JP2016021530A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP2016021530A JP2016021530A JP2014145372A JP2014145372A JP2016021530A JP 2016021530 A JP2016021530 A JP 2016021530A JP 2014145372 A JP2014145372 A JP 2014145372A JP 2014145372 A JP2014145372 A JP 2014145372A JP 2016021530 A JP2016021530 A JP 2016021530A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 124
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- 229910052751 metal Inorganic materials 0.000 claims description 53
- 239000002184 metal Substances 0.000 claims description 53
- 230000004888 barrier function Effects 0.000 claims description 39
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- 239000010936 titanium Substances 0.000 claims description 26
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 10
- 229910052719 titanium Inorganic materials 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 6
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- 229910016570 AlCu Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
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- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(iv) oxide Chemical compound O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 230000005533 two-dimensional electron gas Effects 0.000 description 1
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Abstract
【解決手段】ドレイン電極DEは、ドレインパッドDPの側面DSFに部分的に形成されている。この場合にドレイン電極DEは、ドレインパッドDPと一体であり、平面視で側面DSFから第1方向(y方向)に延伸している。ドレイン電極DEと平面視で重なる領域には、凹部DREが位置している。凹部DREには、ドレイン電極DEの少なくとも一部が埋め込まれる。凹部DREのうちドレインパッドDPに面する側面(側面RDS)は、第1方向(y方向)で見て、ドレインパッドDPに入り込んでいる。
【選択図】図4
Description
図1は、第1の実施形態に係る半導体装置SDの構成を示す平面図である。図2は、図1のA−A´断面図である。図3は、図1のB−B´断面図である。図2及び図3に示すように、半導体装置SDは、半導体基板SMS、バッファ層BUF、窒化物半導体層NSL(第1窒化物半導体層NSL1及び第2窒化物半導体層NSL2)、保護絶縁層PIL(例えば、シリコン窒化膜(SiN))、及び層間絶縁膜ILD(例えば、シリコン酸化膜(SiO2))を備えている。半導体基板SMS、バッファ層BUF、第1窒化物半導体層NSL1、及び第2窒化物半導体層NSL2、保護絶縁層PIL、及び層間絶縁膜ILDは、この順で積層されている。
図21は、第2の実施形態に係る半導体装置SDの構成を示す平面図であり、第1の実施形態の図1と対応する。本実施形態に係る半導体装置SDは、以下の点を除いて、第1の実施形態に係る半導体装置SDと同様の構成である。
図24は、第3の実施形態に係る半導体装置SDの構成を示す平面図であり、第1の実施形態の図1と対応する。本実施形態に係る半導体装置SDは、以下の点を除いて、第1の実施形態に係る半導体装置SDと同様の構成である。
図27は、図1の変形例を示す図である。本図に示すように、複数の凹部DREがドレイン電極DEに沿って配置されていてもよい。同様に、複数の凹部SREがソース電極SEに沿って配置されていてもよい。言い換えると、凹部DREは、ドレイン電極DEに沿って延伸していなくてもよい。同様に、凹部SREは、ソース電極SEに沿って延伸していなくてもよい。なお、本図に示す例において、凹部REC(凹部DRE及び凹部SRE)の平面形状は矩形である。ただし、凹部RECの平面形状は本図に示す例に限定されるものではない。
BM1 金属膜
BUF バッファ層
CL キャップ層
DBM バリアメタル膜
DE ドレイン電極
DP ドレインパッド
DRE 凹部
DSF 側面
GE ゲート電極
GE1 導電膜
GI ゲート絶縁膜
GI1 絶縁膜
GL ゲート配線
GP ゲートパッド
GRE 凹部
ILD 層間絶縁膜
