WO2016095427A1 - 一种激光烧结设备及烧结方法 - Google Patents

一种激光烧结设备及烧结方法 Download PDF

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Publication number
WO2016095427A1
WO2016095427A1 PCT/CN2015/079489 CN2015079489W WO2016095427A1 WO 2016095427 A1 WO2016095427 A1 WO 2016095427A1 CN 2015079489 W CN2015079489 W CN 2015079489W WO 2016095427 A1 WO2016095427 A1 WO 2016095427A1
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Prior art keywords
laser
laser head
power
head
sintering
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PCT/CN2015/079489
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English (en)
French (fr)
Inventor
肖昂
Original Assignee
京东方科技集团股份有限公司
鄂尔多斯市源盛光电有限责任公司
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Priority to US14/894,869 priority Critical patent/US10259144B2/en
Publication of WO2016095427A1 publication Critical patent/WO2016095427A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/22—Driving means
    • B22F12/226—Driving means for rotary motion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/40—Radiation means
    • B22F12/44—Radiation means characterised by the configuration of the radiation means
    • B22F12/45—Two or more
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0838—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/25—Process efficiency

Definitions

  • the present disclosure relates to the field of display manufacturing technology, and more particularly to a laser sintering apparatus and a sintering method.
  • An Organic Light-Emitting Diode (OLED) display device is a display device that autonomously emits light by a current-driven luminescent material. Since the luminescent materials in OLED displays are sensitive to temperature, air, and water, good packaging is critical to the lifetime and picture quality of OLED displays.
  • packaging technologies for OLED displays such as laser packaging, thin film packaging, and injection packaging.
  • the laser encapsulation technology is the more mature OLED packaging technology. Its main working principle is to use the laser to accurately and quickly heat-melt and sandwich the two glass substrates (one is the cover glass, and the other is the back with the luminescent material and the circuit pattern). A glass glue at a specific position between the plate glass) enables encapsulation of the two substrates.
  • the glass glue will instantly increase from room temperature to 800-1000 ° C, and then to room temperature, the rapid heating and cooling process will gather a certain shrinkage stress inside the glass glue, the shrinkage stress in the subsequent process It is easy to form cracks or even breakage.
  • the choice of the second method is not limited to the mass production, so the two methods make the manufacture of OLED displays very limited.
  • An object of the disclosed technical solution is to provide a laser sintering apparatus and a sintering method for solving When a laser package is used in the prior art display manufacturing process, the glass shrinkage is caused by cracking or breakage due to large shrinkage stress generated by laser sintering.
  • the present disclosure provides a laser sintering apparatus, the laser sintering apparatus comprising:
  • a first laser head for outputting a laser of a first power
  • a second laser head for outputting a laser of a second power
  • a driving device for driving the first laser head and the second laser head to move, so that the first laser head and the second laser head respectively heat the same region on the material to be sintered.
  • the laser sintering apparatus described above wherein the laser sintering apparatus further comprises:
  • a third laser head for outputting a laser of a third power, wherein the third power and the first power are less than the second power;
  • the driving device is further configured to move the third laser head, and the first laser head, the second laser head, and the third laser head respectively heat the same region on the material to be sintered.
  • the laser sintering apparatus described above, wherein the driving device is configured to drive the first laser head and the second laser head to move at the same rate at the same time.
  • the laser sintering apparatus described above wherein the driving device comprises:
  • a first control structure configured to cause the first laser head, the second laser head, and the third laser head to scan the material to be sintered in the first direction at the same rate;
  • a second control structure for adjusting a position of the first laser head, the second laser head, and/or the third laser head such that a direction from the second laser head to the first laser head And the direction from the third laser head to the second laser head is always the same as the first direction.
  • the laser sintering apparatus described above wherein the laser sintering apparatus further comprises a fixed stage, the fixed stage is provided with an annular track, and the second laser head is fixedly disposed at a center of the circular track, The first laser head and the third laser head are disposed on the circular track and are disposed on two sides of the second laser head.
  • the laser sintering apparatus described above, wherein the driving device comprises a first motor coupled to the first laser head for moving the first laser head around the circular track; a second motor coupled to the third laser head for moving the third laser head about the circular track.
  • the laser sintering apparatus described above wherein the first power and the third work The rate is 20-40% lower than the second power, respectively.
  • the distance between the second laser head and the first laser head and the second laser head and the third laser head are respectively 2-5 mm.
  • the optical paths of the first laser head, the second laser head, and the third laser head are parallel to each other.
  • the present disclosure also provides a laser sintering method using the laser sintering apparatus as described above, the laser sintering method comprising:
  • the first laser head outputs a laser of a first power
  • the second laser head outputs a laser of a second power
  • the first laser head and the second laser head are moved to respectively heat the same region on the material to be sintered.
  • the laser sintering method described above wherein the laser sintering method further comprises:
  • the third laser head outputs a laser of a third power, wherein the third power and the first power are less than the second power;
  • the first laser head, the second laser head, and the third laser head respectively heat the same region on the material to be sintered.
  • the first laser head, the second laser head, and the third laser head in the step of heating the same region on the material to be sintered, respectively, the first laser head, the second laser head, and the third laser head, specifically The first laser head, the second laser head, and the third laser head are moved in the first direction at the same rate, and the same region of the sintered material is sequentially scanned.
  • the step of moving the first laser head, the second laser head, and the third laser head in the first direction at the same rate further includes:
  • the first power and the third power are respectively 20-40% lower than the first power.
  • the first laser head and the second laser head respectively heat the same region on the material to be sintered
  • the first laser head And the second laser head moves simultaneously at the same rate.
  • the present disclosure also provides a laser sintering method, comprising:
  • One of the power of the laser light output by the first laser head and the power of the laser light output by the second laser head is greater than or equal to a minimum power for sintering the sintered material; output by the first laser head
  • the other of the power of the laser and the power of the laser output by the second laser head is smaller than the minimum power.
  • the distribution trajectory is a closed rectangular shape.
  • the laser sintering method further comprises:
  • the third area is adjacent to the second area; the direction from the third area to the second area and from the second area to the first area is the first direction;
  • the power of the laser light output by the second laser head is greater than or equal to the minimum power
  • the power of the laser light output by the first laser head and the power of the laser light output by the third laser head are both smaller than the minimum power.
