JP2015533256A5 - - Google Patents
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- JP2015533256A5 JP2015533256A5 JP2015535869A JP2015535869A JP2015533256A5 JP 2015533256 A5 JP2015533256 A5 JP 2015533256A5 JP 2015535869 A JP2015535869 A JP 2015535869A JP 2015535869 A JP2015535869 A JP 2015535869A JP 2015533256 A5 JP2015533256 A5 JP 2015533256A5
- Authority
- JP
- Japan
- Prior art keywords
- interest
- feature
- angle
- sample
- ion beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261710376P | 2012-10-05 | 2012-10-05 | |
| US61/710,376 | 2012-10-05 | ||
| PCT/US2013/063704 WO2014055982A1 (en) | 2012-10-05 | 2013-10-07 | Bulk deposition for tilted mill protection |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015533256A JP2015533256A (ja) | 2015-11-19 |
| JP2015533256A5 true JP2015533256A5 (enExample) | 2016-12-01 |
| JP6199979B2 JP6199979B2 (ja) | 2017-09-20 |
Family
ID=50435506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015535869A Active JP6199979B2 (ja) | 2012-10-05 | 2013-10-07 | 傾斜ミリング保護のためのバルク付着 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9412560B2 (enExample) |
| EP (1) | EP2903773B1 (enExample) |
| JP (1) | JP6199979B2 (enExample) |
| KR (1) | KR102039528B1 (enExample) |
| CN (1) | CN104822482B (enExample) |
| TW (1) | TWI607498B (enExample) |
| WO (1) | WO2014055982A1 (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI612551B (zh) | 2012-10-05 | 2018-01-21 | Fei公司 | 在帶電粒子束樣品的製備減少屏幕效應之方法及系統 |
| JP6199979B2 (ja) * | 2012-10-05 | 2017-09-20 | エフ・イ−・アイ・カンパニー | 傾斜ミリング保護のためのバルク付着 |
| KR102155834B1 (ko) | 2012-10-05 | 2020-09-14 | 에프이아이 컴파니 | 높은 종횡비 구조 분석 |
| TWI643235B (zh) * | 2012-12-31 | 2018-12-01 | 美商Fei公司 | 用於具有一帶電粒子束之傾斜或偏斜硏磨操作之基準設計 |
| US9564291B1 (en) * | 2014-01-27 | 2017-02-07 | Mochii, Inc. | Hybrid charged-particle beam and light beam microscopy |
| CN105300754B (zh) * | 2015-09-11 | 2019-06-28 | 上海华力微电子有限公司 | 一种防止tem芯片样品破裂的方法 |
| US9625398B1 (en) | 2016-01-11 | 2017-04-18 | International Business Machines Corporation | Cross sectional depth composition generation utilizing scanning electron microscopy |
| US10242842B2 (en) * | 2016-03-25 | 2019-03-26 | Hitachi High-Tech Science Corporation | Method for cross-section processing and observation and apparatus therefor |
| US10324049B2 (en) | 2017-02-15 | 2019-06-18 | Saudi Arabian Oil Company | Rock sample preparation method by using focused ion beam for minimizing curtain effect |
| US10546719B2 (en) * | 2017-06-02 | 2020-01-28 | Fei Company | Face-on, gas-assisted etching for plan-view lamellae preparation |
| DE102017212020B3 (de) * | 2017-07-13 | 2018-05-30 | Carl Zeiss Microscopy Gmbh | Verfahren zur In-situ-Präparation und zum Transfer mikroskopischer Proben, Computerprogrammprodukt sowie mikroskopische Probe |
| KR102537699B1 (ko) * | 2017-12-26 | 2023-05-26 | 삼성전자주식회사 | 반도체 장치의 검사 방법 |
| US11177110B2 (en) * | 2018-02-06 | 2021-11-16 | Howard Hughes Medical Institute | Volume scanning electron microscopy of serial thick tissue sections with gas cluster milling |
| US10811219B2 (en) * | 2018-08-07 | 2020-10-20 | Applied Materials Israel Ltd. | Method for evaluating a region of an object |
| DE102018120630B3 (de) | 2018-08-23 | 2019-10-31 | Carl Zeiss Microscopy Gmbh | Verfahren zum Bearbeiten eines Objekts und Programm zur Steuerung eines Partikelstrahlsystems |
| JP7305422B2 (ja) * | 2019-05-13 | 2023-07-10 | 株式会社日立ハイテク | パターン評価システム及びパターン評価方法 |
| US11501951B1 (en) | 2021-05-14 | 2022-11-15 | Applied Materials Israel Ltd. | X-ray imaging in cross-section using un-cut lamella with background material |
| US20230196189A1 (en) * | 2021-12-20 | 2023-06-22 | Carl Zeiss Smt Gmbh | Measurement method and apparatus for semiconductor features with increased throughput |
| WO2023117238A1 (en) * | 2021-12-20 | 2023-06-29 | Carl Zeiss Smt Gmbh | Measurement method and apparatus for semiconductor features with increased throughput |
