導電フィルム13に接着されている。
【選択図】図4
Description
Claims (9)
- 表示領域を有し、且つ前記表示領域の外側の領域に端子が形成されている基板と、
前記端子上に配置される異方性導電部材と、
前記異方性導電部材を通して前記端子に接続されるフレキシブルプリント基板と、
前記端子に形成されている開口と、
前記異方性導電部材との間での接着性が前記端子の表面を構成する材料よりも高い材料で形成され、前記端子の開口の内側に配置され、前記異方性導電部材に接着される第1接着補強部と、を備える
ことを特徴とする表示装置。 - 請求項1に記載の表示装置において、
前記基板の表示領域には複数の層を含む積層構造が形成されており、
前記第1接着補強部の材料は前記複数の層のうちいずれかの層の材料と同じである、
ことを特徴とする表示装置。 - 請求項1に記載の表示装置において、
前記基板は、前記表示領域の外側の領域に、前記第1接着補強部と同じ材料によって形成され且つ前記異方性導電部材と接着する2つの第2接着補強部が形成され、
前記端子は前記2つの第2接着補強部の間に配置されている、
ことを特徴とする表示装置。 - 請求項3に記載の表示装置において、
前記第1接着補強部の材料と前記第2接着補強部の材料は前記基板の表示領域に形成されている絶縁膜の材料と同じである、
ことを特徴とする表示装置。 - 請求項1に記載の表示装置において、
前記基板の端子の開口は前記フレキシブルプリント基板の端子の位置を避けた位置に形成されている、
ことを特徴とする表示装置。 - 請求項5に記載の表示装置において、
前記フレキシブルプリント基板は、前記フレキシブルプリント基板の端子として、前記基板の端子に接続される2つの端子を有し、
前記基板の端子に形成されている前記開口は、前記フレキシブルプリント基板の前記2つの端子の間に位置している、
ことを特徴とする表示装置。 - 請求項1に記載の表示装置において、
前記端子の前記開口の位置は前記端子の長さ方向における中心領域を避けている、
ことを特徴とする表示装置。 - 請求項7に記載の表示装置において、
前記基板の端子には、前記開口として、前記端子の長さ方向において離れて位置している第1開口と第2開口とが形成されている、
ことを特徴とする表示装置。 - 請求項1に記載の表示装置において、
前記開口が形成されている端子である第1端子と、
前記基板に形成され、前記異方性導電部材を介して前記フレキシブルプリント基板に接続される第2端子と、を有し、
前記第1端子は前記第2端子よりも大きな幅を有している、
ことを特徴とする表示装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014169758A JP6427360B2 (ja) | 2014-08-22 | 2014-08-22 | 表示装置 |
US14/823,509 US9685494B2 (en) | 2014-08-22 | 2015-08-11 | Organic EL display device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014169758A JP6427360B2 (ja) | 2014-08-22 | 2014-08-22 | 表示装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2016045371A true JP2016045371A (ja) | 2016-04-04 |
JP2016045371A5 JP2016045371A5 (ja) | 2017-08-17 |
JP6427360B2 JP6427360B2 (ja) | 2018-11-21 |
Family
ID=55348974
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014169758A Active JP6427360B2 (ja) | 2014-08-22 | 2014-08-22 | 表示装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US9685494B2 (ja) |
JP (1) | JP6427360B2 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10177129B2 (en) | 2016-06-30 | 2019-01-08 | Samsung Display Co., Ltd. | Display device with a chip on film |
JP2019008106A (ja) * | 2017-06-23 | 2019-01-17 | 三菱電機株式会社 | アレイ基板およびアレイ基板を備える表示パネル |
JP2019215477A (ja) * | 2018-06-14 | 2019-12-19 | 株式会社ジャパンディスプレイ | 半導体装置 |
WO2020071019A1 (ja) * | 2018-10-05 | 2020-04-09 | 株式会社ジャパンディスプレイ | 表示装置 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200145985A (ko) * | 2019-06-21 | 2020-12-31 | 삼성디스플레이 주식회사 | 표시 장치 및 표시 장치의 제조 방법 |
KR20210077105A (ko) * | 2019-12-16 | 2021-06-25 | 삼성디스플레이 주식회사 | 표시 장치 |
CN113053846B (zh) * | 2021-03-19 | 2023-04-11 | 云南创视界光电科技有限公司 | 芯片和具有其的显示模组 |
Citations (7)
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JPH0772508A (ja) * | 1993-06-14 | 1995-03-17 | Casio Comput Co Ltd | 薄膜トランジスタパネル |
JPH11133452A (ja) * | 1997-10-28 | 1999-05-21 | Nec Corp | 半導体デバイスおよびその製造方法 |
JPH11264998A (ja) * | 1998-03-18 | 1999-09-28 | Nec Corp | 配線端子およびその形成方法 |
