JP2015530630A - コーティングのパターニング方法 - Google Patents
コーティングのパターニング方法 Download PDFInfo
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- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/32—Processes for applying liquids or other fluent materials using means for protecting parts of a surface not to be coated, e.g. using stencils, resists
- B05D1/322—Removable films used as masks
- B05D1/327—Masking layer made of washable film
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- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
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- G06F3/046—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by electromagnetic means
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- H—ELECTRICITY
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
Description
75マイクロメートル厚のPET基板(Cadillac Plastics,Inc.(Toronto,Canada)から入手したMelinex(登録商標)Polyester Film 393)膜の表面上に、標準的なフレキソ技術を使用して20フィート/分(約6.1メートル/分)の速度で水溶性インクパターンを印刷した。ローラーに取り付けたゴム製のスタンプは、(1〜5ミリメートル)寸法の特徴及び間隙を有した。水溶性インクは、約250cPの粘度を有し、概ね米国特許第4,895,630号に記載されるような組成物から構成された。
実施例2は、水溶性インクで印刷されたPET基板を、Magentaミクロスフェア(Tartan Color & Chemicals(Ontario,Canada)から入手したMP−MG5518)と15:85の重量比で混合したグラファイト粉末(TIMREX(登録商標)HSAG 300)を使用してバフィングした以外は、実施例1と同じ方法で調製した。
実施例3は、水溶性インクパターンを約5mmの特徴の間隔及び約40マイクロメートルの特徴の幅で印刷した以外は、実施例2と同じ方法で調製した。バフィング後、炭素コーティングした物品を水で洗浄し、パターン化炭素コーティングを現出させた。水溶性インクパターンの印刷後及び洗浄後の試料の8倍の倍率での光学顕微鏡写真を図6A及び6Bにそれぞれ示す。水溶性インクパターンの印刷後及び洗浄後の試料の100倍の倍率での光学顕微鏡写真を図7A及び7Bにそれぞれ示す。パターン化炭素コーティングの品質は、水溶性インクパターンの品質に詳細に従うことを観察した。
グラファイト粉末の代わりに二硫化モリブデン粉末(MoS2、6マイクロメートルの平均粒度、Rose Mill(Hartford,CT)から入手)をPET基板上にバフィングした以外は、実施例1の方法を繰り返した。印刷されたインクパターンをMoS2粉末でコーティングした後、非常に均一なMoS2層を観察した。水で洗浄後、コーティングされたPETは、約40マイクロメートル幅のパターン化されたMoS2の線を生じた。
グラファイト粉末の代わりに六方晶窒化ホウ素粉末(h−BN、5マイクロメートルの平均粒度、M.K.Impex Corporation(Mississauga,Canada)から入手)をPET基板上にバフィングした以外は、実施例1の方法を繰り返した。水で洗浄後、コーティングされたPETは、約40マイクロメートル幅のパターン化されたh−BNのトレースを生じた。
Claims (14)
- 表面を有する基板を用意する工程と、
前記基板の前記表面上に又は前記表面を覆って溶剤可溶性層をパターンで形成する工程であって、前記パターンが、前記溶剤可溶性層によって覆われる、前記表面の1つ以上の第1部分と、前記溶剤可溶性層のない、前記表面の1つ以上の第2部分とを画定する、工程と、
前記第1部分の少なくとも1つ及び前記第2部分の少なくとも1つの上に、又は前記第1部分の少なくとも1つ及び前記第2部分の少なくとも1つを覆って第2層を形成する工程であって、前記第2層を形成する工程が、前記第1部分の少なくとも1つ及び前記第2部分の少なくとも1つの上に、又は前記第1部分の少なくとも1つ及び前記第2部分の少なくとも1つを覆って剥離性材料をバフィングすることを含む、工程と、
前記基板に溶剤を塗布することによって前記溶剤可溶性層を除去し、それによってパターン化層を形成する工程と、を含む、物品を形成する方法。 - 前記剥離性材料が、導電性炭素、MoS2、WS2、粘土、h−BN(六方晶窒化ホウ素)、PTFE、イオウ、又はそれらの組み合わせを含む、請求項1に記載の方法。
- 前記第2層を形成する工程が、前記第1部分の少なくとも1つ及び前記第2部分の少なくとも1つの上に、又は前記第1部分の少なくとも1つ及び前記第2部分の少なくとも1つを覆って前記剥離性材料の乾燥組成物をバフィングすることを更に含む、請求項1又は2に記載の方法。
- 前記剥離性材料が導電性炭素を含む、請求項1〜3のいずれか一項に記載の方法。
- 前記第2層が、非晶質炭素中に包埋されたグラファイトプレートレットを含む形態を有する、請求項4に記載の方法。