  • the present disclosure also provides a laser sintering apparatus comprising:
  • a first laser head for outputting a laser of a first power
  • a second laser head for outputting a laser of a second power
  • a driving device for driving the first laser head and the second laser head to move at a same rate in a first direction along a distribution trajectory of the sintered material, so that the first laser head is on the distribution trajectory Heating the first region while causing the second laser head to add a second region on the distribution trajectory heat;
  • first area is adjacent to the second area, and a direction from the second area to the first area is the first direction;
  • One of the first power and the second power is greater than or equal to a minimum power for sintering the sintered material; the other of the first power and the second power is less than the minimum power.
  • the laser sintering apparatus further comprises:
  • a third laser head for outputting a laser of a third power
  • the driving device is further configured to move the third laser head along the distribution trajectory such that the first laser head, the second laser head, and the third laser head are in the first direction Moving at the same rate and causing the third laser head to heat the third region on the distribution trajectory when the first laser head heats the first region;
  • the third area is adjacent to the second area; the direction from the third area to the second area and from the second area to the first area is the first direction;
  • the second power is greater than or equal to the minimum power
  • the first power and the third power are both smaller than the minimum power.
  • a laser head is added, and when two laser heads are used to heat the material to be sintered provided on the device to be sintered, the two laser heads are respectively treated to a certain one of the sintered materials.
  • the area to be heated is heated, so that the sintered material is preheated before laser sintering, or the sintered material is annealed after laser sintering, thereby reducing the temperature difference or reducing the laser before laser sintering compared to laser sintering.
  • the rate of temperature drop after sintering to reduce the stress of the substrate to be sintered, avoiding cracks or even damage due to shrinkage stress.
  • FIG. 1 is a schematic cross-sectional structural view of a general display
  • FIG. 2 is a schematic plan view of a display
  • FIG. 3 is a schematic diagram of application of a laser sintering apparatus according to a first embodiment of the present disclosure
  • FIG. 4 is a schematic diagram of application of a laser sintering apparatus according to a second embodiment of the present disclosure
  • FIG. 5 is a schematic diagram of application of the laser sintering apparatus according to a third embodiment of the present disclosure.
  • FIG. 6 is a temperature graph of a glass glue when three laser heads are used in a third embodiment of the present disclosure
  • FIG. 7 is a schematic perspective structural view of a laser sintering apparatus according to a fourth embodiment of the present disclosure.
  • FIG. 8 is a schematic plan view showing the structure of a laser sintering apparatus according to a fourth embodiment of the present disclosure.
  • Fig. 9 is a schematic view showing a state in which a scanning direction of a laser sintering apparatus according to a fourth embodiment of the present disclosure is changed.
  • a first laser head for outputting a laser of a first power
  • a second laser head for outputting a laser of a second power
  • a driving device for driving the first laser head and the second laser head to move, so that the first laser head and the second laser head respectively heat the same region on the material to be sintered.
  • the laser sintering apparatus adds a laser head to the laser head used in the conventional laser package, and when the two laser heads are used to heat the material to be sintered provided on the sintering device,
  • the laser heads respectively heat the sintered material in order to preheat the sintered material before laser sintering, or to anneal the sintered material after laser sintering, thereby reducing the temperature before laser sintering compared to laser sintering.
  • the difference in temperature or the decrease in temperature after laser sintering is reduced to reduce the stress of the material to be sintered and the substrate, and to avoid cracks or even damage due to shrinkage stress.
  • the first laser head and the second laser head respectively heat the same region on the material to be sintered
  • the first laser head and the second laser head are simultaneously moved at the same rate, such that The first laser head and the second laser head perform a moving scanning process on one of the regions of the sintered material at the same time, and sequentially heat the region, so that the entire laser sintering device has a simple structure and is easy to control.
  • the second laser head outputs a laser of a second power
  • the first laser head outputs a laser of a first power
  • the second power is greater than the first power
  • the laser output by the second laser head Used for the sintering of glass glue in display packaging, so that the temperature of the glass glue reaches 800 to 1000 degrees
  • the laser output from the first laser head is used for preheating before the glass glue is sintered, or for annealing after glass sintering, so that the glass The glue is heated to a temperature of 400 to 500 degrees.
  • the laser sintering apparatus of the above structure of the present disclosure can be used for packaging of a display, and the glass glue part coated by the package is heated by a laser to melt and melt the glass glue to assemble the two parts of the display together. Therefore, when the laser sintering apparatus described above is applied to a display package, the device to be sintered is a display to be packaged, and the material to be sintered is a glass glue.
  • FIG. 1 is a schematic cross-sectional structural view of a general display
  • FIG. 2 is a schematic plan view of the display.
  • the display includes a back panel glass 1 and a cover glass 2 disposed opposite and in parallel.
  • a device for realizing image display is disposed between the back glass 1 and the cover glass 2; for the OLED display, each of the light-emitting functional layers is disposed between the back glass 1 and the cover glass 2.
  • the glass glue 3 is applied around the frame portion of the back glass 1 , and the cover glass 2 is placed over the light-emitting functional layer, and then the laser output from the laser head is aligned with the glass glue on the surface of the cover glass 2 .
  • the corresponding area is scanned along the corresponding area of the glass glue of the frame, and laser sintering is performed to fix the back glass 1 and the cover glass 2 together.
  • FIG. 3 is a schematic view showing the application of the laser sintering apparatus according to the first embodiment of the present disclosure, taking a laser sintering apparatus disposed above the section A-A of FIG. 2 as an example.
  • the first laser head 10 and the second laser head 20 are fixedly coupled to scan at a corresponding rate along the corresponding area of the glass paste 3 at the same rate as the second laser head 20 to the first
  • the direction of a laser head 10 coincides with the scanning direction, that is, when the second laser head 20 is located opposite to the first laser head 10 in the scanning direction, the mobile scanning is performed while moving the scanning.
  • the laser light output by the first laser head 10 first reaches the corresponding area of the glass glue 3 on the cover glass 2, and then the laser output from the second laser head 20 is output.
  • the corresponding area of the glass glue 3 can be reached.
  • the laser output from the first laser head 10 is used for preheating before the glass paste is sintered, so that when the glass paste 3 reaches a temperature of 400 to 500 degrees, the laser pair of the second laser head 20 is output.
  • the glass glue 3 is sintered to bring the glass paste 3 to a temperature of 800 to 1000 degrees, and can be reduced by preheating the glass paste portion of the package to be packaged prior to laser sintering.
  • the temperature difference before laser sintering is compared with that during laser sintering to reduce the stress of the glass paste and the glass substrate, and to avoid cracks or even damage due to shrinkage stress.
  • FIG. 4 is a schematic view showing the application of the laser sintering apparatus according to the second embodiment of the present disclosure.
  • the laser sintering apparatus is also disposed above the section A-A of FIG. 2 as an example.