| US12437965B1 (en) * | 2022-08-01 | 2025-10-07 | Mochil, Inc. | Charged-particle beam microscope with differential vacuum pressures |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5435850A (en) | 1993-09-17 | 1995-07-25 | Fei Company | Gas injection system |
| US5851413A (en) | 1996-06-19 | 1998-12-22 | Micrion Corporation | Gas delivery systems for particle beam processing |
| US6268608B1 (en) * | 1998-10-09 | 2001-07-31 | Fei Company | Method and apparatus for selective in-situ etching of inter dielectric layers |
| US6373070B1 (en) | 1999-10-12 | 2002-04-16 | Fei Company | Method apparatus for a coaxial optical microscope with focused ion beam |
| US6905623B2 (en) * | 2000-12-15 | 2005-06-14 | Credence Systems Corporation | Precise, in-situ endpoint detection for charged particle beam processing |
| US6621081B2 (en) * | 2001-01-10 | 2003-09-16 | International Business Machines Corporation | Method of pole tip sample preparation using FIB |
| US6911832B2 (en) | 2003-07-16 | 2005-06-28 | Texas Instruments Incorporated | Focused ion beam endpoint detection using charge pulse detection electronics |
| US7611610B2 (en) * | 2003-11-18 | 2009-11-03 | Fei Company | Method and apparatus for controlling topographical variation on a milled cross-section of a structure |
| JP2006228593A (ja) * | 2005-02-18 | 2006-08-31 | Seiko Epson Corp | 断面観察方法 |
| US7442924B2 (en) * | 2005-02-23 | 2008-10-28 | Fei, Company | Repetitive circumferential milling for sample preparation |
| JP2006331847A (ja) * | 2005-05-26 | 2006-12-07 | Hitachi High-Technologies Corp | イオンビーム加工・観察装置及び方法 |
| JP4685627B2 (ja) * | 2005-12-28 | 2011-05-18 | 株式会社日立ハイテクノロジーズ | 試料加工方法 |
| JP5873227B2 (ja) * | 2007-12-06 | 2016-03-01 | エフ・イ−・アイ・カンパニー | デコレーションを用いたスライス・アンド・ビュー |
| DE102009001910A1 (de) * | 2009-03-26 | 2010-09-30 | Carl Zeiss Nts Gmbh | Verfahren und Vorrichtung zur Erzeugung dreidimensionaler Bilddaten |
| US8350237B2 (en) * | 2010-03-31 | 2013-01-08 | Fei Company | Automated slice milling for viewing a feature |
| CN103403520B (zh) * | 2011-01-28 | 2015-12-23 | Fei公司 | Tem样品制备 |
| EP2749863A3 (en) * | 2012-12-31 | 2016-05-04 | Fei Company | Method for preparing samples for imaging |
| US8912490B2 (en) * | 2011-06-03 | 2014-12-16 | Fei Company | Method for preparing samples for imaging |
| US8822921B2 (en) * | 2011-06-03 | 2014-09-02 | Fei Company | Method for preparing samples for imaging |
| US8859963B2 (en) * | 2011-06-03 | 2014-10-14 | Fei Company | Methods for preparing thin samples for TEM imaging |
| CN103797351B (zh) * | 2011-09-12 | 2019-11-05 | Fei 公司 | 掠射角铣削 |
| WO2013082496A1 (en) | 2011-12-01 | 2013-06-06 | Fei Company | High throughput tem preparation processes and hardware for backside thinning of cross-sectional view lamella |
| US8740209B2 (en) * | 2012-02-22 | 2014-06-03 | Expresslo Llc | Method and apparatus for ex-situ lift-out specimen preparation |
| EP2852967B1 (en) * | 2012-05-21 | 2019-01-16 | FEI Company | Preparation of lamellae for tem viewing |
| US9733164B2 (en) | 2012-06-11 | 2017-08-15 | Fei Company | Lamella creation method and device using fixed-angle beam and rotating sample stage |
| TWI612551B (zh) * | 2012-10-05 | 2018-01-21 | Fei公司 | 在帶電粒子束樣品的製備減少屏幕效應之方法及系統 |
| JP6199979B2 (ja) * | 2012-10-05 | 2017-09-20 | エフ・イ−・アイ・カンパニー | 傾斜ミリング保護のためのバルク付着 |
| KR102155834B1 (ko) * | 2012-10-05 | 2020-09-14 | 에프이아이 컴파니 | 높은 종횡비 구조 분석 |
| CN104885196B (zh) * | 2012-12-31 | 2018-02-06 | Fei 公司 | 带电粒子束系统以及使用带电粒子束诱发沉积来填充孔的方法 |
| US20150137003A1 (en) * | 2013-11-21 | 2015-05-21 | United Microelectronics Corp. | Specimen preparation method |
-
2013
- 2013-10-07 JP JP2015535869A patent/JP6199979B2/ja active Active
- 2013-10-07 CN CN201380063847.8A patent/CN104822482B/zh active Active
- 2013-10-07 WO PCT/US2013/063704 patent/WO2014055982A1/en not_active Ceased
- 2013-10-07 KR KR1020157011682A patent/KR102039528B1/ko active Active
- 2013-10-07 US US14/432,730 patent/US9412560B2/en active Active
- 2013-10-07 EP EP13843746.2A patent/EP2903773B1/en active Active
- 2013-10-07 TW TW102136309A patent/TWI607498B/zh active
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