JP2015524556A5 - - Google Patents

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Publication number
JP2015524556A5
JP2015524556A5 JP2015520466A JP2015520466A JP2015524556A5 JP 2015524556 A5 JP2015524556 A5 JP 2015524556A5 JP 2015520466 A JP2015520466 A JP 2015520466A JP 2015520466 A JP2015520466 A JP 2015520466A JP 2015524556 A5 JP2015524556 A5 JP 2015524556A5
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JP
Japan
Prior art keywords
laser diode
incident beam
stacks
laser
light
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JP2015520466A
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English (en)
Japanese (ja)
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JP6282643B2 (ja
JP2015524556A (ja
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Priority claimed from US13/924,216 external-priority patent/US8896827B2/en
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Publication of JP2015524556A publication Critical patent/JP2015524556A/ja
Publication of JP2015524556A5 publication Critical patent/JP2015524556A5/ja
Application granted granted Critical
Publication of JP6282643B2 publication Critical patent/JP6282643B2/ja
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JP2015520466A 2012-06-26 2013-06-26 ウェハ検査ツールのためのダイオードレーザーベースの広帯域光源 Active JP6282643B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261664493P 2012-06-26 2012-06-26
US61/664,493 2012-06-26
US13/924,216 US8896827B2 (en) 2012-06-26 2013-06-21 Diode laser based broad band light sources for wafer inspection tools
US13/924,216 2013-06-21
PCT/US2013/047901 WO2014004679A1 (en) 2012-06-26 2013-06-26 Diode laser based broad band light sources for wafer inspection tools

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018009830A Division JP2018119963A (ja) 2012-06-26 2018-01-24 ウェハ検査ツールのためのダイオードレーザーベースの広帯域光源

Publications (3)

Publication Number Publication Date
JP2015524556A JP2015524556A (ja) 2015-08-24
JP2015524556A5 true JP2015524556A5 (enExample) 2016-08-12
JP6282643B2 JP6282643B2 (ja) 2018-02-21

Family

ID=49774195

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2015520466A Active JP6282643B2 (ja) 2012-06-26 2013-06-26 ウェハ検査ツールのためのダイオードレーザーベースの広帯域光源
JP2018009830A Pending JP2018119963A (ja) 2012-06-26 2018-01-24 ウェハ検査ツールのためのダイオードレーザーベースの広帯域光源
JP2019215516A Active JP6932174B2 (ja) 2012-06-26 2019-11-28 半導体デバイスの検査または計測を実行するための光学装置及び方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2018009830A Pending JP2018119963A (ja) 2012-06-26 2018-01-24 ウェハ検査ツールのためのダイオードレーザーベースの広帯域光源
JP2019215516A Active JP6932174B2 (ja) 2012-06-26 2019-11-28 半導体デバイスの検査または計測を実行するための光学装置及び方法

Country Status (5)