JP2004333673A (ja) * | 2003-05-02 | 2004-11-25 | Hitachi Displays Ltd | 表示装置 |
JP2008241801A (ja) * | 2007-03-26 | 2008-10-09 | Epson Imaging Devices Corp | 電気光学装置用基板、この基板を用いた電気光学装置及びこの電気光学装置を搭載した電子機器。 |
WO2011074336A1 (ja) * | 2009-12-17 | 2011-06-23 | シャープ株式会社 | アクティブマトリクス基板、及び製造方法 |
US20120299888A1 (en) * | 2011-05-26 | 2012-11-29 | Sung Gyu Kim | Display panel |
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JP3139549B2 (ja) | 1999-01-29 | 2001-03-05 | 日本電気株式会社 | アクティブマトリクス型液晶表示装置 |
KR100538328B1 (ko) * | 2003-06-20 | 2005-12-22 | 엘지.필립스 엘시디 주식회사 | 액정표시장치 및 그 제조방법 |
KR20050093606A (ko) * | 2004-03-20 | 2005-09-23 | 삼성에스디아이 주식회사 | 전계 발광 디스플레이 장치 및 이의 제조 방법 |
KR101119196B1 (ko) * | 2005-02-16 | 2012-03-22 | 삼성전자주식회사 | 표시장치 및 이의 제조 방법 |
US7710739B2 (en) * | 2005-04-28 | 2010-05-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device |
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2014
- 2014-08-22 JP JP2014169758A patent/JP6427360B2/ja active Active
-
2015
- 2015-08-11 US US14/823,509 patent/US9685494B2/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0772508A (ja) * | 1993-06-14 | 1995-03-17 | Casio Comput Co Ltd | 薄膜トランジスタパネル |
JPH11133452A (ja) * | 1997-10-28 | 1999-05-21 | Nec Corp | 半導体デバイスおよびその製造方法 |
JPH11264998A (ja) * | 1998-03-18 | 1999-09-28 | Nec Corp | 配線端子およびその形成方法 |
JP2004333673A (ja) * | 2003-05-02 | 2004-11-25 | Hitachi Displays Ltd | 表示装置 |
JP2008241801A (ja) * | 2007-03-26 | 2008-10-09 | Epson Imaging Devices Corp | 電気光学装置用基板、この基板を用いた電気光学装置及びこの電気光学装置を搭載した電子機器。 |
WO2011074336A1 (ja) * | 2009-12-17 | 2011-06-23 | シャープ株式会社 | アクティブマトリクス基板、及び製造方法 |
US20120299888A1 (en) * | 2011-05-26 | 2012-11-29 | Sung Gyu Kim | Display panel |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10177129B2 (en) | 2016-06-30 | 2019-01-08 | Samsung Display Co., Ltd. | Display device with a chip on film |
US10651162B2 (en) | 2016-06-30 | 2020-05-12 | Samsung Display Co., Ltd. | Display device with a chip on film |
US11251173B2 (en) | 2016-06-30 | 2022-02-15 | Samsung Display Co., Ltd. | Display device with a chip on film |
JP2019008106A (ja) * | 2017-06-23 | 2019-01-17 | 三菱電機株式会社 | アレイ基板およびアレイ基板を備える表示パネル |
JP2019215477A (ja) * | 2018-06-14 | 2019-12-19 | 株式会社ジャパンディスプレイ | 半導体装置 |
WO2019239742A1 (ja) * | 2018-06-14 | 2019-12-19 | 株式会社ジャパンディスプレイ | 半導体装置 |
JP7062528B2 (ja) | 2018-06-14 | 2022-05-06 | 株式会社ジャパンディスプレイ | 半導体装置 |
WO2020071019A1 (ja) * | 2018-10-05 | 2020-04-09 | 株式会社ジャパンディスプレイ | 表示装置 |
JP7112930B2 (ja) | 2018-10-05 | 2022-08-04 | 株式会社ジャパンディスプレイ | 表示装置 |
Also Published As
Publication number | Publication date |
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US20160056222A1 (en) | 2016-02-25 |
US9685494B2 (en) | 2017-06-20 |
JP6427360B2 (ja) | 2018-11-21 |
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