WO2016095415A1 - 一种激光烧结设备及烧结方法 - Google Patents

一种激光烧结设备及烧结方法 Download PDF

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Publication number
WO2016095415A1
WO2016095415A1 PCT/CN2015/078754 CN2015078754W WO2016095415A1 WO 2016095415 A1 WO2016095415 A1 WO 2016095415A1 CN 2015078754 W CN2015078754 W CN 2015078754W WO 2016095415 A1 WO2016095415 A1 WO 2016095415A1
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laser sintering
sintered
heating
laser
glass
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PCT/CN2015/078754
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English (en)
French (fr)
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肖昂
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京东方科技集团股份有限公司
鄂尔多斯市源盛光电有限责任公司
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Priority to US14/888,341 priority Critical patent/US10205130B2/en
Publication of WO2016095415A1 publication Critical patent/WO2016095415A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements

Definitions

  • the present disclosure relates to the field of display manufacturing technology, and more particularly to a laser sintering apparatus and a sintering method.
  • An Organic Light-Emitting Diode (OLED) display device is a display device that autonomously emits light by a current-driven luminescent material. Since the luminescent materials in OLED displays are sensitive to temperature, air, and water, good packaging is critical to the lifetime and picture quality of OLED displays.
  • packaging technologies for OLED displays such as laser packaging, thin film packaging, and injection packaging. Among them, laser encapsulation technology is the most mature OLED packaging technology. Its main working principle is to use the precise and rapid temperature rise of laser to clamp on two glass substrates (one for cover glass and one for back with luminescent material and circuit pattern). A glass glue at a specific position between the plate glass) enables encapsulation of the two substrates.
  • the glass glue Due to the traditional laser sintering, the glass glue will instantly increase from room temperature to 800-1000 ° C, and then to room temperature. The rapid heating and cooling process will accumulate a certain shrinkage stress inside the glass glue, which will cause the glass glue. And the glass substrate encapsulated by the glass glue is easily cracked or even broken.
  • the choice of the second method is not limited to the mass production, so the two methods make the manufacture of OLED displays very limited.
  • An object of the disclosed technical solution is to provide a laser sintering apparatus and a sintering method for solving In the prior art display manufacturing process using a laser for sintering, the large shrinkage stress generated by laser sintering causes cracking or breakage of the material to be sintered.
  • the present disclosure provides a laser sintering apparatus, wherein the laser sintering apparatus includes:
  • a laser sintering head for outputting laser light to a portion of the material to be sintered disposed on the device to be sintered for laser sintering
  • Heating means for heating the portion of the material to be sintered and/or the portion of the sintered material before and/or after the laser sintering of the laser sintering head.
  • the laser sintering apparatus described above wherein the heating means is for heating a portion of the material to be sintered to 400 to 500 degrees before laser sintering of the laser sintering head.
  • the laser sintering apparatus described above wherein the laser sintering apparatus further comprises:
  • a support substrate for placing a device to be sintered wherein the heating device is disposed on the other side of the support substrate on which the device to be sintered is placed.
  • the laser sintering apparatus described above wherein a surface of the support substrate for placing the device to be sintered is provided with a ventilation duct, and the ventilation duct is disposed corresponding to a region of the material to be sintered, and is used for After the laser sintering of the laser sintering head is completed, the gas input to the region at a predetermined temperature is cooled.
  • the laser sintering apparatus described above wherein the heating device comprises an infrared generator, and the infrared light emitted by the infrared generator has a wavelength of 795 nm to 810 nm.
  • the laser sintering apparatus described above wherein the heating device is further provided with a mask plate on a side of the material to be sintered, an opening on the mask plate and a material to be sintered of the device to be sintered Partial correspondence.
  • the laser sintering apparatus described above wherein a mask is further disposed between the heating device and the support substrate, and the opening on the mask corresponds to a portion of the material to be sintered of the device to be sintered. .
  • the support substrate is a transparent substrate.
  • the laser sintering apparatus described above wherein the device to be sintered comprises opposite first sides and second sides, and the material to be sintered is disposed between the first side and the second side;
  • the laser sintering head is disposed opposite to the first side for outputting laser light toward the first side;
  • the heating device is disposed opposite to the second side for adding to the second side heat.
  • the laser sintering apparatus described above, wherein the laser sintering head and the heating device are disposed on the same side of the device to be sintered.
  • the present disclosure also provides a laser sintering method, the laser sintering method comprising:
  • Heating of the portion of the material to be sintered and/or the portion of the sintered material is performed before and/or after laser sintering.
  • the portion of the material to be sintered is heated to 400 to 500 degrees in the step of heating the portion of the material to be sintered before the laser sintering.
  • the laser sintering method described above uses an infrared generator to emit a wavelength of 795 nm to 810 nm in a step of heating the portion of the material to be sintered and/or the portion of the sintered material before and/or after laser sintering.
