JP2015537378A - 溶液プロセスによる量子ドットを利用した中間帯半導体、ヘテロ接合、及び光電子デバイス、並びに関連する方法 - Google Patents
溶液プロセスによる量子ドットを利用した中間帯半導体、ヘテロ接合、及び光電子デバイス、並びに関連する方法 Download PDFInfo
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- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000003574 free electron Substances 0.000 description 1
- 229910052949 galena Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- HRHKULZDDYWVBE-UHFFFAOYSA-N indium;oxozinc;tin Chemical compound [In].[Sn].[Zn]=O HRHKULZDDYWVBE-UHFFFAOYSA-N 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- XCAUINMIESBTBL-UHFFFAOYSA-N lead(ii) sulfide Chemical compound [Pb]=S XCAUINMIESBTBL-UHFFFAOYSA-N 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000012705 liquid precursor Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910021392 nanocarbon Inorganic materials 0.000 description 1
- 238000007709 nanocrystallization Methods 0.000 description 1
- 238000005329 nanolithography Methods 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 230000001443 photoexcitation Effects 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- VVOPUZNLRVJDJQ-UHFFFAOYSA-N phthalocyanine copper Chemical compound [Cu].C12=CC=CC=C2C(N=C2NC(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2N1 VVOPUZNLRVJDJQ-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001467 poly(styrenesulfonates) Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 229910002059 quaternary alloy Inorganic materials 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004054 semiconductor nanocrystal Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 150000003623 transition metal compounds Chemical class 0.000 description 1
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 1
- VLCQZHSMCYCDJL-UHFFFAOYSA-N tribenuron methyl Chemical compound COC(=O)C1=CC=CC=C1S(=O)(=O)NC(=O)N(C)C1=NC(C)=NC(OC)=N1 VLCQZHSMCYCDJL-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000009489 vacuum treatment Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
本出願は、参照により内容全体が本出願に組み込まれている、2012年10月26日に出願された米国特許仮出願第61/718,786号、件名「溶液プロセスによる量子ドットを利用した中間帯半導体、ヘテロ接合、及び光電子デバイス、並びに関連する方法(INTERMEDIATE BAND SEMICONDUCTORS, HETEROJUNCTIONS, AND OPTOELECTRONIC DEVICES UTILIZING SOLUTION PROCESSED QUANTUM DOTS, AND RELATED METHODS)」の優先権を主張するものである。
Claims (41)
- 第1の電極と、