  • the first laser head 10 and the second laser head 20 are fixedly coupled to scan along the corresponding area of the glass paste 3 over the cover glass 2 at the same rate.
  • the directions of the first laser head 10 to the second laser head 20 coincide with the scanning direction, that is, the first laser head 10 is located second to the second laser head 20.
  • the laser head 20 is scanned in the opposite direction to the scanning direction.
  • the laser light output by the second laser head 20 first reaches the corresponding area of the glass glue 3 on the cover glass 2, and then the laser output from the first laser head 10 is output. Reach the corresponding area of the glass glue 3.
  • the laser output from the second laser head 20 heats the glass glue 3, so that the temperature of the glass glue 3 reaches 800 to 1000 degrees, and the glass glue 3 is sintered, and then the first laser head 10 is used.
  • the output laser reaches the corresponding area of the glass glue 3, and the heating is stopped when the temperature of the glass glue 3 is slowly reached 400 to 500 degrees, and the glass glue 3 is annealed to reduce the temperature drop rate after laser sintering to reduce the glass.
  • the stress of the glue and the glass substrate avoids cracks or even breakage due to shrinkage stress.
  • FIG. 5 is a schematic view showing the application of the laser sintering apparatus according to the third embodiment of the present disclosure, and the laser sintering apparatus disposed above the section A-A of FIG. 2 is also taken as an example.
  • the laser sintering apparatus includes, in addition to the first laser head 10 and the second laser head 20, a third laser head 30 for outputting a laser of a third power, the third power Less than the second power.
  • the first laser head 10, the second laser head 20, and the third laser head 30 are fixed together and scanned along the corresponding area of the glass paste 3 over the cover glass 2 at the same rate.
  • the driving device is further configured to scan the corresponding area of the glass glue 3 together with the first laser head 10 and the second laser head 20, the first laser head 10, The second laser head 20 and the third laser head 30 respectively heat the glass glue in sequence.
  • the glass glue 3 is preheated by the first laser head 10 to make the temperature of the glass glue 3 reach 400 to 500 degrees, and then the glass glue 3 is sintered by the second laser head 20 to make the temperature of the glass glue 3.
  • the glass glue 3 is annealed by the third laser head 30, and the glass glue 3 is slowly cooled down to 400 to 500 degrees.
  • the temperature profile shown in Fig. 6 is slow before the laser sintering. Heating and laser sintering After slowly cooling, the temperature gradient sintering and annealing can reduce the stress of the glass paste and the glass substrate, and avoid cracks or even damage due to shrinkage stress.
  • the glass glue 3 is usually disposed along the frame, so that the plane of the cover glass 2 is formed into a closed rectangular shape, and two laser heads or three laser heads are used simultaneously along the glass above the cover glass 2.
  • the driving device is further configured to adjust the position of each laser head. Taking the three laser heads included in the third embodiment as an example, the driving device specifically includes:
  • a first control structure for causing the first laser head 10, the second laser head 20, and the third laser head 30 to scan the glass paste 3 in the first direction at the same rate;
  • a second control structure for adjusting a position of the first laser head 10, the second laser head 20, and/or the third laser head 30 from the second laser head 30 to the first
  • the direction of the laser head 10 and the direction from the third laser head 30 to the second laser head 20 are always the same as the first direction.
  • the arrangement direction is the same as the scanning direction, so that when scanning in the scanning direction, the first laser head 10, the second laser head 20, and the third laser head 30 sequentially heat the glass paste 30 in the same region.
  • the first direction in the above is the direction in which the glass glue moves along the display frame during the display of the display.
  • the frame of the display is generally rectangular, and the glass glue disposed along the frame is also formed into a rectangular shape, so that the display is
  • the output laser varies along the direction in which the glass paste is scanned according to the shape of the glass paste, that is, the first direction changes according to the shape of the glass glue.
  • the process of performing the mobile scanning of each of the above laser heads is a process of laser heating and curing the entire glass paste.
  • the present disclosure provides the laser sintering apparatus of the fourth embodiment.
  • the laser sintering apparatus further includes a fixing table. 40, the fixing table 40 is provided with an annular track 41, wherein the second laser head 20 is fixedly disposed at the center of the circular track 41, and the first laser head 10 and the third laser head 30 are disposed at The annular track 41 is disposed on both sides of the second laser head 20.
  • the driving device includes a first motor 11 connected to the first laser head 10 for moving the first laser head 10 around the circular orbit 41; and further comprising a third laser head A second motor 31 is coupled 30 for moving the third laser head 30 about the annular track 41.
  • the first laser head 10 is wound on the circular orbit 41 by the first motor 11.
  • the second laser head 20 rotates, and the third laser head 30 is rotated around the circular track 41 around the second laser head 20 by the second motor 31, and the third laser head 30 and the second laser head 20 are ensured regardless of the scanning direction.
  • the sequential arrangement direction with the first laser head 10 is the same as the scanning direction.
  • the first power of the laser light output by the first laser head 10 and the third power of the laser light output by the third laser head 30 are compared with those of the second laser head.
  • the second power of the output laser is 20-40% lower.
  • the first power may be equal to the third power, but is not limited thereto.
  • the distance between the second laser head 20 and the first laser head 10 and the second laser head 20 and the third laser head 30 is respectively 2-5 mm, with the structural parameter And process parameters can guarantee a better sintering effect.
  • the optical paths of the first laser head 10, the second laser head 20, and the third laser head 30 are parallel to each other, and are respectively incident perpendicular to the plane of the cover glass 2 to the glass glue 3 region.
  • Another aspect of an embodiment of the present disclosure provides a laser sintering method using the above laser sintering apparatus, the laser sintering method comprising:
  • the first laser head outputs a laser of a first power
  • the second laser head outputs a laser of a second power
  • the first laser head and the second laser head are moved to respectively heat the same region on the material to be sintered.
  • the first laser head and the second laser head simultaneously move at the same rate.
  • the laser sintering device of the above structure of the present disclosure can be applied to a package of a display, and the glass glue portion coated by the laser is to be heated by the laser to melt the glass glue to display
  • the two parts of the device are assembled together. Therefore, when the laser sintering apparatus described above is applied to a display package, the device to be sintered is a display to be packaged, and the material to be sintered is a glass glue.
  • the laser outputted by the second laser head causes the glass glue to reach a temperature of 800 to 1000 degrees to sinter the glass glue; and the glass glue is heated by the first laser head to 400 to 500 degrees; the first laser head can heat the glass glue before the second laser head to preheat the glass glue before sintering, thereby reducing the temperature difference before laser sintering compared to laser sintering; A laser head can also heat the glass glue after the second laser head is sintered to anneal the glass glue after sintering, thereby reducing the temperature drop rate after laser sintering and reducing the stress of the glass glue and the glass substrate. To avoid cracks or even damage due to shrinkage stress.