  • the infrared light is heated to the portion of the sintered material and/or the portion of the sintered material.
  • the laser sintering method further comprises:
  • the gas into which the sintered material is partially supplied with a predetermined temperature is cooled.
  • the portion of the sintered material is cooled at a temperature decreasing rate of 10 degrees/minute in a process of lowering a temperature at which a portion of the sintered material is supplied with a predetermined temperature.
  • laser sintering and heating are respectively performed on both sides of the material to be sintered of the apparatus to be sintered.
  • Figure 1 is a schematic view of the structure of a general display
  • FIG. 2 is a schematic view showing an application structure of a laser sintering apparatus according to a first embodiment of the present disclosure
  • FIG. 3 is a schematic view showing an application structure of a laser sintering apparatus according to a second embodiment of the present disclosure
  • FIG. 4 is a schematic view showing an application structure of a laser sintering apparatus according to a third embodiment of the present disclosure.
  • a laser sintering head for outputting laser light to a portion of the material to be sintered disposed on the device to be sintered for laser sintering
  • Heating means for heating the portion of the material to be sintered and/or the portion of the sintered material before and/or after the laser sintering of the laser sintering head reduces the laser by preheating a portion of the material to be sintered of the apparatus to be sintered before laser sintering, and/or annealing the portion of the sintered material after laser sintering by providing a heating device.
  • the temperature difference before sintering is compared with that of laser sintering and/or the decreasing speed of the temperature after laser sintering is reduced to reduce the stress on the material to be sintered and the device to be sintered, and to avoid cracking or even cracking of the device to be sintered due to shrinkage stress. Damage situation.
  • the device to be sintered comprises opposite first sides and second sides, the material to be sintered is disposed between the first side and the second side; the laser sintering head and the first a side oppositely disposed for outputting laser light toward the first side; the heating device is disposed opposite the second side for heating toward the second side; that is, the laser sintering head and the heating device are respectively Laser sintering and heating are performed on different sides of the device to be sintered.
  • the arrangement of the laser sintering head and the heating device is not limited to the above, and may be provided on the same side of the device to be sintered.
  • the laser sintering apparatus of the above structure of the present disclosure can be used for packaging of a display, and the glass glue part coated by the package is heated by a laser to melt and melt the glass glue to assemble the two parts of the display together. Therefore, when the device to be sintered is applied to a display package, the device to be sintered is a display to be packaged, and the material to be sintered is a glass glue.
  • FIG. 1 is a schematic structural view of a general display, including a back panel glass 1 and a cover glass 2 disposed oppositely and in parallel, wherein a device for realizing image display is disposed between the back panel glass 1 and the cover glass 2, for an OLED display
  • a device for realizing image display is disposed between the back panel glass 1 and the cover glass 2, for an OLED display
  • each of the illuminating work is disposed between the back glass 1 and the cover glass 2 Energy layer.
  • a glass paste 3 is applied to the frame portion of the back glass 1 , and the cover glass 2 is covered over the light-emitting functional layer, and then the upper surface of the cover glass 2 is coated with a glass paste portion for laser sintering.
  • the back sheet glass 1 and the cover glass 2 are consolidated together.
  • the first side and the second side of the above-mentioned display to be packaged are formed as the outer surface of the back sheet glass 1 or the cover glass 2 of the display to be packaged, in particular, the present disclosure.
  • the laser sintering head and the heating device of the laser sintering apparatus may be respectively located on the outer surface of the back sheet glass 1 and the outer surfaces of the cover glass 2, or may be located on the outer surface of the back sheet glass 1 or the cover glass 2 The same side of the outer surface.
  • FIG. 2 is a schematic diagram of an application structure of a laser sintering apparatus according to a first embodiment of the present disclosure.
  • the laser sintering head 10 and the heating device 20 are disposed above the cover glass 2 of the display, and the outer surface of the cover glass 2 is heated by the heating device 20, and the glass glue is heated.
  • the laser sintering head 10 After heating to a predetermined temperature, the laser sintering head 10 outputs laser light to a corresponding portion of the glass paste 3 on the outer surface of the cover glass 2, and performs laser sintering to consolidate the glass paste 3, and the cover glass 2 and the back glass 1 connected.
  • the temperature difference between the laser sintering and the laser sintering can be reduced to reduce the stress of the glass glue and the glass substrate, and the crack of the glass substrate due to the shrinkage stress is avoided. Even the damage.
  • the heating device 20 can further heat the corresponding portion of the cover glass 2 to the corresponding portion of the glass paste 3 after the laser sintering head 10 performs laser sintering.
  • the glass glue 3 is annealed to slowly lower the glass glue 3, further reducing the stress of the glass glue and the glass substrate, and avoiding the effects of cracks or even damage due to shrinkage stress.
  • the heating device 20 may be an infrared generator that is heated by infrared light, or may be a laser generator. Like the laser sintering head 10, the laser is used for heating.
