JP2015532004A5 - - Google Patents

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Publication number
JP2015532004A5
JP2015532004A5 JP2015528515A JP2015528515A JP2015532004A5 JP 2015532004 A5 JP2015532004 A5 JP 2015532004A5 JP 2015528515 A JP2015528515 A JP 2015528515A JP 2015528515 A JP2015528515 A JP 2015528515A JP 2015532004 A5 JP2015532004 A5 JP 2015532004A5
Authority
JP
Japan
Prior art keywords
inorganic
substrate
flexible glass
glass substrate
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2015528515A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015532004A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2013/054473 external-priority patent/WO2014031372A1/en
Publication of JP2015532004A publication Critical patent/JP2015532004A/ja
Publication of JP2015532004A5 publication Critical patent/JP2015532004A5/ja
Ceased legal-status Critical Current

Links

JP2015528515A 2012-08-22 2013-08-12 フレキシブルガラス基板の処理 Ceased JP2015532004A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261691904P 2012-08-22 2012-08-22
US61/691,904 2012-08-22
PCT/US2013/054473 WO2014031372A1 (en) 2012-08-22 2013-08-12 Processing flexible glass substrates

Publications (2)

Publication Number Publication Date
JP2015532004A JP2015532004A (ja) 2015-11-05
JP2015532004A5 true JP2015532004A5 (enExample) 2016-09-08

Family

ID=49034218

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015528515A Ceased JP2015532004A (ja) 2012-08-22 2013-08-12 フレキシブルガラス基板の処理

Country Status (5)

Country Link
JP (1) JP2015532004A (enExample)
KR (1) KR20150046218A (enExample)
CN (1) CN104685627B (enExample)
TW (1) TWI589443B (enExample)
WO (1) WO2014031372A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3212588B1 (en) * 2014-10-31 2021-04-07 Corning Incorporated Dimensionally stable fast etching glasses
CN104992944B (zh) 2015-05-26 2018-09-11 京东方科技集团股份有限公司 一种柔性显示母板及柔性显示面板的制作方法
KR102649238B1 (ko) 2016-10-26 2024-03-21 삼성디스플레이 주식회사 표시패널, 이를 포함하는 적층 기판, 및 표시패널 제조방법
JP7091121B2 (ja) * 2018-04-18 2022-06-27 信越石英株式会社 石英ガラス板
CN108962028B (zh) * 2018-07-10 2020-03-31 云谷（固安）科技有限公司 柔性显示屏盖板、柔性显示模组和柔性显示装置
CN112297546A (zh) * 2019-07-24 2021-02-02 东旭光电科技股份有限公司 显示面板的制备方法
CN111393032B (zh) * 2020-04-13 2022-07-08 Oppo广东移动通信有限公司 微晶玻璃盖板、柔性屏组件、电子设备及微晶玻璃盖板加工方法
KR102815849B1 (ko) * 2020-11-02 2025-06-05 삼성디스플레이 주식회사 유연성 글라스 제조를 위한 유리적층 구조물 및 이의 제조방법
CN112582576A (zh) * 2020-12-10 2021-03-30 深圳市华星光电半导体显示技术有限公司 柔性基板制备方法及显示面板

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5281560A (en) * 1993-06-21 1994-01-25 Corning Incorporated Non-lead sealing glasses
CN1495523A (zh) * 1996-08-27 2004-05-12 ������������ʽ���� 转移方法和有源矩阵基板的制造方法
JP2000252342A (ja) * 1999-03-01 2000-09-14 Seiko Epson Corp 薄板の搬送方法および液晶パネルの製造方法
JP2004186201A (ja) * 2002-11-29 2004-07-02 Sekisui Chem Co Ltd 薄層ガラスパネルの取扱い方法
US20060207967A1 (en) * 2003-07-03 2006-09-21 Bocko Peter L Porous processing carrier for flexible substrates
JP2007036074A (ja) * 2005-07-29 2007-02-08 Toshiba Corp 半導体装置の製造方法
JP2006152308A (ja) * 2005-12-28 2006-06-15 Nitto Denko Corp 電子部品の切断方法
KR100820170B1 (ko) * 2006-08-30 2008-04-10 한국전자통신연구원 플렉시블 기판의 적층 방법
KR20110007134A (ko) * 2008-04-17 2011-01-21 아사히 가라스 가부시키가이샤 유리 적층체, 지지체를 부착한 표시 장치용 패널 및 이들의 제조 방법
KR101458901B1 (ko) * 2008-04-29 2014-11-10 삼성디스플레이 주식회사 가요성 표시 장치의 제조 방법
EP2351718A4 (en) * 2008-10-23 2013-05-08 Asahi Glass Co Ltd GLASS SUPPLY LAMINATED DEVICE AND METHOD FOR PRODUCING LAMINATE GLASS SUBSTRATE
US9063605B2 (en) * 2009-01-09 2015-06-23 Apple Inc. Thin glass processing using a carrier
JP2011003668A (ja) * 2009-06-17 2011-01-06 Seiko Epson Corp 素子の転写方法および電子機器の製造方法
JP2012064710A (ja) * 2010-09-15 2012-03-29 Asahi Glass Co Ltd 半導体素子の製造方法
JP2012109538A (ja) * 2010-10-29 2012-06-07 Tokyo Ohka Kogyo Co Ltd 積層体、およびその積層体の分離方法

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