  • the laser sintering method further includes:
  • the third laser head outputs a laser of a third power, wherein the third power and the first power are less than the second power;
  • the first laser head, the second laser head, and the third laser head respectively heat the same region on the material to be sintered.
  • the first laser head is used to preheat the glass glue to make the temperature of the glass glue reach 400 to 500 degrees, and then the glass glue is sintered by the second laser head to make the temperature of the glass glue. After reaching 800 to 1000 degrees, the glass glue is annealed by the third laser head to slowly cool the glass glue to 400 to 500 degrees.
  • the temperature gradient sintering and annealing are used to reduce the stress of the glass glue and the glass substrate, thereby avoiding A crack or even a damage caused by shrinkage stress gives a better effect.
  • the first laser head, the second laser head and the third laser head are moved in the first direction at the same rate, and the same region of the sintered material is sequentially scanned.
  • the method further includes:
  • the first power and the third power are respectively 20-40% lower than the first power.
  • the laser sintering apparatus and the laser sintering method according to the embodiments of the present disclosure can reduce the stress of the glass glue and the glass substrate, avoid cracks or even damage due to shrinkage stress, thereby improving the sintering yield.

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Abstract

一种激光烧结设备及烧结方法。该激光烧结设备包括：第一激光头（10），用于输出第一功率的激光；第二激光头（20），用于输出第二功率的激光；驱动装置，用于驱动第一激光头（10）与第二激光头（20）移动并分别对待烧结材料上的同一区域进行加热。利用两个激光头在对待烧结装置上所设置的待烧结材料进行加热时，使两个激光头依次分别对待烧结材料的某一待加热区域进行加热，这样在进行激光烧结之前对待烧结材料进行预热，或者激光烧结之后对待烧结材料进行退火处理，从而减小激光烧结前相较于激光烧结时的温度差或者减小激光烧结后温度的下降速度，以减小待烧结材料基板的应力，避免由于收缩应力造成的裂纹甚至破损情况。

Description

一种激光烧结设备及烧结方法
相关申请的交叉引用
本申请主张在2014年12月15日在中国提交的中国专利申请号No.201410777659.8的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及显示器制造技术领域，尤其是指一种激光烧结设备及烧结方法。
背景技术
有机发光二极管(Organic Light-Emitting Diode，OLED)显示器件是通过电流驱动发光材料自主发光的显示器件。由于OLED显示器中的发光材料对温度、空气、水十分敏感，因此良好的封装对OLED显示器的寿命和画面品质至关重要。OLED显示器的封装技术有多种，如激光封装、薄膜封装和注入封装等。其中激光封装技术是目前较成熟的OLED封装技术，其主要的工作原理是利用激光的精确快速升温融化夹在两片玻璃基板(一片为盖板玻璃，一片为设置有发光材料和电路图形的背板玻璃)间特定位置的玻璃胶来实现对两片基板的封装。
由于传统激光烧结时，玻璃胶会瞬间从室温提高到800～1000℃，然后再降至室温，该快速升温和降温的过程会在玻璃胶内部聚集一定的收缩应力，该收缩应力在后续工艺中极易形成裂纹甚至破损的情况。目前针对这一问题的改善措施基本上有两种：一、降低玻璃基板和玻璃胶材料的热膨胀系数来降低收缩应力；二、降低激光烧结速度，然而第一种方法使得玻璃基板和玻璃胶材料的选择受到很大限制，第二种方法的应用并不能适用于量产，因此该两种方法使OLED显示器的制造受到很大限制。
发明内容
本公开技术方案的目的是提供一种激光烧结设备及烧结方法，用于解决 现有技术显示器制造过程中采用激光封装时，由于激光烧结产生的大收缩应力造成玻璃胶形成裂纹或破损的问题。
本公开提供一种激光烧结设备，所述激光烧结设备包括：
第一激光头，用于输出第一功率的激光；
第二激光头，用于输出第二功率的激光；
驱动装置，用于驱动所述第一激光头与所述第二激光头移动，使所述第一激光头和第二激光头分别对待烧结材料上的同一区域进行加热。
优选地，上述所述的激光烧结设备，其中，所述激光烧结设备还包括：