  • the heating device 20 preheats the glass paste 3 at a temperature of 400 to 500 degrees before the laser sintering head 10 is sintered; and the sintering is completed at the laser sintering head 10.
  • the temperature at the time of annealing is also 400 to 500 degrees; in addition, when the glass paste 3 is sintered by the laser sintering head 10, the temperature reached by the glass paste 3 is 800 to 1000 degrees.
  • the laser sintering head 10 and the heating device 20 are on the same side of the display The surface is heated. It should be noted that the laser sintering head 10 and the heating device 20 can be simultaneously disposed on both sides with respect to the display, that is, the laser sintering head 10 and the heating device 20 are provided on both sides of the display, thereby achieving the glass glue 3 Heat cured effect.
  • the present disclosure also provides the laser sintering apparatus of the second embodiment.
  • the laser sintering head 10 and the heating device 20 are disposed on both sides of the display as compared with the laser sintering apparatus of the first embodiment.
  • the laser sintering head 10 is disposed on the upper side of the display for outputting laser light to the corresponding portion of the glass paste 3 on the outer surface (first side) of the cover glass 2 for laser sintering;
  • the heating device 20 is disposed on the lower side of the display For heating the outer surface (second side surface) of the back sheet glass 1 corresponding to the glass glue 3 portion.
  • the heating device 20 may preheat the glass paste 3 before the laser sintering head 10 outputs the laser for laser sintering, or may continue to the outer surface of the back glass 1 after the sintering of the laser sintering head 10 is completed.
  • the corresponding portion of the glue 3 is heated, and the glass glue 3 is annealed to reduce the stress of the glass glue and the glass substrate, thereby avoiding cracks or even breakage due to shrinkage stress.
  • the manner in which the heating device 20 is heated in the second embodiment and the temperature at which the glass glue 3 needs to be heated are the same as in the first embodiment, and will not be described in detail herein.
  • FIG. 4 is a schematic view showing an application structure of the laser sintering apparatus according to the third embodiment of the present disclosure.
  • the laser sintering head 10 and the heating device 20 are disposed on both sides of the display.
  • the laser sintering apparatus further includes:
  • the support substrate 30 is used to place a display to be packaged.
  • the laser sintering head 10 is disposed on a side of the cover glass 2 of the display away from the back glass 1 for outputting laser light toward the outer surface of the cover glass 2 to heat the corresponding portion of the glass paste 3;
  • the other side of the display substrate 30 is placed on the support substrate 30 and supported by the base 50, and the heating device 20 is configured to heat the corresponding portion of the glass paste 3 of the back sheet glass 1 through the support substrate 30.
  • the support substrate 30 is transparent, and the heating device 20 includes an infrared generator for emitting infrared light having a wavelength of 795 to 810 nm, and the infrared light of the wavelength range is used to correspond to the glass paste 3 of the back sheet glass 1.
  • the support substrate 30 and the back sheet glass 1 are made of the same material and are made of a material that does not absorb the light of the wavelength band, so that infrared light is not absorbed by the support substrate 30 and the back sheet glass 1, It can be used only to heat the glass glue 3 to heat.
  • the laser sintering apparatus further includes:
  • the mask 40 is disposed between the heating device 20 and the support substrate 30.
  • the mask 40 is provided with an opening 41 corresponding to the corresponding portion of the glass paste of the back glass 1 on the display to be packaged.
  • the glass glue corresponding portion of the back glass 1 on the support substrate 30 is also provided with a through hole communicating with the opening 41 of the mask 30, so that the light emitted by the heating device 20 passes through the mask 40 and the support substrate 30 only.
  • the corresponding portion of the glass glue 3 that is transferred to the back sheet glass 1.
  • the mask 40 can also be disposed on the side of the heating device 20 facing the glass glue 3, so that the mask 40 can also partially block the heat generated by the heating device 20, so that The other parts of the display are not affected by the heating means.
  • a surface of the support substrate 30 for placing a surface of the display to be packaged (that is, a surface that is in contact with the back sheet glass 1) is provided with a ventilation duct 31, and the ventilation duct 31 corresponds to the glass glue portion.
  • An area is provided for cooling a gas of a predetermined temperature in a region of the glass paste portion after the laser sintering of the laser sintering head 10 is completed.
  • the gas may be N2 or clean air.
  • the glass paste 3 is subjected to a temperature drop rate of 10 degrees/minute by inputting a gas of a predetermined temperature to a region corresponding to the glass paste on the surface of the back sheet glass 1. Cooling, compared with the natural cooling after laser sintering, the temperature is slow, reducing the stress of the glass glue and the glass substrate, and avoiding cracks or even damage due to shrinkage stress.
  • the infrared light is output by the heating device 20, so that the glass paste 3 of the display is preheated before sintering, preferably, when the temperature is reached.