- 前記第2層の平均の厚さが1000ナノメートル未満である、請求項1〜5のいずれか一項に記載の方法。
- 前記パターン化層が、104オーム/平方未満のシート抵抗を有する物品を提供する、請求項1〜6のいずれか一項に記載の方法。
- 前記溶剤可溶性層を除去する工程の後、前記物品が550nmで少なくとも80%の光透過率を有する、請求項1〜7のいずれか一項に記載の方法。
- 前記溶剤可溶性層が水溶性材料を含む、請求項1〜8のいずれか一項に記載の方法。
- 前記溶剤可溶性層が水溶性インクを含む、請求項1〜9のいずれか一項に記載の方法。
- 前記溶剤可溶性層が、水溶性の被膜形成ポリマーと、溶解性促進剤と、前記被膜形成ポリマー中で不溶性である固体粒子と、を含む、請求項1〜10のいずれか一項に記載の方法。
- 前記基板が、透明なポリマー膜を含む、請求項1〜11のいずれか一項に記載の方法。
- 請求項1〜12のいずれか一項に記載の方法によって形成された物品。
- 表面を有する基板を用意する工程と、
前記基板の前記表面上に又は前記表面を覆って溶剤可溶性層をパターンで形成する工程であって、前記パターンが、前記溶剤可溶性層によって覆われる、前記表面の1つ以上の第1部分と、前記溶剤可溶性層のない、前記表面の1つ以上の第2部分とを画定する、工程と、
前記第1部分の少なくとも1つ及び前記第2部分の少なくとも1つの上に、又は前記第1部分の少なくとも1つ及び前記第2部分の少なくとも1つを覆って炭素層を形成する工程であって、前記炭素層を形成する工程が、前記第1部分の少なくとも1つ及び前記第2部分の少なくとも1つの上に、又は前記第1部分の少なくとも1つ及び前記第2部分の少なくとも1つを覆って導電性炭素材料をバフィングすることを含む、工程と、
前記基板に溶剤を塗布することによって前記溶剤可溶性層を除去し、それによってパターン化炭素層を形成する工程と、を含む、方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261663097P | 2012-06-22 | 2012-06-22 | |
US61/663,097 | 2012-06-22 | ||
PCT/US2013/044921 WO2013191939A1 (en) | 2012-06-22 | 2013-06-10 | Methods for patterning coatings |
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JP2015530630A true JP2015530630A (ja) | 2015-10-15 |
JP2015530630A5 JP2015530630A5 (ja) | 2016-06-02 |
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JP2015518434A Ceased JP2015530630A (ja) | 2012-06-22 | 2013-06-10 | コーティングのパターニング方法 |
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US (1) | US20150118457A1 (ja) |
EP (1) | EP2864999A4 (ja) |
JP (1) | JP2015530630A (ja) |
CN (1) | CN104471674A (ja) |
WO (1) | WO2013191939A1 (ja) |
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CN105531114B (zh) | 2013-09-24 | 2017-10-10 | 3M创新有限公司 | 可转移的透明导电图案和显示器叠堆材料 |
KR101668817B1 (ko) * | 2014-09-11 | 2016-10-25 | 주식회사 엘엠에스 | 전기적 특성이 향상된 그래핀 구조체 |
CN105415215B (zh) * | 2015-11-06 | 2017-11-24 | 富耐克超硬材料股份有限公司 | 一种超硬磨料有序排布方法 |
US9793132B1 (en) * | 2016-05-13 | 2017-10-17 | Applied Materials, Inc. | Etch mask for hybrid laser scribing and plasma etch wafer singulation process |
US11241711B2 (en) * | 2017-03-22 | 2022-02-08 | 3M Innovative Properties Company | Buff-coated article and method of making the same |
JP2018180168A (ja) * | 2017-04-07 | 2018-11-15 | ホヤ レンズ タイランド リミテッドHOYA Lens Thailand Ltd | 処理パターンが形成された光学部材の製造方法 |
CN108330434A (zh) * | 2018-01-11 | 2018-07-27 | 广东欧珀移动通信有限公司 | 板材及制备方法、壳体、电子设备 |
TWI751863B (zh) * | 2020-12-28 | 2022-01-01 | 新唐科技股份有限公司 | 半導體結構 |
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US20150118457A1 (en) | 2015-04-30 |
CN104471674A (zh) | 2015-03-25 |
EP2864999A4 (en) | 2016-03-09 |
EP2864999A1 (en) | 2015-04-29 |
WO2013191939A1 (en) | 2013-12-27 |
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