第三激光头，用于输出第三功率的激光，其中所述第三功率以及所述第一功率小于所述第二功率；
所述驱动装置还用于使所述第三激光头移动，所述第一激光头、所述第二激光头和所述第三激光头分别对待烧结材料上的同一区域进行加热。
优选地，上述所述的激光烧结设备，其中，所述驱动装置用于驱动所述第一激光头和所述第二激光头以相同速率同时移动。
优选地，上述所述的激光烧结设备，其中，所述驱动装置包括：
第一控制结构，用于使所述第一激光头、所述第二激光头和所述第三激光头以相同速率沿第一方向移动对待烧结材料进行扫描；
第二控制结构，用于调节所述第一激光头、所述第二激光头和/或所述第三激光头的位置，使从所述第二激光头至所述第一激光头的方向、以及从所述第三激光头至所述第二激光头的方向始终与所述第一方向保持相同。
优选地，上述所述的激光烧结设备，其中，所述激光烧结设备还包括一固定台，所述固定台上设置有环形轨道，所述第二激光头固定设置于所述环形轨道的中心，所述第一激光头和所述第三激光头设置于所述环形轨道上，并分设于所述第二激光头的两侧。
优选地，上述所述的激光烧结设备，其中，所述驱动装置包括与所述第一激光头连接的第一马达，用于使所述第一激光头绕所述环形轨道移动；还包括与所述第三激光头连接的第二马达，用于使所述第三激光头绕所述环形轨道移动。
优选地，上述所述的激光烧结设备，其中，所述第一功率和所述第三功 率相较于所述第二功率分别低20-40％。
优选地，上述所述的激光烧结设备，其中，所述第二激光头与所述第一激光头以及所述第二激光头与所述第三激光头之间的距离分别为2-5mm。
优选地，上述所述的激光烧结设备，其中，所述第一激光头、所述第二激光头和所述第三激光头的光路相互平行。
本公开还提供一种采用如上所述激光烧结设备的激光烧结方法，所述激光烧结方法包括：
所述第一激光头输出第一功率的激光；
所述第二激光头输出第二功率的激光；
所述第一激光头与所述第二激光头移动，分别对待烧结材料上的同一区域进行加热。
优选地，上述所述的激光烧结方法，其中，所述激光烧结方法还包括：
第三激光头输出第三功率的激光，其中所述第三功率和所述第一功率小于所述第二功率；
所述第一激光头、所述第二激光头和所述第三激光头分别对待烧结材料上的同一区域进行加热。
优选地，上述所述的激光烧结方法，其中，在所述第一激光头、所述第二激光头和所述第三激光头分别对待烧结材料上的同一区域进行加热的步骤中，具体地使所述第一激光头、所述第二激光头和所述第三激光头以相同速率沿第一方向移动，先后分别对待烧结材料的同一区域进行扫描。
优选地，上述所述的激光烧结方法，其中，在使所述第一激光头、所述第二激光头和所述第三激光头以相同速率沿第一方向移动的步骤中，还包括：
调节所述第一激光头、所述第二激光头和/或所述第三激光头的位置，使从所述第二激光头至所述第一激光头的方向、以及从所述第三激光头至所述第二激光头的方向始终与所述第一方向保持相同。
优选地，上述所述的激光烧结方法，其中，所述第一功率和所述第三功率相较于所述第一功率分别低20-40％。
优选地，上述所述的激光烧结方法，其中，所述第一激光头与所述第二激光头分别对待烧结材料上的同一区域进行加热的步骤中，所述第一激光头 和所述第二激光头以相同速率同时移动。
本公开还提供一种激光烧结方法，包括：
用第一激光头和第二激光头输出不同功率的激光；
驱动所述第一激光头与所述第二激光头沿着烧结材料的分布轨迹按第一方向以相同的速率移动，并使所述第一激光头对所述分布轨迹上的第一区域加热，同时使所述第二激光头对所述分布轨迹上的与所述第一区域邻接的第二区域加热；
其中，从所述第二区域至所述第一区域的方向为所述第一方向；
由所述第一激光头输出的激光的功率和由所述第二激光头输出的激光的功率中之一大于等于使所述烧结材料发生烧结的最小功率；由所述第一激光头输出的激光的功率和由所述第二激光头输出的激光的功率中之另一个小于所述最小功率。
优选地，所述分布轨迹为封闭的长方形形状。
优选地，在所述第一激光头对所述第一区域加热时，所述激光烧结方法还包括：
驱动第三激光头沿着所述分布轨迹移动从而使得所述第一激光头、所述第二激光头和所述第三激光头按所述第一方向以相同的速率移动，并使所述第三激光头对所述分布轨迹上的第三区域加热；
其中，所述第三区域与所述第二区域邻接；从所述第三区域至所述第二区域、从所述第二区域至所述第一区域的方向为所述第一方向；
由所述第二激光头输出的激光的功率大于等于所述最小功率；
由所述第一激光头输出的激光的功率和由所述第三激光头输出的激光的功率均小于所述最小功率。
本公开还提供一种激光烧结设备，包括：
第一激光头，用于输出第一功率的激光；
第二激光头，用于输出第二功率的激光；
驱动装置，用于驱动所述第一激光头与所述第二激光头沿着烧结材料的分布轨迹按第一方向以相同的速率移动，使所述第一激光头对所述分布轨迹上的第一区域加热，同时使所述第二激光头对所述分布轨迹上的第二区域加 热；
其中，所述第一区域与所述第二区域邻接，且从所述第二区域至所述第一区域的方向为所述第一方向；
所述第一功率与所述第二功率中之一大于等于使所述烧结材料发生烧结的最小功率；所述第一功率与所述第二功率中之另一个小于所述最小功率。
优选地，所述激光烧结设备还包括：
第三激光头，用于输出第三功率的激光；
所述驱动装置还用于使所述第三激光头沿着所述分布轨迹移动从而使得所述第一激光头、所述第二激光头和所述第三激光头按所述第一方向以相同的速率移动，并在所述第一激光头对所述第一区域加热时使所述第三激光头对所述分布轨迹上的第三区域加热；
其中，所述第三区域与所述第二区域邻接；从所述第三区域至所述第二区域、从所述第二区域至所述第一区域的方向为所述第一方向；
所述第二功率大于等于所述最小功率；
所述第一功率和所述第三功率均小于所述最小功率。
本公开具体实施例上述技术方案中的至少一个具有以下有益效果：
在现有激光封装所用激光头的基础上，增加一个激光头，利用两个激光头在对待烧结装置上所设置的待烧结材料进行加热时，使两个激光头依次分别对待烧结材料的某一待加热区域进行加热，这样在进行激光烧结之前对待烧结材料进行预热，或者激光烧结之后对已烧结材料进行退火处理，从而减小激光烧结前相较于激光烧结时的温度差或者减小激光烧结后温度的下降速度，以减小待烧结材料基板的应力，避免由于收缩应力造成的裂纹甚至破损情况。
附图说明
图1为通常显示器的剖面结构示意图；
图2为显示器的平面结构示意图；
图3为本公开第一实施例所述激光烧结设备的应用示意图；
图4为本公开第二实施例所述激光烧结设备的应用示意图；