  • the heating device 20 stops outputting infrared light, that is, stops heating; at this time, the laser burns the head 10 to output laser light, and scans the corresponding portion of the glass glue on the upper surface of the cover glass 2 to heat the glass glue 3 to At 800 to 1000 degrees, the laser sintering is stopped; thereafter, the ventilation duct 31 below the back glass 2 is passed through a predetermined temperature of N2 or clean air to cool the glass paste 3 at a temperature drop rate of 10 degrees/minute.
  • the glass glue of the display is sintered by the method, and the glass glue part is preheated before the laser sintering, and the glass glue part is slowly cooled after the laser sintering, thereby reducing the temperature difference and the reduction before the laser sintering compared with the laser sintering.
  • the rate of temperature drop after sintering of the small laser to reduce the stress of the glass paste and the glass substrate, and avoid cracks or even damage due to shrinkage stress.
  • Another aspect of a specific embodiment of the present disclosure provides a laser sintering method, the laser sintering method comprising:
  • Heating of the portion of the material to be sintered and/or the portion of the sintered material is performed before and/or after laser sintering.
  • the portion of the material to be sintered is heated to 400 to 500 degrees.
  • an infrared generator is used to emit infrared light having a wavelength of 795 nm to 810 nm to the portion of the material to be sintered. And/or the portion of the sintered material is heated.
  • the laser sintering method further includes:
  • the gas into which the sintered material is partially supplied with a predetermined temperature is cooled.
  • the portion of the sintered material is cooled at a temperature decreasing rate of 10 degrees/minute.
  • the step of heating the portion of the material to be sintered and/or the portion of the material to be sintered may be performed on the same side or on the opposite side of the device to be sintered, respectively, and before and/or after the laser sintering.
  • laser sintering and heating are respectively performed on both sides of the material to be sintered of the apparatus to be sintered. This ensures that the internal temperature difference of the material to be sintered is reduced.
