CN104685627B - 加工柔性玻璃基片 - Google Patents
加工柔性玻璃基片 Download PDFInfo
- Publication number
- CN104685627B CN104685627B CN201380041476.3A CN201380041476A CN104685627B CN 104685627 B CN104685627 B CN 104685627B CN 201380041476 A CN201380041476 A CN 201380041476A CN 104685627 B CN104685627 B CN 104685627B
- Authority
- CN
- China
- Prior art keywords
- substrate
- flexible glass
- glass substrate
- adhesive layer
- inorganic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
- H10D86/0214—Manufacture or treatment of multiple TFTs using temporary substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/54—Yield strength; Tensile strength
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/542—Shear strength
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/702—Amorphous
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/202—LCD, i.e. liquid crystal displays
Landscapes
- Joining Of Glass To Other Materials (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261691904P | 2012-08-22 | 2012-08-22 | |
| US61/691,904 | 2012-08-22 | ||
| PCT/US2013/054473 WO2014031372A1 (en) | 2012-08-22 | 2013-08-12 | Processing flexible glass substrates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104685627A CN104685627A (zh) | 2015-06-03 |
| CN104685627B true CN104685627B (zh) | 2017-12-05 |
Family
ID=49034218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380041476.3A Expired - Fee Related CN104685627B (zh) | 2012-08-22 | 2013-08-12 | 加工柔性玻璃基片 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2015532004A (enExample) |
| KR (1) | KR20150046218A (enExample) |
| CN (1) | CN104685627B (enExample) |
| TW (1) | TWI589443B (enExample) |
| WO (1) | WO2014031372A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016069821A1 (en) * | 2014-10-31 | 2016-05-06 | Corning Incorporated | Dimensionally stable fast etching glasses |
| CN104992944B (zh) * | 2015-05-26 | 2018-09-11 | 京东方科技集团股份有限公司 | 一种柔性显示母板及柔性显示面板的制作方法 |
| KR102649238B1 (ko) | 2016-10-26 | 2024-03-21 | 삼성디스플레이 주식회사 | 표시패널, 이를 포함하는 적층 기판, 및 표시패널 제조방법 |
| JP7091121B2 (ja) * | 2018-04-18 | 2022-06-27 | 信越石英株式会社 | 石英ガラス板 |
| CN108962028B (zh) | 2018-07-10 | 2020-03-31 | 云谷(固安)科技有限公司 | 柔性显示屏盖板、柔性显示模组和柔性显示装置 |
| CN112297546A (zh) * | 2019-07-24 | 2021-02-02 | 东旭光电科技股份有限公司 | 显示面板的制备方法 |
| CN111393032B (zh) * | 2020-04-13 | 2022-07-08 | Oppo广东移动通信有限公司 | 微晶玻璃盖板、柔性屏组件、电子设备及微晶玻璃盖板加工方法 |
| KR102815849B1 (ko) * | 2020-11-02 | 2025-06-05 | 삼성디스플레이 주식회사 | 유연성 글라스 제조를 위한 유리적층 구조물 및 이의 제조방법 |
| CN112582576A (zh) * | 2020-12-10 | 2021-03-30 | 深圳市华星光电半导体显示技术有限公司 | 柔性基板制备方法及显示面板 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060207967A1 (en) * | 2003-07-03 | 2006-09-21 | Bocko Peter L | Porous processing carrier for flexible substrates |
| US20090266471A1 (en) * | 2008-04-29 | 2009-10-29 | Myung-Hwan Kim | Method of fabricating flexible display device |
| CN102007524A (zh) * | 2008-04-17 | 2011-04-06 | 旭硝子株式会社 | 玻璃层叠体、带支撑体的显示装置用面板及它们的制造方法 |
| WO2012056867A1 (ja) * | 2010-10-29 | 2012-05-03 | 東京応化工業株式会社 | 積層体、およびその積層体の分離方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5281560A (en) * | 1993-06-21 | 1994-01-25 | Corning Incorporated | Non-lead sealing glasses |
| DE69739376D1 (de) * | 1996-08-27 | 2009-06-04 | Seiko Epson Corp | Ablösungsverfahren und Verfahren zum Übertragen eines Dünnfilm-Bauelements |
| JP2000252342A (ja) * | 1999-03-01 | 2000-09-14 | Seiko Epson Corp | 薄板の搬送方法および液晶パネルの製造方法 |
| JP2004186201A (ja) * | 2002-11-29 | 2004-07-02 | Sekisui Chem Co Ltd | 薄層ガラスパネルの取扱い方法 |
| JP2007036074A (ja) * | 2005-07-29 | 2007-02-08 | Toshiba Corp | 半導体装置の製造方法 |
| JP2006152308A (ja) * | 2005-12-28 | 2006-06-15 | Nitto Denko Corp | 電子部品の切断方法 |
| KR100820170B1 (ko) * | 2006-08-30 | 2008-04-10 | 한국전자통신연구원 | 플렉시블 기판의 적층 방법 |
| EP2351718A4 (en) * | 2008-10-23 | 2013-05-08 | Asahi Glass Co Ltd | GLASS SUPPLY LAMINATED DEVICE AND METHOD FOR PRODUCING LAMINATE GLASS SUBSTRATE |
| US9063605B2 (en) * | 2009-01-09 | 2015-06-23 | Apple Inc. | Thin glass processing using a carrier |
| JP2011003668A (ja) * | 2009-06-17 | 2011-01-06 | Seiko Epson Corp | 素子の転写方法および電子機器の製造方法 |
| JP2012064710A (ja) * | 2010-09-15 | 2012-03-29 | Asahi Glass Co Ltd | 半導体素子の製造方法 |
-
2013
- 2013-08-12 KR KR20157007085A patent/KR20150046218A/ko not_active Withdrawn
- 2013-08-12 JP JP2015528515A patent/JP2015532004A/ja not_active Ceased
- 2013-08-12 CN CN201380041476.3A patent/CN104685627B/zh not_active Expired - Fee Related
- 2013-08-12 WO PCT/US2013/054473 patent/WO2014031372A1/en not_active Ceased
- 2013-08-15 TW TW102129312A patent/TWI589443B/zh not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060207967A1 (en) * | 2003-07-03 | 2006-09-21 | Bocko Peter L | Porous processing carrier for flexible substrates |
| CN102007524A (zh) * | 2008-04-17 | 2011-04-06 | 旭硝子株式会社 | 玻璃层叠体、带支撑体的显示装置用面板及它们的制造方法 |
| US20090266471A1 (en) * | 2008-04-29 | 2009-10-29 | Myung-Hwan Kim | Method of fabricating flexible display device |
| WO2012056867A1 (ja) * | 2010-10-29 | 2012-05-03 | 東京応化工業株式会社 | 積層体、およびその積層体の分離方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015532004A (ja) | 2015-11-05 |
| TW201410474A (zh) | 2014-03-16 |
| TWI589443B (zh) | 2017-07-01 |
| CN104685627A (zh) | 2015-06-03 |
| KR20150046218A (ko) | 2015-04-29 |
| WO2014031372A1 (en) | 2014-02-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171205 Termination date: 20190812 |