图5为本公开第三实施例的所述激光烧结设备的应用示意图；
图6为本公开第三实施例采用三个激光头时玻璃胶的温度曲线图；
图7为本公开第四实施例所述激光烧结设备的立体结构示意图；
图8为本公开第四实施例所述激光烧结设备的平面结构示意图；
图9为本公开第四实施例所述激光烧结设备的扫描方向改变时的示意图。
具体实施方式
为使本公开的目的、技术方案和优点更加清楚，下面将结合附图及具体实施例对本公开进行详细描述。
本公开具体实施例所述激光烧结设备包括：
第一激光头，用于输出第一功率的激光；
第二激光头，用于输出第二功率的激光；
驱动装置，用于驱动所述第一激光头与所述第二激光头移动，使所述第一激光头和第二激光头分别对待烧结材料上的同一区域进行加热。
本公开实施例所述激光烧结设备，在现有激光封装所用激光头的基础上，增加一个激光头，并在利用两个激光头对待烧结装置上所设置的待烧结材料进行加热时，使两个激光头依次分别对待烧结材料进行加热，这样在进行激光烧结之前对待烧结材料进行预热，或者激光烧结之后对已烧结材料进行退火处理，从而减小激光烧结前相较于激光烧结时的温度差或者减小激光烧结后温度的下降速度，以减小待烧结材料和基板的应力，避免由于收缩应力造成的裂纹甚至破损情况。
较佳地，所述第一激光头与所述第二激光头分别对待烧结材料上的同一区域进行加热时，使所述第一激光头和所述第二激光头以相同速率同时移动，这样第一激光头和第二激光头在同时对待烧结材料的其中一区域进行移动扫描的过程，先后对该区域进行加热，使整个激光烧结设备结构简单、易于控制。
本公开实施例中，第二激光头输出为第二功率的激光，第一激光头输出为第一功率的激光，第二功率大于第一功率，具体地第二激光头所输出激光 用于显示器封装时玻璃胶的烧结，使玻璃胶的温度达到800至1000度；第一激光头所输出激光用于在玻璃胶烧结之前的预热，或者用于玻璃烧结之后的退火，使玻璃胶加热达到温度为400至500度。
本公开上述结构的激光烧结设备，可以用于显示器的封装，通过激光对待封装显示器所涂覆的玻璃胶部分进行加热，以使玻璃胶升温融化将显示器的两部分组装在一起。因此，上述的激光烧结设备应用于显示器封装时，所述待烧结装置为待封装显示器，所述待烧结材料为玻璃胶。
以下将以本公开所述激光烧结设备应用于显示器封装为例，对本公开具体实施例的结构进行详细描述。
图1为通常显示器的剖面结构示意图，图2为显示器的平面结构示意图。参阅图1和图2，显示器包括相对且平行设置的背板玻璃1和盖板玻璃2。其中，背板玻璃1与盖板玻璃2之间设置用于实现图像显示的器件；对于OLED显示器来说，背板玻璃1与盖板玻璃2之间设置各发光功能层。在封装时，沿背板玻璃1的边框部分四周涂覆玻璃胶3，将盖板玻璃2盖设于发光功能层的上方，之后使激光头所输出激光对准盖板玻璃2表面的玻璃胶对应区域，并沿着边框的玻璃胶对应区域进行扫描，进行激光烧结，使背板玻璃1与盖板玻璃2固结在一起。
图3为本公开第一实施例所述激光烧结设备的应用示意图，以图2中剖面A-A上方设置激光烧结设备为例。在第一实施例中，第一激光头10与第二激光头20固连在一起，以相同速率在盖板玻璃2上方沿玻璃胶3的对应区域进行扫描，当第二激光头20至第一激光头10的方向与扫描方向一致，也即第二激光头20相较于第一激光头10位于第一激光头10朝扫描方向的相反方向时，则进行移动扫描，在同时移动扫描的过程中，第一激光头10与第二激光头20均输出激光时，第一激光头10所输出激光首先到达盖板玻璃2上玻璃胶3的对应区域，之后第二激光头20所输出激光才能达到玻璃胶3的对应区域。采用该实施例的激光烧结设备，第一激光头10所输出激光用于在玻璃胶烧结之前的预热，使玻璃胶3达到温度至400至500度时，第二激光头20所输出激光对玻璃胶3进行烧结，使玻璃胶3达到温度至800至1000度，通过在进行激光烧结之前对待封装显示器的玻璃胶部分进行预热，能够减小 激光烧结前相较于激光烧结时的温度差，以减小玻璃胶和玻璃基板的应力，避免由于收缩应力造成的裂纹甚至破损情况。
图4为本公开第二实施例所述激光烧结设备的应用示意图，同样以图2中剖面A-A上方设置激光烧结设备为例。与第一实施例相同，在第二实施例中，第一激光头10与第二激光头20固连在一起，以相同速率在盖板玻璃2上方沿玻璃胶3的对应区域进行扫描。但与第一实施例不同，第二实施例中，第一激光头10至第二激光头20的方向与扫描方向一致，也即第一激光头10相较于第二激光头20位于第二激光头20朝扫描方向的相反方向，进行扫描。则当第一激光头10与第二激光头20同时输出激光时，第二激光头20所输出激光首先到达盖板玻璃2上玻璃胶3的对应区域，之后第一激光头10所输出激光才到达玻璃胶3的对应区域。采用该实施例的激光烧结设备，首先第二激光头20所输出激光对玻璃胶3加热，使玻璃胶3的温度达到800至1000度，对玻璃胶3进行烧结，之后第一激光头10所输出激光才到达玻璃胶3的对应区域，使玻璃胶3的温度缓慢达到400至500度时停止加热，对玻璃胶3进行退火处理，从而减小激光烧结后温度的下降速度，以减小玻璃胶和玻璃基板的应力，避免由于收缩应力造成的裂纹甚至破损情况。
图5为本公开第三实施例所述激光烧结设备的应用示意图，同样以图2中剖面A-A上方设置激光烧结设备为例。在第三实施例中，所述激光烧结设备除包括第一激光头10和第二激光头20之外，还包括第三激光头30，用于输出第三功率的激光，所述第三功率小于第二功率。在第三实施例中，第一激光头10、第二激光头20和第三激光头30固连在一起，以相同速率在盖板玻璃2上方沿玻璃胶3的对应区域进行扫描。所述驱动装置还用于使所述第三激光头30与所述第一激光头10、所述第二激光头20一起对玻璃胶3的对应区域进行扫描，所述第一激光头10、所述第二激光头20和所述第三激光头30依序先后分别对玻璃胶进行加热。这样，利用第一激光头10先对玻璃胶3进行预热，使玻璃胶3的温度达到400至500度，之后再利用第二激光头20对玻璃胶3进行烧结，使玻璃胶3的温度达到800至1000度，再后再利用第三激光头30对玻璃胶3进行退火，使玻璃胶3缓慢降温至400至500度，如图6所示的温度曲线图，激光烧结前玻璃胶缓慢升温以及激光烧结之 后缓慢降温，采用该温度梯度烧结和退火，能够减小玻璃胶和玻璃基板的应力，避免由于收缩应力造成的裂纹甚至破损情况。