MF 金属膜
NSL 窒化物半導体層
NSL1 第1窒化物半導体層
NSL2 第2窒化物半導体層
PIL 保護絶縁層
RDS 側面
REC 凹部
RSS 側面
SBM バリアメタル膜
SD 半導体装置
SE ソース電極
SMS 半導体基板
SP ソースパッド
SRE 凹部
SSF 側面
TR トランジスタ
Claims (8)
- 窒化物半導体層と、
前記窒化物半導体層上に位置する層間絶縁膜と、
前記層間絶縁膜上に位置する配線と、
前記配線と一体であり、かつ前記配線の第1側面に部分的に形成され、平面視で前記第1側面から第1方向に延伸している電極と、
平面視で前記電極と重なる領域に位置し、前記層間絶縁膜に形成され、下端が前記窒化物半導体層に達し、前記電極の少なくとも一部が埋め込まれている凹部と、
前記凹部の底面及び側面、前記配線の底面、並びに前記電極の底面に沿って形成されたバリアメタル膜と、
を備え、
前記配線及び前記電極は、アルミニウムを含んでおり、
前記バリアメタル膜は、チタンを含んでおり、
前記凹部のうち前記配線に面する側面は、前記第1方向で見て、前記配線の前記第1側面に達し、又は前記配線に入り込んでいる半導体装置。 - 請求項1に記載の半導体装置において、
平面視で前記第1方向と交わる第2方向にドレイン、ゲート電極、及びソースがこの順で並んだ第1トランジスタと、
前記第2方向に延伸しているドレインパッドと、
前記ドレインパッドから前記第2方向に延伸し、前記ドレインに電気的に接続しているドレイン電極と、
前記第1方向に前記ドレイン電極を介して前記ドレインパッドと対向し、前記第2方向に延伸しているソースパッドと、
前記ソースパッドから前記ドレインパッド側に向かって前記第1方向に延伸し、前記ソースに電気的に接続しているソース電極と、
を備え、
前記配線及び前記電極は、
それぞれ、前記ドレインパッド及び前記ドレイン電極であり、又は
それぞれ、前記ソースパッド及び前記ソース電極である半導体装置。 - 請求項2に記載の半導体装置において、
平面視でドレイン、ゲート電極、及びソースが前記第2方向に前記第1トランジスタと逆の順で並び、前記ソースが前記第1トランジスタの前記ソースと同一の前記ソース電極に電気的に接続している第2トランジスタと、
平面視で前記ドレイン電極に比して前記ソースパッド側に位置し、前記第1トランジスタの前記ゲート電極と前記第2トランジスタの前記ゲート電極を接続しているゲート配線と、
を備え、
前記配線及び前記電極は、それぞれ、前記ソースパッド及び前記ソース電極であり、
平面視において、前記凹部は、前記第1トランジスタの前記ゲート電極と前記第2トランジスタの前記ゲート電極によって挟まれ、かつ前記ゲート配線に比して前記ドレインパッド側に位置しており、
前記ゲート配線、前記第1側面、及び前記ソース電極がこの順で前記第1方向に並んでいる半導体装置。 - 請求項2に記載の半導体装置において、
前記配線及び前記電極は、それぞれ、前記ドレインパッド及び前記ドレイン電極であり、
前記ソース電極の幅が前記ドレイン電極の幅よりも広い半導体装置。 - 請求項4に記載の半導体装置において、
前記ソース電極は、前記ゲート電極の少なくとも一部と平面視で重なっている半導体装置。 - 請求項1に記載の半導体装置において、
前記バリアメタル膜は、チタンからなる単層膜である半導体装置。 - 請求項6に記載の半導体装置において、
前記バリアメタル膜と前記電極の間に、窒化チタンからなる膜が含まれていない半導体装置。 - 請求項6に記載の半導体装置において、
前記バリアメタル膜は、前記電極に直接接続している半導体装置。
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EP15175414.0A EP2975647B1 (en) | 2014-07-15 | 2015-07-06 | Semiconductor device |
TW104122141A TW201607047A (zh) | 2014-07-15 | 2015-07-08 | 半導體裝置 |
KR1020150099586A KR20160008979A (ko) | 2014-07-15 | 2015-07-14 | 반도체 장치 |
CN202110012100.6A CN112820770A (zh) | 2014-07-15 | 2015-07-14 | 半导体器件 |
CN201510413155.2A CN105280690B (zh) | 2014-07-15 | 2015-07-14 | 半导体器件 |
US14/800,207 US9293457B2 (en) | 2014-07-15 | 2015-07-15 | Semiconductor device |
US15/055,604 US9722066B2 (en) | 2014-07-15 | 2016-02-28 | Semiconductor device |
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EP2975647B1 (en) | 2018-05-23 |
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US9722066B2 (en) | 2017-08-01 |
US10074740B2 (en) | 2018-09-11 |
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US20160181411A1 (en) | 2016-06-23 |
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