前記第1の電極上に配置され、複数の第1のコロイド量子ドットと複数の第2のコロイド量子ドットとを含むコロイド量子ドットアセンブリ層であって、前記第2の量子ドットは、前記第1の量子ドットよりも数が少なく、前記複数の第1の量子ドットの全体にわたって分散し、前記第2の量子ドットは、サイズ又は組成が前記第1の量子ドットと異なり、前記第2の量子ドットは、第1の励起子ピーク波長が、前記第1の量子ドットの第1の励起子ピーク波長よりも長く、前記不連続半導体層は、価電子帯と、伝導帯と、前記価電子帯と前記伝導帯との間のバンドギャップ内にエネルギ準位を有する中間帯と、を含む、前記コロイド量子ドットアセンブリ層と、
前記コロイド量子ドットアセンブリ層の上に直接配置された電子受容体層であって、前記コロイド量子ドットアセンブリ層及び前記電子受容体層は電子的ヘテロ接合を形成する、前記電子受容体層と、
前記電子受容体層の上に配置された第2の電極と、
を備える光電子デバイス。 - 前記中間帯のエネルギ準位は、条件0.20<Ex<0.80を満足し、Ex=(EIB−EVB)/(ECB−EVB)であり、EIB、EVB、及びECBは、それぞれ、前記中間帯、前記ホスト価電子帯、及び前記ホスト伝導帯のエネルギ準位である、請求項1に記載の光電子デバイス。
- 前記中間帯は、前記価電子帯及び前記伝導帯の両方から、4kTより大きいバンドギャップだけ離れており、kはボルツマン定数であり、Tは前記コロイド量子ドットアセンブリ層の温度である、請求項1に記載の光電子デバイス。
- 前記第1の量子ドット及び前記第2の量子ドットの総数に対する前記第2の量子ドットの数の比率が0.05から0.4の範囲である、請求項1に記載の光電子デバイス。
- 前記不連続半導体層は、前記中間帯において、10マイクロ秒を超えるキャリア存続時間を有する、請求項1に記載の光電子デバイス。
- 前記第2の量子ドットは、組成が前記第1の量子ドットと同じであり、サイズが前記第1の量子ドットより大きい、請求項1に記載の光電子デバイス。
- 前記第2の量子ドットの分散はランダムである、請求項1に記載の光電子デバイス。
- 前記第1の量子ドット及び前記第2の量子ドットは、可視光感光性材料、赤外線感光性材料、紫外線感光性材料、II−VI族材料、I−III−VI族材料、III−V族材料、IV族材料、IV−VI族材料、V−VI族材料、及びこれらのうちの2つ以上の組み合わせ又は合金からなる群から選択される組成を有する、請求項1に記載の光電子デバイス。
- 前記量子ドットは、硫化鉛、セレン化鉛、テルル化鉛、テルル化水銀、硫化カドミウム、セレン化カドミウム、テルル化カドミウム、及びこれらの合金からなる群から選択される組成を有する、請求項1に記載の光電子デバイス。
- 前記コロイド量子ドットアセンブリ層は、厚さが5nmから5μmの範囲である、請求項1に記載の光電子デバイス。
- 前記コロイド量子ドットアセンブリ層は、粒子間間隔が2nm未満である、請求項1に記載の光電子デバイス。
- 前記電子受容体層は、フラーレン又は半導体酸化物を含む、請求項1に記載の光電子デバイス。
- 前記電子受容体層は、酸化チタン、酸化亜鉛、酸化スズ、又はこれらの合金からなる群から選択される半導体酸化物を含む、請求項1に記載の光電子デバイス。
- 前記電子受容体層は、厚さが3nmから300nmの範囲である、請求項1に記載の光電子デバイス。
- 前記第1の電極上に配置された電子阻止層を備え、前記コロイド量子ドットアセンブリ層は、前記電子阻止層上に配置される、請求項1に記載の光電子デバイス。
- 前記電子阻止層は、酸化モリブデン、酸化タングステン、酸化銅、酸化ニッケル、フタロシアニン、m−MTDATA、α−NPD、量子ドット、並びにこれらの化学的類縁物及び化学的派生物からなる群から選択される組成を有する、請求項15に記載の光電子デバイス。
- 前記電子受容体層上に配置された正孔阻止層を備え、前記第2の電極は、前記正孔阻止層上に配置される、請求項1に記載の光電子デバイス。
- 前記正孔阻止層は、酸化チタン、酸化亜鉛、酸化スズ、BCP、BPhen、NBPhen、金属キレート、並びにこれらの化学的類縁物及び化学的派生物からなる群から選択される組成を有する、請求項17に記載の光電子デバイス。
- 前記第1の電極と前記コロイド量子ドットアセンブリ層との間に配置された、前記第1の量子ドットの層を備える、請求項1に記載の光電子デバイス。
- 前記コロイド量子ドットアセンブリ層と前記電子受容体層との間に配置された、前記第1の量子ドットの層を備える、請求項1に記載の光電子デバイス。
- 光電子デバイスの組み立て方法であって、
溶媒、複数の第1の量子ドット、及び複数の第2の量子ドットを含む溶液を、電極を備える基板の上に堆積させることによってコロイド量子ドットアセンブリ層を形成するステップであって、前記第2の量子ドットは、前記第1の量子ドットよりも数が少なく、前記複数の第1の量子ドットの全体にわたって分散し、前記第2の量子ドットは、サイズ又は組成が前記第1の量子ドットと異なり、前記第2の量子ドットは、第1の励起子ピーク波長が、前記第1の量子ドットの第1の励起子ピーク波長よりも長く、前記コロイド量子ドットアセンブリ層は、価電子帯と、伝導帯と、前記価電子帯と前記伝導帯との間のバンドギャップ内にエネルギ準位を有する中間帯と、を含む、前記ステップと、
前記コロイド量子ドットアセンブリ層の上に電子受容体層を直接堆積させるステップであって、前記コロイド量子ドットアセンブリ層及び前記電子受容体層は電子的ヘテロ接合を形成する、前記ステップと、
を含む方法。 - 前記中間帯のエネルギ準位は、条件0.20<Ex<0.80を満足し、Ex=(EIB−EVB)/(ECB−EVB)であり、EIB、EVB、及びECBは、それぞれ、前記中間帯、前記ホスト価電子帯、及び前記ホスト伝導帯のエネルギ準位である、請求項21に記載の方法。
