JP2015530630A - コーティングのパターニング方法 - Google Patents

コーティングのパターニング方法 Download PDF

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Publication number
JP2015530630A
JP2015530630A JP2015518434A JP2015518434A JP2015530630A JP 2015530630 A JP2015530630 A JP 2015530630A JP 2015518434 A JP2015518434 A JP 2015518434A JP 2015518434 A JP2015518434 A JP 2015518434A JP 2015530630 A JP2015530630 A JP 2015530630A
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layer
solvent
substrate
soluble
carbon
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Ceased
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JP2015518434A
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English (en)
Japanese (ja)
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JP2015530630A5 (enExample
Inventor
ランジス ディヴィガルピティヤ，
ランジス ディヴィガルピティヤ，
ミカイル エル． ペクロヴスキー，
ミカイル エル． ペクロヴスキー，
ショーン シー． ドッズ，
ショーン シー． ドッズ，
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3M Innovative Properties Co
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3M Innovative Properties Co
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Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2015530630A publication Critical patent/JP2015530630A/ja
Publication of JP2015530630A5 publication Critical patent/JP2015530630A5/ja
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/32—Processes for applying liquids or other fluent materials using means for protecting parts of a surface not to be coated, e.g. using stencils, resists
    • B05D1/322—Removable films used as masks
    • B05D1/327—Masking layer made of washable film
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/046—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by electromagnetic means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0036—Details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/881—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being a two-dimensional material
    • H10D62/882—Graphene
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24893—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including particulate material

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP2015518434A 2012-06-22 2013-06-10 コーティングのパターニング方法 Ceased JP2015530630A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261663097P 2012-06-22 2012-06-22
US61/663,097 2012-06-22
PCT/US2013/044921 WO2013191939A1 (en) 2012-06-22 2013-06-10 Methods for patterning coatings

Publications (2)

Publication Number Publication Date
JP2015530630A true JP2015530630A (ja) 2015-10-15
JP2015530630A5 JP2015530630A5 (enExample) 2016-06-02

Family

ID=49769222

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015518434A Ceased JP2015530630A (ja) 2012-06-22 2013-06-10 コーティングのパターニング方法

Country Status (5)

Country Link
US (1) US20150118457A1 (enExample)
EP (1) EP2864999A4 (enExample)
JP (1) JP2015530630A (enExample)
CN (1) CN104471674A (enExample)
WO (1) WO2013191939A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015047572A1 (en) 2013-09-24 2015-04-02 3M Innovative Properties Company Transferable transparent conductive patterns and display stack materials
KR101668817B1 (ko) * 2014-09-11 2016-10-25 주식회사 엘엠에스 전기적 특성이 향상된 그래핀 구조체
CN105415215B (zh) * 2015-11-06 2017-11-24 富耐克超硬材料股份有限公司 一种超硬磨料有序排布方法
US9793132B1 (en) * 2016-05-13 2017-10-17 Applied Materials, Inc. Etch mask for hybrid laser scribing and plasma etch wafer singulation process
US11241711B2 (en) * 2017-03-22 2022-02-08 3M Innovative Properties Company Buff-coated article and method of making the same
JP2018180168A (ja) * 2017-04-07 2018-11-15 ホヤ レンズ タイランド リミテッドＨＯＹＡ Ｌｅｎｓ Ｔｈａｉｌａｎｄ Ｌｔｄ 処理パターンが形成された光学部材の製造方法
CN108330434A (zh) * 2018-01-11 2018-07-27 广东欧珀移动通信有限公司 板材及制备方法、壳体、电子设备
TWI751863B (zh) * 2020-12-28 2022-01-01 新唐科技股份有限公司 半導體結構