  • the device to be sintered is a display to be packaged, and the material to be sintered is a glass glue.
  • the above-described laser sintering apparatus and laser sintering method of the present disclosure are not limited to the package applied only to the display, and the laser sintering apparatus and the laser sintering method of the embodiments of the present disclosure can be solved as long as the processing method using the laser sintering method is employed.
  • the problem of cracking or breakage of the material to be sintered is caused by the large shrinkage stress generated by laser sintering.
  • the laser sintering apparatus and the laser sintering method of the present disclosure can reduce the temperature difference before laser sintering compared to laser sintering and/or reduce the temperature drop rate after laser sintering to reduce the stress of the glass paste and the glass substrate. To avoid cracks or even damage due to shrinkage stress.

Abstract

一种激光烧结设备及烧结方法。该激光烧结设备包括：激光烧结头（10），用于朝待烧结装置上所设置的待烧结材料部分输出激光，进行激光烧结；加热装置（20），用于在该激光烧结头（10）进行激光烧结之前和/或之后，朝待烧结材料部分和/或已烧结材料部分进行加热。通过设置加热装置（20），使得进行激光烧结之前对待烧结装置的待烧结材料部分进行预热，和/或激光烧结之后对已烧结材料部分进行退火处理，从而减小激光烧结前相较于激光烧结时的温度差和/或减小激光烧结后温度的下降速度，以减小待烧结材料和待烧结装置所受到的应力，避免由于收缩应力使待烧结装置出现裂纹甚至破损情况。

Description

一种激光烧结设备及烧结方法
相关申请的交叉引用
本申请主张在2014年12月15日在中国提交的中国专利申请号No.201410777719.6的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及显示器制造技术领域，尤其是指一种激光烧结设备及烧结方法。
背景技术
有机发光二极管(Organic Light-Emitting Diode，OLED)显示器件是通过电流驱动发光材料自主发光的显示器件。由于OLED显示器中的发光材料对温度、空气、水十分敏感，因此良好的封装对OLED显示器的寿命和画面品质至关重要。OLED显示器的封装技术有多种，如激光封装、薄膜封装和注入封装等。其中激光封装技术是目前最成熟的OLED封装技术，其主要的工作原理是利用激光的精确快速升温融化夹在两片玻璃基板(一片为盖板玻璃，一片为设置有发光材料和电路图形的背板玻璃)间特定位置的玻璃胶来实现对两片基板的封装。
由于传统激光烧结时，玻璃胶会瞬间从室温提高到800～1000℃，然后再降至室温，该快速升温和降温的过程会在玻璃胶内部聚集一定的收缩应力，该收缩应力会使玻璃胶以及被玻璃胶封装的玻璃基板极易形成裂纹甚至破损的情况。目前针对这一问题的改善措施基本上有两种：一、降低玻璃基板和玻璃胶材料的热膨胀系数来降低收缩应力；二、降低激光烧结速度，然而第一种方法使得玻璃基板和玻璃胶材料的选择受到很大限制，第二种方法的应用并不能适用于量产，因此该两种方法使OLED显示器的制造受到很大限制。
发明内容
本公开技术方案的目的是提供一种激光烧结设备及烧结方法，用于解决 现有技术显示器制造过程中采用激光进行烧结时，由于激光烧结产生的大收缩应力造成待烧结材料形成裂纹或破损的问题。
本公开提供一种激光烧结设备，其中所述激光烧结设备包括：
激光烧结头，用于朝待烧结装置上所设置的待烧结材料部分输出激光，进行激光烧结；
加热装置，用于在所述激光烧结头进行激光烧结之前和/或之后，朝待烧结材料部分和/或已烧结材料部分进行加热。
优选地，上述所述的激光烧结设备，其中，所述加热装置用于在所述激光烧结头进行激光烧结之前，使待烧结材料部分加热到400至500度。
优选地，上述所述的激光烧结设备，其中，所述激光烧结设备还包括：