Country Link
US (2) US8896827B2 (enExample)
JP (3) JP6282643B2 (enExample)
KR (2) KR102091987B1 (enExample)
IL (2) IL236401B (enExample)
WO (1) WO2014004679A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8896827B2 (en) 2012-06-26 2014-11-25 Kla-Tencor Corporation Diode laser based broad band light sources for wafer inspection tools
US9128387B2 (en) * 2013-05-14 2015-09-08 Taiwan Semiconductor Manufacturing Co., Ltd. Ultraviolet light emitting diode array light source for photolithography and method
US9581554B2 (en) * 2013-05-30 2017-02-28 Seagate Technology Llc Photon emitter array
US9558858B2 (en) * 2013-08-14 2017-01-31 Kla-Tencor Corporation System and method for imaging a sample with a laser sustained plasma illumination output
US9709510B2 (en) * 2014-06-26 2017-07-18 Kla-Tencor Corp. Determining a configuration for an optical element positioned in a collection aperture during wafer inspection
US9599573B2 (en) 2014-12-02 2017-03-21 Kla-Tencor Corporation Inspection systems and techniques with enhanced detection
US10180248B2 (en) 2015-09-02 2019-01-15 ProPhotonix Limited LED lamp with sensing capabilities
US10257918B2 (en) * 2015-09-28 2019-04-09 Kla-Tencor Corporation System and method for laser-sustained plasma illumination
EP3276389A1 (en) * 2016-07-27 2018-01-31 Fundació Institut de Ciències Fotòniques A common-path interferometric scattering imaging system and a method of using common-path interferometric scattering imaging to detect an object
CN106568396A (zh) * 2016-10-26 2017-04-19 深圳奥比中光科技有限公司 一种激光投影仪及其深度相机
CN106501959A (zh) * 2016-10-26 2017-03-15 深圳奥比中光科技有限公司 一种面阵激光投影仪及其深度相机
DE102017108873A1 (de) * 2017-04-26 2018-10-31 Carl Zeiss Microscopy Gmbh Phasenkontrast-Bildgebung mit Übertragungsfunktion
CN108646167B (zh) * 2018-04-27 2020-12-04 中科晶源微电子技术（北京）有限公司 用于半导体器件的激光辅助的电子束检测设备和方法
CN109211803B (zh) * 2018-09-17 2020-10-09 中国科学院生态环境研究中心 一种基于显微多光谱技术对微塑料进行快速识别的装置
US11262591B2 (en) * 2018-11-09 2022-03-01 Kla Corporation System and method for pumping laser sustained plasma with an illumination source having modified pupil power distribution
WO2020132960A1 (zh) * 2018-12-26 2020-07-02 合刃科技（深圳）有限公司 缺陷检测方法及缺陷检测系统
US11156846B2 (en) * 2019-04-19 2021-10-26 Kla Corporation High-brightness illumination source for optical metrology
KR102170357B1 (ko) * 2019-05-29 2020-10-27 재단법인대구경북과학기술원 비파괴 결함 검출방법
KR20220030067A (ko) 2020-09-02 2022-03-10 삼성전자주식회사 웨이퍼 검사 장치 및 이를 포함하는 시스템
JP2023139436A (ja) 2022-03-22 2023-10-04 株式会社Ｓｃｒｅｅｎホールディングス フォトマスク検査装置
US20240069167A1 (en) * 2022-08-23 2024-02-29 Liturex (Guangzhou) Co. Ltd Mirrorless solid state lidar
US20250072791A1 (en) * 2023-08-30 2025-03-06 GS-HealthMatrix, LLC Multi-device health parameter monitoring systems, methods, and devices
US20250180484A1 (en) * 2023-12-05 2025-06-05 Orbotech Ltd. Apparatus and method for fluorescence detection in electronic devices with high brightness coaxial diode laser illumination