参阅图2，在显示器中，玻璃胶3通常沿边框设置，因此在盖板玻璃2所在平面形成为封闭的长方形形状，在采用两个激光头或三个激光头同时沿盖板玻璃2上方玻璃胶3的形状进行扫描加热时，为保证各激光头对玻璃胶3的加热顺序不变，需要根据玻璃胶3的形状改变各激光头之间的相对关系。因此，本公开实施例所述激光烧结设备，所述驱动装置还用于调节各激光头的位置。以第三实施例中所包括的三个激光头为例，所述驱动装置具体包括：
第一控制结构，用于使所述第一激光头10、所述第二激光头20和所述第三激光头30以相同速率沿第一方向对玻璃胶3进行扫描；
第二控制结构，用于调节所述第一激光头10、所述第二激光头20和/或所述第三激光头30的位置，使从所述第二激光头30至所述第一激光头10的方向、以及从所述第三激光头30至所述第二激光头20的方向始终与所述第一方向保持相同。
也即通过调节所述第一激光头10、所述第二激光头20和/或所述第三激光头30的位置，使第三激光头30、第二激光头20和第一激光头10的排列方向与扫描方向相同，这样沿扫描方向进行扫描时，第一激光头10、第二激光头20和第三激光头30依次对同一区域的玻璃胶30进行加热。
上述中的第一方向为显示器封装过程中，沿显示器边框的玻璃胶移动的方向，本领域技术人员可以理解，显示器的边框通常为长方形，沿边框设置的玻璃胶也形成为长方形，因此对于显示器的封装过程，利用激光烧结设备对玻璃胶进行激光加热固化时，所输出激光沿玻璃胶扫描的方向依据玻璃胶的设置形状变化，也即第一方向为依据玻璃胶的设置形状而变化。上述各激光头进行移动扫描的过程也即是将整个玻璃胶进行激光加热固化的过程。
为使各激光头的位置调节简单、方便，本公开提供第四实施例的激光烧结设备，参阅图7和图8所示，在第四实施例中，所述激光烧结设备还包括一固定台40，所述固定台40上设置有环形轨道41，其中所述第二激光头20固定设置于所述环形轨道41的中心，所述第一激光头10和所述第三激光头30设置于所述环形轨道41上，并分设于第二激光头20的两侧。
进一步地，所述驱动装置包括与所述第一激光头10连接的第一马达11，用于使所述第一激光头10绕所述环形轨道41移动；还包括与所述第三激光头30连接的第二马达31，用于使所述第三激光头30绕所述环形轨道41移动。
利用上述的结构，参阅图9所示，当使激光烧结设备沿玻璃胶3的形状进行扫描加热时，当扫描方向改变时，通过第一马达11使第一激光头10在环形轨道41上绕第二激光头20转动，通过第二马达31使第三激光头30在绕环形轨道41上绕第二激光头20转动，无论扫描方向如何改变，保证第三激光头30、第二激光头20和第一激光头10的依序排列方向与扫描方向相同。
本公开第三实施例和第四实施例的激光烧结设备中，第一激光头10所输出激光的第一功率和第三激光头30所输出激光的第三功率相较于第二激光头所输出激光的第二功率低20-40％。此外，第一功率可以等于第三功率，但不限于此。且较佳地，所述第二激光头20与所述第一激光头10以及所述第二激光头20与所述第三激光头30之间的距离分别为2-5mm，以该结构参数和工艺参数能够保证获得较佳的烧结效果。
另外，优选地，所述第一激光头10、所述第二激光头20和所述第三激光头30的光路相互平行，分别相对于盖板玻璃2所在平面垂直地入射至玻璃胶3所在区域。
本公开实施例另一方面提供一种采用如上激光烧结设备的激光烧结方法，所述激光烧结方法包括：
所述第一激光头输出第一功率的激光；
所述第二激光头输出第二功率的激光；
所述第一激光头与所述第二激光头移动，分别对待烧结材料上的同一区域进行加热。
较佳地，所述第一激光头与所述第二激光头分别对待烧结材料上的同一区域进行加热的步骤中，所述第一激光头和所述第二激光头以相同速率同时移动。
本公开上述结构的激光烧结设备，可以应用于显示器的封装，通过激光对待封装显示器所涂覆的玻璃胶部分进行加热，以使玻璃胶升温融化将显示 器的两部分组装在一起。因此，上述的激光烧结设备应用于显示器封装时，所述待烧结装置为待封装显示器，所述待烧结材料为玻璃胶。
采用本公开实施例的激光烧结方法，用于显示器的封装时，第二激光头所输出激光使玻璃胶达到温度800至1000度，对玻璃胶进行烧结；利用第一激光头对玻璃胶加热至400至500度；第一激光头可以在第二激光头之前先对玻璃胶进行加热，以在玻璃胶烧结前进行预热，从而减小激光烧结前相较于激光烧结时的温度差；第一激光头也可以在第二激光头烧结之后再对玻璃胶进行加热，以对烧结之后的玻璃胶进行退火处理，从而减小激光烧结后温度的下降速度，减小玻璃胶和玻璃基板的应力，避免由于收缩应力造成的裂纹甚至破损情况。
进一步地，所述激光烧结方法还包括：
第三激光头输出第三功率的激光，其中所述第三功率和所述第一功率小于所述第二功率；
所述第一激光头、所述第二激光头和所述第三激光头分别对待烧结材料上的同一区域进行加热。
在用于显示器的封装时，利用第一激光头先对玻璃胶进行预热，使玻璃胶的温度达到400至500度，之后再利用第二激光头对玻璃胶进行烧结，使玻璃胶的温度达到800至1000度，然后再利用第三激光头对玻璃胶进行退火，使玻璃胶缓慢降温至400至500度，采用该温度梯度烧结和退火，减小玻璃胶和玻璃基板的应力，避免由于收缩应力造成的裂纹甚至破损情况，获得较佳的效果。较佳地，在所述第一激光头、所述第二激光头和所述第三激光头分别对待烧结材料上的同一区域进行加热的步骤中，具体地所述第一激光头、所述第二激光头和所述第三激光头以相同速率沿第一方向移动，先后分别对待烧结材料的同一区域进行扫描。
此外，在使所述第一激光头、所述第二激光头和所述第三激光头以相同速率沿第一方向移动的步骤中，还包括：
调节所述第一激光头、所述第二激光头和/或所述第三激光头的位置，使从所述第二激光头至所述第一激光头的方向、以及从所述第三激光头至所述第二激光头的方向始终与所述第一方向保持相同。
此外，较佳地，所述第一功率和所述第三功率相较于所述第一功率分别低20-40％。
本公开实施例所述激光烧结设备和激光烧结方法，能够减小玻璃胶和玻璃基板的应力，避免由于收缩应力造成的裂纹甚至破损情况，从而提高烧结良率。
以上所述的是本公开的优选实施方式，应当指出对于本技术领域的普通人员来说，在不脱离本公开所述的原理前提下还可以作出若干改进和润饰，这些改进和润饰也在本公开的保护范围内。

Claims (20)

  1. 一种激光烧结设备，包括：
    第一激光头，用于输出第一功率的激光；
    第二激光头，用于输出第二功率的激光；
    驱动装置，用于驱动所述第一激光头与所述第二激光头移动，使所述第一激光头和所述第二激光头分别对待烧结材料上的同一区域进行加热。
  2. 如权利要求1所述的激光烧结设备，其中，所述激光烧结设备还包括：