用于放置待烧结装置的支撑基板，其中所述加热装置设置于所述支撑基板放置待烧结装置的另一侧。
优选地，上述所述的激光烧结设备，其中，所述支撑基板上用于放置待烧结装置的表面开设有通风管道，且所述通风管道对应所述待烧结材料部分的区域设置，用于当所述激光烧结头的激光烧结完成后，对所述区域输入预定温度的气体进行降温。
优选地，上述所述的激光烧结设备，其中，所述加热装置包括红外发生器，所述红外发生器所发出红外光的波长为795nm至810nm。
优选地，上述所述的激光烧结设备，其中，所述加热装置朝向所述待烧结材料的一侧还设置有掩膜板，所述掩膜板上的开孔与待烧结装置的待烧结材料部分对应。
优选地，上述所述的激光烧结设备，其中，所述加热装置与所述支撑基板之间还设置有掩膜板，所述掩膜板上的开孔与待烧结装置的待烧结材料部分对应。
优选地，上述所述的激光烧结设备，其中，所述支撑基板为透明基板。
优选地，上述所述的激光烧结设备，其中，所述待烧结装置包括相对的第一侧面和第二侧面，所述待烧结材料设置在所述第一侧面与所述第二侧面之间；所述激光烧结头与所述第一侧面相对设置，用于朝所述第一侧面输出激光；所述加热装置与所述第二侧面相对设置，用于朝所述第二侧面进行加 热。
优选地，上述所述的激光烧结设备，其中，所述激光烧结头和所述加热装置设置在所述待烧结装置的同侧。
本公开还提供一种激光烧结方法，所述激光烧结方法包括：
朝待烧结装置上所设置的待烧结材料部分输出激光，进行激光烧结；
在进行激光烧结之前和/或之后，朝待烧结材料部分和/或已烧结材料部分进行加热。
优选地，上述所述的激光烧结方法，在进行激光烧结之前，朝待烧结材料部分进行加热的步骤中，使待烧结材料部分加热到400至500度。
优选地，上述所述的激光烧结方法，在进行激光烧结之前和/或之后，朝待烧结材料部分和/或已烧结材料部分进行加热的步骤中，采用红外发生器发出波长为795nm至810nm的红外光对待烧结材料部分和/或已烧结材料部分进行加热。
优选地，上述所述的激光烧结方法，所述激光烧结方法还包括：
在进行激光烧结之后，对已烧结材料部分输入预定温度的气体进行降温。
优选地，上述所述的激光烧结方法，在对已烧结材料部分输入预定温度的气体进行降温的过程中，使已烧结材料部分以10度/分的降温速度进行降温。
优选地，上述所述的激光烧结方法，在进行激光烧结和朝待烧结材料部分进行加热的步骤中，在待烧结装置的待烧结材料的两侧分别进行激光烧结以及加热。
附图说明
图1为通常显示器的结构示意图
图2为本公开第一实施例所述激光烧结设备的应用结构示意图；
图3为本公开第二实施例所述激光烧结设备的应用结构示意图；
图4为本公开第三实施例所述激光烧结设备的应用结构示意图。
具体实施方式
为使本公开的目的、技术方案和优点更加清楚，下面将结合附图及具体实施例对本公开进行详细描述。
本公开具体实施例所述激光烧结设备，包括：
激光烧结头，用于朝待烧结装置上所设置的待烧结材料部分输出激光，进行激光烧结；
加热装置，用于在所述激光烧结头进行激光烧结之前和/或之后，朝待烧结材料部分和/或已烧结材料部分进行加热。本公开实施例所述激光烧结设备通过设置加热装置，使得进行激光烧结之前对待烧结装置的待烧结材料部分进行预热，和/或激光烧结之后对已烧结材料部分进行退火处理，从而减小激光烧结前相较于激光烧结时的温度差和/或减小激光烧结后温度的下降速度，以减小待烧结材料和待烧结装置所受到的应力，避免由于收缩应力使待烧结装置出现裂纹甚至破损情况。
较佳地，所述待烧结装置包括相对的第一侧面和第二侧面，所述待烧结材料设置在所述第一侧面与所述第二侧面之间；所述激光烧结头与所述第一侧面相对设置，用于朝所述第一侧面输出激光；所述加热装置与所述第二侧面相对设置，用于朝所述第二侧面进行加热；也即激光烧结头和加热装置分别在待烧结装置的不同侧面进行激光烧结和加热。
当然，激光烧结头和加热装置的设置方式并不限于上述，也可以设置在待烧结装置的同侧。
本公开上述结构的激光烧结设备，可以用于显示器的封装，通过激光对待封装显示器所涂覆的玻璃胶部分进行加热，以使玻璃胶升温融化将显示器的两部分组装在一起。因此，上述的待烧结装置应用于显示器封装时，所述待烧结装置为待封装显示器，所述待烧结材料为玻璃胶。
以下将以本公开所述激光烧结设备应用于显示器封装为例，对本公开具体实施例的结构进行详细描述。
如图1为通常显示器的结构示意图，包括相对且平行设置的背板玻璃1和盖板玻璃2，其中背板玻璃1与盖板玻璃2之间设置用于实现图像显示的器件，对于OLED显示器来说，背板玻璃1与盖板玻璃2之间设置各发光功 能层。在封装时，在背板玻璃1的边框部分涂覆玻璃胶3，将盖板玻璃2盖设于发光功能层的上方，之后对盖板玻璃2的上表面涂覆玻璃胶部分进行激光烧结，使背板玻璃1与盖板玻璃2固结在一起。
根据以上，本领域技术人员能够了解的，上述所提及的待封装显示器的第一侧面和第二侧面形成为待封装显示器的背板玻璃1或者盖板玻璃2的外表面，具体地本公开所述激光烧结设备的激光烧结头和加热装置可以分别位于背板玻璃1的外表面和盖板玻璃2的外表面的两侧，也可以位于背板玻璃1的外表面或者盖板玻璃2的外表面的同侧。
如图2为本公开第一实施例所述激光烧结设备的应用结构示意图。在第一实施例中，在显示器的盖板玻璃2的上方设置激光烧结头10与加热装置20，利用加热装置20对盖板玻璃2的外表面对应玻璃胶3部分进行加热，当使玻璃胶3加热到预定温度之后，利用激光烧结头10朝盖板玻璃2的外表面的玻璃胶3对应部分输出激光，进行激光烧结，使玻璃胶3固结，将盖板玻璃2与背板玻璃1连接在一起。
