CN104685627B - 加工柔性玻璃基片 - Google Patents

加工柔性玻璃基片 Download PDF

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Publication number
CN104685627B
CN104685627B CN201380041476.3A CN201380041476A CN104685627B CN 104685627 B CN104685627 B CN 104685627B CN 201380041476 A CN201380041476 A CN 201380041476A CN 104685627 B CN104685627 B CN 104685627B
Authority
CN
China
Prior art keywords
substrate
flexible glass
glass substrate
adhesive layer
inorganic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201380041476.3A
Other languages
English (en)
Chinese (zh)
Other versions
CN104685627A (zh
Inventor
S·M·加纳
R·G·曼利
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corning Inc
Original Assignee
Corning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Inc filed Critical Corning Inc
Publication of CN104685627A publication Critical patent/CN104685627A/zh
Application granted granted Critical
Publication of CN104685627B publication Critical patent/CN104685627B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/06Interconnection of layers permitting easy separation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01Manufacture or treatment
    • H10D86/021Manufacture or treatment of multiple TFTs
    • H10D86/0214Manufacture or treatment of multiple TFTs using temporary substrates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/50Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54Yield strength; Tensile strength
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/50Properties of the layers or laminate having particular mechanical properties
    • B32B2307/542Shear strength
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/70Other properties
    • B32B2307/702Amorphous
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/20Displays, e.g. liquid crystal displays, plasma displays
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/20Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/202LCD, i.e. liquid crystal displays

Landscapes

  • Joining Of Glass To Other Materials (AREA)
  • Laminated Bodies (AREA)
CN201380041476.3A 2012-08-22 2013-08-12 加工柔性玻璃基片 Expired - Fee Related CN104685627B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261691904P 2012-08-22 2012-08-22
US61/691,904 2012-08-22
PCT/US2013/054473 WO2014031372A1 (en) 2012-08-22 2013-08-12 Processing flexible glass substrates

Publications (2)

Publication Number Publication Date
CN104685627A CN104685627A (zh) 2015-06-03
CN104685627B true CN104685627B (zh) 2017-12-05

Family

ID=49034218

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380041476.3A Expired - Fee Related CN104685627B (zh) 2012-08-22 2013-08-12 加工柔性玻璃基片

Country Status (5)

Country Link
JP (1) JP2015532004A (enExample)
KR (1) KR20150046218A (enExample)
CN (1) CN104685627B (enExample)
TW (1) TWI589443B (enExample)
WO (1) WO2014031372A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016069821A1 (en) * 2014-10-31 2016-05-06 Corning Incorporated Dimensionally stable fast etching glasses
CN104992944B (zh) * 2015-05-26 2018-09-11 京东方科技集团股份有限公司 一种柔性显示母板及柔性显示面板的制作方法
KR102649238B1 (ko) 2016-10-26 2024-03-21 삼성디스플레이 주식회사 표시패널, 이를 포함하는 적층 기판, 및 표시패널 제조방법
JP7091121B2 (ja) * 2018-04-18 2022-06-27 信越石英株式会社 石英ガラス板
CN108962028B (zh) 2018-07-10 2020-03-31 云谷(固安)科技有限公司 柔性显示屏盖板、柔性显示模组和柔性显示装置
CN112297546A (zh) * 2019-07-24 2021-02-02 东旭光电科技股份有限公司 显示面板的制备方法
CN111393032B (zh) * 2020-04-13 2022-07-08 Oppo广东移动通信有限公司 微晶玻璃盖板、柔性屏组件、电子设备及微晶玻璃盖板加工方法
KR102815849B1 (ko) * 2020-11-02 2025-06-05 삼성디스플레이 주식회사 유연성 글라스 제조를 위한 유리적층 구조물 및 이의 제조방법
CN112582576A (zh) * 2020-12-10 2021-03-30 深圳市华星光电半导体显示技术有限公司 柔性基板制备方法及显示面板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060207967A1 (en) * 2003-07-03 2006-09-21 Bocko Peter L Porous processing carrier for flexible substrates
US20090266471A1 (en) * 2008-04-29 2009-10-29 Myung-Hwan Kim Method of fabricating flexible display device
CN102007524A (zh) * 2008-04-17 2011-04-06 旭硝子株式会社 玻璃层叠体、带支撑体的显示装置用面板及它们的制造方法
WO2012056867A1 (ja) * 2010-10-29 2012-05-03 東京応化工業株式会社 積層体、およびその積層体の分離方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5281560A (en) * 1993-06-21 1994-01-25 Corning Incorporated Non-lead sealing glasses
DE69739376D1 (de) * 1996-08-27 2009-06-04 Seiko Epson Corp Ablösungsverfahren und Verfahren zum Übertragen eines Dünnfilm-Bauelements
JP2000252342A (ja) * 1999-03-01 2000-09-14 Seiko Epson Corp 薄板の搬送方法および液晶パネルの製造方法
JP2004186201A (ja) * 2002-11-29 2004-07-02 Sekisui Chem Co Ltd 薄層ガラスパネルの取扱い方法
JP2007036074A (ja) * 2005-07-29 2007-02-08 Toshiba Corp 半導体装置の製造方法
JP2006152308A (ja) * 2005-12-28 2006-06-15 Nitto Denko Corp 電子部品の切断方法
KR100820170B1 (ko) * 2006-08-30 2008-04-10 한국전자통신연구원 플렉시블 기판의 적층 방법
EP2351718A4 (en) * 2008-10-23 2013-05-08 Asahi Glass Co Ltd GLASS SUPPLY LAMINATED DEVICE AND METHOD FOR PRODUCING LAMINATE GLASS SUBSTRATE
US9063605B2 (en) * 2009-01-09 2015-06-23 Apple Inc. Thin glass processing using a carrier
JP2011003668A (ja) * 2009-06-17 2011-01-06 Seiko Epson Corp 素子の転写方法および電子機器の製造方法
JP2012064710A (ja) * 2010-09-15 2012-03-29 Asahi Glass Co Ltd 半導体素子の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060207967A1 (en) * 2003-07-03 2006-09-21 Bocko Peter L Porous processing carrier for flexible substrates
CN102007524A (zh) * 2008-04-17 2011-04-06 旭硝子株式会社 玻璃层叠体、带支撑体的显示装置用面板及它们的制造方法
US20090266471A1 (en) * 2008-04-29 2009-10-29 Myung-Hwan Kim Method of fabricating flexible display device
WO2012056867A1 (ja) * 2010-10-29 2012-05-03 東京応化工業株式会社 積層体、およびその積層体の分離方法

Also Published As

Publication number Publication date
JP2015532004A (ja) 2015-11-05
TW201410474A (zh) 2014-03-16
TWI589443B (zh) 2017-07-01
CN104685627A (zh) 2015-06-03
KR20150046218A (ko) 2015-04-29
WO2014031372A1 (en) 2014-02-27

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EXSB Decision made by sipo to initiate substantive examination
SE01 Entry into force of request for substantive examination
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CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20171205

Termination date: 20190812