    第三激光头，用于输出第三功率的激光，其中所述第三功率以及所述第一功率小于所述第二功率；
    所述驱动装置还用于使所述第三激光头移动，所述第一激光头、所述第二激光头和所述第三激光头分别对待烧结材料上的同一区域进行加热。
  3. 如权利要求1所述的激光烧结设备，其中，所述驱动装置用于驱动所述第一激光头和所述第二激光头以相同速率同时移动。
  4. 如权利要求2所述的激光烧结设备，其中，所述驱动装置包括：
    第一控制结构，用于使所述第一激光头、所述第二激光头和所述第三激光头以相同速率沿第一方向移动对待烧结材料进行扫描；
    第二控制结构，用于调节所述第一激光头、所述第二激光头和/或所述第三激光头的位置，使从所述第二激光头至所述第一激光头的方向、以及从所述第三激光头至所述第二激光头的方向始终与所述第一方向保持相同。
  5. 如权利要求2所述的激光烧结设备，其中，所述激光烧结设备还包括一固定台，所述固定台上设置有环形轨道，所述第二激光头固定设置于所述环形轨道的中心，所述第一激光头和所述第三激光头设置于所述环形轨道上，并分设于所述第二激光头的两侧。
  6. 如权利要求5所述的激光烧结设备，其中，所述驱动装置包括与所述第一激光头连接的第一马达，用于使所述第一激光头绕所述环形轨道移动；还包括与所述第三激光头连接的第二马达，用于使所述第三激光头绕所述环形轨道移动。
  7. 如权利要求2至6任一项所述的激光烧结设备，其中，所述第一功率 和所述第三功率相较于所述第二功率分别低20-40％。
  8. 如权利要求2至6任一项所述的激光烧结设备，其中，所述第二激光头与所述第一激光头以及所述第二激光头与所述第三激光头之间的距离分别为2-5mm。
  9. 如权利要求2至6任一项所述的激光烧结设备，其中，所述第一激光头、所述第二激光头和所述第三激光头的光路相互平行。
  10. 一种采用权利要求1所述激光烧结设备的激光烧结方法，其中，所述激光烧结方法包括：
    所述第一激光头输出第一功率的激光；
    所述第二激光头输出第二功率的激光；
    所述第一激光头与所述第二激光头移动，分别对待烧结材料上的同一区域进行加热。
  11. 如权利要求10所述的激光烧结方法，其中，所述激光烧结方法还包括：
    第三激光头输出第三功率的激光，其中所述第三功率和所述第一功率小于所述第二功率；
    所述第一激光头、所述第二激光头和所述第三激光头分别对待烧结材料上的同一区域进行加热。
  12. 如权利要求11所述的激光烧结方法，其中，在所述第一激光头、所述第二激光头和所述第三激光头分别对待烧结材料上的同一区域进行加热的步骤中，具体地使所述第一激光头、所述第二激光头和所述第三激光头以相同速率沿第一方向移动，先后分别对待烧结材料的同一区域进行扫描。
  13. 如权利要求12所述的激光烧结方法，其中，在使所述第一激光头、所述第二激光头和所述第三激光头以相同速率沿第一方向移动的步骤中，还包括：
    调节所述第一激光头、所述第二激光头和/或所述第三激光头的位置，使从所述第二激光头至所述第一激光头的方向、以及从所述第三激光头至所述第二激光头的方向始终与所述第一方向保持相同。
  14. 如权利要求11至13任一项所述的激光烧结方法，其中，所述第一 功率和所述第三功率相较于所述第一功率分别低20-40％。
  15. 如权利要求10所述的激光烧结方法，其中，所述第一激光头与所述第二激光头分别对待烧结材料上的同一区域进行加热的步骤中，所述第一激光头和所述第二激光头以相同速率同时移动。
  16. 一种激光烧结方法，包括：
    用第一激光头和第二激光头输出不同功率的激光；
    驱动所述第一激光头与所述第二激光头沿着烧结材料的分布轨迹按第一方向以相同的速率移动，并使所述第一激光头对所述分布轨迹上的第一区域加热，同时使所述第二激光头对所述分布轨迹上的与所述第一区域邻接的第二区域加热；
    其中，从所述第二区域至所述第一区域的方向为所述第一方向；
    由所述第一激光头输出的激光的功率和由所述第二激光头输出的激光的功率中之一大于等于使所述烧结材料发生烧结的最小功率；由所述第一激光头输出的激光的功率和由所述第二激光头输出的激光的功率中之另一个小于所述最小功率。
  17. 如权利要求16所述的激光烧结方法，其中，所述分布轨迹为封闭的长方形形状。
  18. 如权利要求16所述的激光烧结方法，其中，在所述第一激光头对所述第一区域加热时，所述激光烧结方法还包括：
    驱动第三激光头沿着所述分布轨迹移动从而使得所述第一激光头、所述第二激光头和所述第三激光头按所述第一方向以相同的速率移动，并使所述第三激光头对所述分布轨迹上的第三区域加热；
    其中，所述第三区域与所述第二区域邻接；从所述第三区域至所述第二区域、从所述第二区域至所述第一区域的方向为所述第一方向；
    由所述第二激光头输出的激光的功率大于等于所述最小功率；
    由所述第一激光头输出的激光的功率和由所述第三激光头输出的激光的功率均小于所述最小功率。
  19. 一种激光烧结设备，包括：
    第一激光头，用于输出第一功率的激光；
    第二激光头，用于输出第二功率的激光；
    驱动装置，用于驱动所述第一激光头与所述第二激光头沿着烧结材料的分布轨迹按第一方向以相同的速率移动，使所述第一激光头对所述分布轨迹上的第一区域加热，同时使所述第二激光头对所述分布轨迹上的第二区域加热；
    其中，所述第一区域与所述第二区域邻接，且从所述第二区域至所述第一区域的方向为所述第一方向；
    所述第一功率与所述第二功率中之一大于等于使所述烧结材料发生烧结的最小功率；所述第一功率与所述第二功率中之另一个小于所述最小功率。
  20. 如权利要求19所述的激光烧结设备，其中，所述激光烧结设备还包括：
    第三激光头，用于输出第三功率的激光；
    所述驱动装置还用于使所述第三激光头沿着所述分布轨迹移动从而使得所述第一激光头、所述第二激光头和所述第三激光头按所述第一方向以相同的速率移动，并在所述第一激光头对所述第一区域加热时使所述第三激光头对所述分布轨迹上的第三区域加热；
    其中，所述第三区域与所述第二区域邻接；从所述第三区域至所述第二区域、从所述第二区域至所述第一区域的方向为所述第一方向；
    所述第二功率大于等于所述最小功率；
    所述第一功率和所述第三功率均小于所述最小功率。
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