通过上述的处理方式，通过提前对玻璃胶进行预热，能够减少激光烧结前相较于激光烧结时的温度差，以减小玻璃胶和玻璃基板的应力，避免由于收缩应力造成玻璃基板的裂纹甚至破损情况。
当然，上述实施例的激光烧结设备，采用所述加热装置20还可以进一步当激光烧结头10进行激光烧结完成之后，继续对盖板玻璃2的外表面对玻璃胶3的对应部分进行加热，对玻璃胶3进行退火处理，使玻璃胶3缓慢降温，进一步达到减小玻璃胶和玻璃基板的应力，避免由于收缩应力造成的裂纹甚至破损情况的效果。
具体地，所述加热装置20可以为红外发生器采用红外光方式进行加热，也可以为激光发生器，与激光烧结头10相同，采用激光进行加热。
本公开实施例的激光烧结设备，较佳地，所述加热装置20在激光烧结头10进行烧结之前，对玻璃胶3预热的温度为400至500度；以及在激光烧结头10结束烧结进行退火时的温度也为400至500度；此外，激光烧结头10对玻璃胶3进行烧结时使玻璃胶3所达到的温度为800至1000度。
本公开第一实施例中，激光烧结头10与加热装置20对显示器的同一侧 面进行加热，需要说明的是，相对于显示器，激光烧结头10与加热装置20也可以同时设于两侧，即显示器两侧都有激光烧结头10与加热装置20，从而达到使玻璃胶3受热固化的效果。
从成本上考虑，本公开还提供第二实施例的激光烧结设备，如图3所示，相较于第一实施例的激光烧结设备，激光烧结头10与加热装置20分设于显示器的两侧，其中激光烧结头10设置于显示器的上侧，用于朝盖板玻璃2的外表面(第一侧面)的玻璃胶3对应部分输出激光，进行激光烧结；加热装置20设置于显示器的下侧，用于对背板玻璃1的外表面(第二侧面)对应玻璃胶3部分进行加热。具体地，加热装置20可以在激光烧结头10输出激光进行激光烧结之前对玻璃胶3部分进行预热，也可以在激光烧结头10的烧结结束之后，继续对背板玻璃1的外表面对玻璃胶3的对应部分进行加热，对玻璃胶3进行退火处理，以减小玻璃胶和玻璃基板的应力，避免由于收缩应力造成的裂纹甚至破损情况。
第二实施例中加热装置20进行加热的方式以及所需要使玻璃胶3加热达到的温度与第一实施例相同，在此不再详细描述。
此外，本公开还提供第三实施例的激光烧结设备，参阅图4本公开第三实施例所述激光烧结设备的应用结构示意图。在第三实施例中，激光烧结头10与加热装置20分设于显示器的两侧。具体地，该激光烧结设备还包括：
支撑基板30，用于放置待封装显示器。
所述激光烧结头10设置于显示器的盖板玻璃2远离背板玻璃1的一侧，用于朝盖板玻璃2的外表面输出激光，对玻璃胶3的对应部分进行加热；加热装置20设置于支撑基板30放置显示器的另一侧，并通过基台50支撑，加热装置20用于透过支撑基板30朝背板玻璃1的玻璃胶3的对应部分进行加热。
较佳地，所述支撑基板30呈透明，加热装置20包括红外发生器，用于发出波长为795到810nm的红外光，采用该波长范围的红外光对背板玻璃1的玻璃胶3的对应部分加热，较佳地，支撑基板30与背板玻璃1采用相同材料制成，且由不吸收该波段光的材料制成，因此红外光不会被支撑基板30和背板玻璃1所吸收，可以只用于使玻璃胶3加热升温。
进一步，为了使加热装置20所发出光只传输至背板玻璃1的玻璃胶3的对应部分，参阅图4，所述激光烧结设备还包括：
掩膜板40，设置于加热装置20与支撑基板30之间，该掩膜板40上设置有开孔41，与待封装显示器上背板玻璃1的玻璃胶对应部分相对应设置。优选地，支撑基板30上背板玻璃1的玻璃胶对应部分也设置与掩膜板30的开孔41连通的通孔，使加热装置20所发出光透过掩膜板40和支撑基板30只传输至背板玻璃1的玻璃胶3的对应部分。可以理解，所述掩膜板40还可以设置在所述加热装置20朝向所述玻璃胶3的一侧，如此掩膜板40同样也可以对所述加热装置20发出的热量进行部分遮挡，使所述显示器的其它部分不会受到加热装置的影响。
优选地，所述支撑基板30上用于放置待封装显示器的表面(也即与背板玻璃1相贴合的表面)开设有通风管道31，且所述通风管道31对应所述玻璃胶部分的区域设置，用于当所述激光烧结头10的激光烧结完成后，对所述玻璃胶部分的区域输入预定温度的气体进行降温。具体地，所述气体可以为N2或洁净空气，较佳地，通过对背板玻璃1表面的玻璃胶对应部分的区域输入预定温度的气体，使玻璃胶3以10度/分的降温速度进行降温，相较于通常激光烧结后的自然降温，降温缓慢，减小玻璃胶和玻璃基板的应力，避免由于收缩应力造成的裂纹甚至破损情况。
采用本公开第三实施例的激光烧结设备，在激光烧结头10进行烧结之前，先利用加热装置20输出红外光线，使显示器的玻璃胶3在烧结之前进行预热，较佳地，当温度达到400至500度后，加热装置20停止输出红外光线，也即停止加热；此时使激光烧对头10输出激光，对盖板玻璃2上表面的玻璃胶对应部分进行扫描，使玻璃胶3升温至800至1000度时，停止激光烧结；之后，在背板玻璃2下方的通风管道31通入预定温度的N2或洁净空气，使玻璃胶3以10度/分的降温速度进行降温。采用该方法对显示器的玻璃胶进行烧结，进行激光烧结之前对玻璃胶部分进行预热，激光烧结之后使玻璃胶部分缓慢降温，能够减小激光烧结前相较于激光烧结时的温度差和减小激光烧结后温度的下降速度，以减小玻璃胶和玻璃基板的应力，避免由于收缩应力造成的裂纹甚至破损情况。
本公开具体实施例的另一方面提供一种激光烧结方法，所述激光烧结方法包括：