- 前記中間帯は、前記価電子帯及び前記伝導帯の両方から、4kTより大きいバンドギャップだけ離れており、kはボルツマン定数であり、Tは前記コロイド量子ドットアセンブリ層の温度である、請求項21に記載の方法。
- 前記第1の量子ドット及び前記第2の量子ドットの総数に対する前記第1の量子ドットの数の比率が0.05から0.4の範囲である、請求項21に記載の方法。
- 前記コロイド量子ドットアセンブリ層は、前記中間帯において、10マイクロ秒を超えるキャリア存続時間を有する、請求項21に記載の方法。
- 前記第2の量子ドットは、組成が前記第1の量子ドットと同じであり、サイズが前記第1の量子ドットより大きい、請求項21に記載の方法。
- 前記コロイド量子ドットアセンブリ層を堆積させる前記ステップは、前記複数の第1の量子ドットの全体にわたって前記第2の量子ドットをランダムに分散させるステップを含む、請求項21に記載の方法。
- 前記溶媒は、トルエン、アニソール、アルカン、ブチルアミン、及び水からなる群から選択される、請求項21に記載の方法。
- 第1の溶液内に前記第1の量子ドットを形成するステップと、第2の溶液内に前記第2の量子ドットを形成するステップと、前記第1の溶液と前記第2の溶液とを混合して、前記第1の量子ドットと前記第2の量子ドットとの混合物を形成するステップと、を含み、前記コロイド量子ドットアセンブリ層を堆積させる前記ステップは、前記混合物を前記電子阻止層上に堆積させるステップを含む、請求項21に記載の方法。
- 前記第1の量子ドット及び前記第2の量子ドットを溶液又は蒸気で処理するステップを含み、前記溶液又は蒸気は、エタンチオール、アルキルチオール、アルケニルチオール、アルキニルチオール、アリールチオール、エタンジチオール、ベンゼンジチオール、アルキルポリチオール、アルケニルポリチオール、アルキニルポリチオール、アリールポリチオール、カルボン酸、ギ酸、メタノール、トルエン、イソプロピルアルコール、クロロホルム、アセトニトリル、酢酸、ブチルアミン、1,4ブチルジアミン、アルキルアミン、アルケニルアミン、アルキニルアミン、アリールアミン、アルキルポリアミン、アルケニルポリアミン、アルキニルポリアミン、アリールポリアミン、及びこれらのうちの2つ以上を組み合わせたものからなる群から選択される組成を有する、請求項21に記載の方法。
- 前記第1の量子ドット及び前記第2の量子ドットを処理する前記ステップによって、量子ドット間の粒子間間隔が減少するか、前記コロイド量子ドットアセンブリ層の堆積直後の厚さが減少するか、前記粒子間間隔及び前記堆積直後の厚さの両方が減少する、請求項30に記載の方法。
- 前記第1の量子ドット及び前記第2の量子ドットを処理する前記ステップによって、量子ドット間の粒子間間隔が2nm以下まで減少するか、前記コロイド量子ドットアセンブリ層の堆積直後の厚さが20%から80%減少するか、前記粒子間間隔が2nm以下まで減少し、且つ、前記堆積直後の厚さが20%から80%減少する、請求項31に記載の方法。
- 前記電子受容体層は、フラーレン又は半導体酸化物を含む、請求項21に記載の方法。
- 前記基板は更に、前記電極上に電子阻止層を備え、前記コロイド量子ドットアセンブリ層は、前記電子阻止層上に形成される、請求項21に記載の方法。
- 前記電子受容体層上に正孔阻止層又は励起子阻止層を堆積させるステップを含む、請求項21に記載の方法。
- 前記溶液を堆積させる前記ステップは、スピンコーティング、印刷、ドクターブレーディング、又はスプレーを含む、請求項21に記載の方法。
- 請求項21に記載の方法に従って組み立てられる光電子デバイス。
- コロイド量子ドットアセンブリを形成する複数の第1のコロイド量子ドットと、複数の第2のコロイド量子ドットと、を含む半導体材料であって、前記第2の量子ドットは、前記第1の量子ドットよりも数が少なく、前記複数の第1の量子ドットの全体にわたって分散し、前記第2の量子ドットは、サイズ又は組成が前記第1の量子ドットと異なり、前記第2の量子ドットは、第1の励起子ピーク波長が、前記第1の量子ドットの第1の励起子ピーク波長よりも長く、前記半導体材料は、価電子帯と、伝導帯と、前記価電子帯と前記伝導帯との間のバンドギャップ内にエネルギ準位を有する中間帯と、を含む、前記半導体材料。
- 請求項38に記載の半導体材料と、前記半導体材料上に直接配置された電子受容体層と、を含む電子的ヘテロ接合。
- 溶媒、複数の第1の量子ドット、及び複数の第2の量子ドットを含む溶液を基板上に堆積させるステップを含む、半導体材料の組み立て方法であって、前記第2の量子ドットは、前記第1の量子ドットよりも数が少なく、前記複数の第1の量子ドットの全体にわたって分散し、前記堆積された第1の量子ドットはコロイド量子ドットアセンブリを形成し、前記第2の量子ドットは、サイズ又は組成が前記第1の量子ドットと異なり、前記第2の量子ドットは、第1の励起子ピーク波長が、前記第1の量子ドットの第1の励起子ピーク波長よりも長く、前記半導体材料は、価電子帯と、伝導帯と、前記価電子帯と前記伝導帯との間のバンドギャップ内にエネルギ準位を有する中間帯と、を含む、前記方法。
- 電子的ヘテロ接合の組み立て方法であって、請求項40に記載の半導体材料の上に電子受容体層を直接堆積させるステップを含む方法。
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