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05327178A (ja) * 1991-03-28 1993-12-10 Unitika Ltd 透明導電性基体の連続製造方法
JP2003532528A (ja) * 2000-05-09 2003-11-05 スリーエム イノベイティブ プロパティズ カンパニー コーティングおよび方法
JP2004053955A (ja) * 2002-07-19 2004-02-19 Mitsubishi Chemicals Corp 磁化パターン形状規定用マスクに対する薄膜形成方法及び磁化パターン形状規定用マスク、並びに磁化パターン形状規定用マスクの余剰薄膜除去方法
JP2005005721A (ja) * 2003-06-12 2005-01-06 Samsung Electronics Co Ltd 半導体パッケージ用配線基板、その製造方法及びそれを利用した半導体パッケージ
JP2005191526A (ja) * 2003-08-26 2005-07-14 Sony Internatl Europ Gmbh 有機材料又は有機材料と無機材料を組み合わせた材料をパターニングする方法
JP2007081409A (ja) * 2005-09-15 2007-03-29 Samsung Electro-Mechanics Co Ltd 微細パターンを有する印刷回路基板及びその製造方法
JP2010050431A (ja) * 2008-07-25 2010-03-04 Hokkaido Univ フォトレジスパターンの作製方法
JP2010253813A (ja) * 2009-04-24 2010-11-11 Nissha Printing Co Ltd 艶消し状導電性ナノファイバーシート及びその製造方法
JP2012079257A (ja) * 2010-10-06 2012-04-19 Dic Corp 両面粘着シートを用いた透明導電膜積層体およびタッチパネル装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1423952A (en) * 1973-06-26 1976-02-04 Oike & Co Process for preparing a metallized resin film for condenser element
US4895630A (en) * 1985-08-28 1990-01-23 W. H. Brady Co. Rapidly removable undercoating for vacuum deposition of patterned layers onto substrates
US6221562B1 (en) * 1998-11-13 2001-04-24 International Business Machines Corporation Resist image reversal by means of spun-on-glass
US20070026205A1 (en) * 2005-08-01 2007-02-01 Vapor Technologies Inc. Article having patterned decorative coating
KR20070068909A (ko) * 2005-12-27 2007-07-02 주식회사 하이닉스반도체 역 포토레지스트 패턴을 이용한 포토 마스크의 제조방법
US7875219B2 (en) * 2007-10-04 2011-01-25 Nanotek Instruments, Inc. Process for producing nano-scaled graphene platelet nanocomposite electrodes for supercapacitors
JP5112380B2 (ja) * 2009-04-24 2013-01-09 信越化学工業株式会社 パターン形成方法
JP5247936B2 (ja) * 2009-07-23 2013-07-24 ダウ コーニング コーポレーション 反転パターン形成方法及び材料
US8288271B2 (en) * 2009-11-02 2012-10-16 International Business Machines Corporation Method for reworking antireflective coating over semiconductor substrate

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05327178A (ja) * 1991-03-28 1993-12-10 Unitika Ltd 透明導電性基体の連続製造方法
JP2003532528A (ja) * 2000-05-09 2003-11-05 スリーエム イノベイティブ プロパティズ カンパニー コーティングおよび方法
JP2004053955A (ja) * 2002-07-19 2004-02-19 Mitsubishi Chemicals Corp 磁化パターン形状規定用マスクに対する薄膜形成方法及び磁化パターン形状規定用マスク、並びに磁化パターン形状規定用マスクの余剰薄膜除去方法
JP2005005721A (ja) * 2003-06-12 2005-01-06 Samsung Electronics Co Ltd 半導体パッケージ用配線基板、その製造方法及びそれを利用した半導体パッケージ
JP2005191526A (ja) * 2003-08-26 2005-07-14 Sony Internatl Europ Gmbh 有機材料又は有機材料と無機材料を組み合わせた材料をパターニングする方法
JP2007081409A (ja) * 2005-09-15 2007-03-29 Samsung Electro-Mechanics Co Ltd 微細パターンを有する印刷回路基板及びその製造方法
JP2010050431A (ja) * 2008-07-25 2010-03-04 Hokkaido Univ フォトレジスパターンの作製方法
JP2010253813A (ja) * 2009-04-24 2010-11-11 Nissha Printing Co Ltd 艶消し状導電性ナノファイバーシート及びその製造方法
JP2012079257A (ja) * 2010-10-06 2012-04-19 Dic Corp 両面粘着シートを用いた透明導電膜積層体およびタッチパネル装置

Also Published As

Publication number Publication date
WO2013191939A1 (en) 2013-12-27
CN104471674A (zh) 2015-03-25
EP2864999A1 (en) 2015-04-29
EP2864999A4 (en) 2016-03-09
US20150118457A1 (en) 2015-04-30

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