朝待烧结装置上所设置的待烧结材料部分输出激光，进行激光烧结；
在进行激光烧结之前和/或之后，朝待烧结材料部分和/或已烧结材料部分进行加热。
具体地，在进行激光烧结之前，朝待烧结材料部分进行加热的步骤中，使所述待烧结材料部分加热到400至500度。
另外，在进行激光烧结之前和/或之后，朝待烧结材料部分和/或已烧结材料部分进行加热的步骤中，采用红外发生器发出波长为795nm至810nm的红外光对所述待烧结材料部分和/或已烧结材料部分进行加热。
进一步地，所述激光烧结方法还包括：
在进行激光烧结之后，对已烧结材料部分输入预定温度的气体进行降温。较佳地，在对已烧结材料部分输入预定温度的气体进行降温的过程中，使已烧结材料部分以10度/分的降温速度进行降温。
另外，可以分别在待烧结装置的同侧或异侧执行激光烧结和在进行激光烧结之前和/或之后，对待烧结材料部分和/或已烧结材料部分进行加热的步骤。
优选地，上述所述的激光烧结方法，在进行激光烧结和朝待烧结材料部分进行加热的步骤中，在待烧结装置的待烧结材料的两侧分别进行激光烧结以及加热。如此能够保证待烧结材料的内部温差减小。
本公开上述的激光烧结方法应用于显示器的封装时，所述待烧结装置为待封装显示器，所述待烧结材料为玻璃胶。
然而，本公开上述的激光烧结装置和激光烧结方法并不限于仅应用于显示器的封装，只要采用激光烧结方式的处理工艺中，采用本公开实施例的激光烧结装置和激光烧结方法，均能够解决由于激光烧结产生的大收缩应力造成待烧结材料形成裂纹或破损的问题。
本公开所述激光烧结设备和激光烧结方法，能够减小激光烧结前相较于激光烧结时的温度差和/或减小激光烧结后温度的下降速度，以减小玻璃胶和玻璃基板的应力，避免由于收缩应力造成的裂纹甚至破损情况。
以上所述的是本公开的优选实施方式，应当指出对于本技术领域的普通人员来说，在不脱离本公开所述的原理前提下还可以作出若干改进和润饰，这些改进和润饰也在本公开的保护范围内。

Claims (16)

  1. 一种激光烧结设备，包括：
    激光烧结头，用于朝待烧结装置上所设置的待烧结材料部分输出激光，进行激光烧结；
    加热装置，用于在所述激光烧结头进行激光烧结之前和/或之后，朝所述待烧结材料部分和/或已烧结材料部分进行加热。
  2. 如权利要求1所述的激光烧结设备，其中，所述加热装置用于在所述激光烧结头进行激光烧结之前，使所述待烧结材料部分加热到400至500度。
  3. 如权利要求1所述的激光烧结设备，其中，所述激光烧结设备还包括：
    用于放置所述待烧结装置的支撑基板，其中所述加热装置设置于所述支撑基板放置所述待烧结装置的另一侧。
  4. 如权利要求3所述的激光烧结设备，其中，所述支撑基板上用于放置所述待烧结装置的表面开设有通风管道，且所述通风管道对应所述待烧结材料部分的区域设置，用于当所述激光烧结头的激光烧结完成后，对所述区域输入预定温度的气体进行降温。
  5. 如权利要求1至4任一项所述的激光烧结设备，其中，所述加热装置包括红外发生器，所述红外发生器所发出红外光的波长为795nm至810nm。
  6. 如权利要求1所述的激光烧结设备，其中，所述加热装置朝向所述待烧结材料的一侧还设置有掩膜板，所述掩膜板上的开孔与所述待烧结装置的所述待烧结材料部分对应。
  7. 如权利要求3所述的激光烧结设备，其中，所述加热装置与所述支撑基板之间还设置有掩膜板，所述掩膜板上的开孔与所述待烧结装置的所述待烧结材料部分对应。
  8. 如权利要求3所述的激光烧结设备，其中，所述支撑基板为透明基板。
  9. 如权利要求1所述的激光烧结设备，其中，所述待烧结装置包括相对的第一侧面和第二侧面，所述待烧结材料设置在所述第一侧面与所述第二侧面之间；所述激光烧结头与所述第一侧面相对设置，用于朝所述第一侧面输出激光；所述加热装置与所述第二侧面相对设置，用于朝所述第二侧面进行 加热。
  10. 如权利要求1所述的激光烧结设备，其中，所述激光烧结头和所述加热装置设置在所述待烧结装置的同侧。
  11. 一种激光烧结方法，包括：
    朝待烧结装置上所设置的待烧结材料部分输出激光，进行激光烧结；
    在进行激光烧结之前和/或之后，朝所述待烧结材料部分和/或已烧结材料部分进行加热。
  12. 如权利要求11所述的激光烧结方法，其中，在进行激光烧结之前，朝所述待烧结材料部分进行加热的步骤中，使所述待烧结材料部分加热到400至500度。
  13. 如权利要求11所述的激光烧结方法，其中，在进行激光烧结之前和/或之后，朝所述待烧结材料部分和/或已烧结材料部分进行加热的步骤中，采用红外发生器发出波长为795nm至810nm的红外光对所述待烧结材料部分和/或已烧结材料部分进行加热。
  14. 如权利要求11所述的激光烧结方法，其中，所述激光烧结方法还包括：
    在进行激光烧结之后，对所述已烧结材料部分输入预定温度的气体进行降温。
  15. 如权利要求14所述的激光烧结方法，其中，在对已烧结材料部分输入预定温度的气体进行降温的过程中，使所述已烧结材料部分以10度/分的降温速度进行降温。
  16. 如权利要求11所述的激光烧结方法，其中，在进行激光烧结和朝所述待烧结材料部分进行加热的步骤中，在待烧结装置的所述待烧结材料的两侧分别进行激光烧结以及加热。
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