JP2016012583A5 - - Google Patents

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Publication number
JP2016012583A5
JP2016012583A5 JP2014132028A JP2014132028A JP2016012583A5 JP 2016012583 A5 JP2016012583 A5 JP 2016012583A5 JP 2014132028 A JP2014132028 A JP 2014132028A JP 2014132028 A JP2014132028 A JP 2014132028A JP 2016012583 A5 JP2016012583 A5 JP 2016012583A5
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JP
Japan
Prior art keywords
gas
valve
plasma processing
processing apparatus
controlling
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JP2014132028A
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English (en)
Japanese (ja)
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JP2016012583A (ja
JP6318027B2 (ja
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Priority to JP2014132028A priority Critical patent/JP6318027B2/ja
Priority claimed from JP2014132028A external-priority patent/JP6318027B2/ja
Publication of JP2016012583A publication Critical patent/JP2016012583A/ja
Publication of JP2016012583A5 publication Critical patent/JP2016012583A5/ja
Application granted granted Critical
Publication of JP6318027B2 publication Critical patent/JP6318027B2/ja
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JP2014132028A 2014-06-27 2014-06-27 プラズマ処理装置 Active JP6318027B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014132028A JP6318027B2 (ja) 2014-06-27 2014-06-27 プラズマ処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014132028A JP6318027B2 (ja) 2014-06-27 2014-06-27 プラズマ処理装置

Publications (3)

Publication Number Publication Date
JP2016012583A JP2016012583A (ja) 2016-01-21
JP2016012583A5 true JP2016012583A5 (enExample) 2017-02-16
JP6318027B2 JP6318027B2 (ja) 2018-04-25

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ID=55229130

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JP2014132028A Active JP6318027B2 (ja) 2014-06-27 2014-06-27 プラズマ処理装置

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JP (1) JP6318027B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9972478B2 (en) * 2016-09-16 2018-05-15 Lam Research Corporation Method and process of implementing machine learning in complex multivariate wafer processing equipment
JP2021174902A (ja) * 2020-04-27 2021-11-01 東京エレクトロン株式会社 処理方法及び基板処理装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003161281A (ja) * 2001-11-28 2003-06-06 Tokyo Electron Ltd 真空処理装置
JP4908045B2 (ja) * 2006-04-17 2012-04-04 株式会社日立ハイテクノロジーズ プラズマ処理方法およびプラズマ処理装置
JP5235293B2 (ja) * 2006-10-02 2013-07-10 東京エレクトロン株式会社 処理ガス供給機構および処理ガス供給方法ならびにガス処理装置
JP4815538B2 (ja) * 2010-01-15 2011-11-16 シーケーディ株式会社 真空制御システムおよび真空制御方法
JP5528363B2 (ja) * 2011-01-20 2014-06-25 パナソニック株式会社 プラズマ処理方法及びプラズマ処理装置
JP2011166167A (ja) * 2011-05-16 2011-08-25 Hitachi High-Technologies Corp プラズマエッチング装置およびプラズマエッチング方法

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