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR880014520A (ko) * 1987-05-12 1988-12-24 안시환 레이저 다이오드 어레이를 사용한 광 디스크 재생장치
US5715270A (en) * 1996-09-27 1998-02-03 Mcdonnell Douglas Corporation High efficiency, high power direct diode laser systems and methods therefor
JPH10282009A (ja) * 1997-04-04 1998-10-23 Toshiba Corp 微粒子評価方法・装置
JPH1164793A (ja) * 1997-08-19 1999-03-05 Fuji Photo Film Co Ltd 半導体レーザ光源装置および放射線画像読取装置
US7028899B2 (en) * 1999-06-07 2006-04-18 Metrologic Instruments, Inc. Method of speckle-noise pattern reduction and apparatus therefore based on reducing the temporal-coherence of the planar laser illumination beam before it illuminates the target object by applying temporal phase modulation techniques during the transmission of the plib towards the target
US6104481A (en) 1997-11-11 2000-08-15 Kabushiki Kaisha Topcon Surface inspection apparatus
US6020957A (en) * 1998-04-30 2000-02-01 Kla-Tencor Corporation System and method for inspecting semiconductor wafers
US6181472B1 (en) * 1998-06-10 2001-01-30 Robotic Vision Systems, Inc. Method and system for imaging an object with a plurality of optical beams
US6959870B2 (en) * 1999-06-07 2005-11-01 Metrologic Instruments, Inc. Planar LED-based illumination array (PLIA) chips
JP4332933B2 (ja) 1999-06-10 2009-09-16 ソニー株式会社 検査装置
JP4030815B2 (ja) * 2001-07-10 2008-01-09 ケーエルエー−テンカー テクノロジィース コーポレイション 同時のまたは連続的な多重の斜視的な試料欠陥検査のためのシステムおよび方法
US6862090B2 (en) 2001-08-09 2005-03-01 Therma-Wave, Inc. Coaxial illumination system
US6809808B2 (en) 2002-03-22 2004-10-26 Applied Materials, Inc. Wafer defect detection system with traveling lens multi-beam scanner
US6979578B2 (en) 2002-08-13 2005-12-27 Lam Research Corporation Process endpoint detection method using broadband reflectometry
US20040207836A1 (en) 2002-09-27 2004-10-21 Rajeshwar Chhibber High dynamic range optical inspection system and method
EP1546691A1 (en) * 2002-09-30 2005-06-29 Applied Materials Israel Ltd. Inspection system with oblique viewing angle
US7126131B2 (en) 2003-01-16 2006-10-24 Metrosol, Inc. Broad band referencing reflectometer
JP2007519259A (ja) * 2004-01-20 2007-07-12 トルンプ フォトニクス，インコーポレイテッド 高出力半導体レーザ
WO2005100961A2 (en) 2004-04-19 2005-10-27 Phoseon Technology, Inc. Imaging semiconductor strucutures using solid state illumination
US20060109876A1 (en) * 2004-11-22 2006-05-25 Selim Shahriar Method and system for combining multiple laser beams using transmission holographic methodologies
US7424902B2 (en) * 2004-11-24 2008-09-16 The Boeing Company In-process vision detection of flaw and FOD characteristics
KR100655545B1 (ko) * 2004-12-23 2006-12-08 엘지전자 주식회사 집적광학 유닛 및 이를 이용한 광 픽업 장치
US7446882B2 (en) 2005-01-20 2008-11-04 Zygo Corporation Interferometer for determining characteristics of an object surface
US8194242B2 (en) * 2005-07-29 2012-06-05 Asml Netherlands B.V. Substrate distortion measurement
JP4721803B2 (ja) * 2005-07-29 2011-07-13 株式会社モリテックス 面照明装置
US7349103B1 (en) 2005-10-31 2008-03-25 N&K Technology, Inc. System and method for high intensity small spot optical metrology
US7372556B2 (en) * 2005-10-31 2008-05-13 The Boeing Company Apparatus and methods for inspecting a composite structure for inconsistencies
JP4723362B2 (ja) 2005-11-29 2011-07-13 株式会社日立ハイテクノロジーズ 光学式検査装置及びその方法
US7405417B2 (en) 2005-12-20 2008-07-29 Asml Netherlands B.V. Lithographic apparatus having a monitoring device for detecting contamination
US7564544B2 (en) * 2006-03-22 2009-07-21 3i Systems Corporation Method and system for inspecting surfaces with improved light efficiency
US7970199B2 (en) 2006-06-05 2011-06-28 Hitachi High-Technologies Corporation Method and apparatus for detecting defect on a surface of a specimen
JP2008066032A (ja) 2006-09-05 2008-03-21 Moritex Corp 照明装置
US7755775B1 (en) 2006-10-03 2010-07-13 N&K Technology, Inc. Broadband optical metrology with reduced wave front distortion, chromatic dispersion compensation and monitoring
DE102006059190B4 (de) * 2006-12-15 2009-09-10 Vistec Semiconductor Systems Gmbh Vorrichtung zur Wafer-Inspektion
WO2008151266A2 (en) 2007-06-05 2008-12-11 Zygo Corporation Interferometry for determining characteristics of an object surface, with spatially coherent illumination
JP4719284B2 (ja) * 2008-10-10 2011-07-06 トヨタ自動車株式会社 表面検査装置
SG164293A1 (en) 2009-01-13 2010-09-29 Semiconductor Technologies & Instruments Pte System and method for inspecting a wafer
DE112011100812T5 (de) * 2010-03-05 2013-03-07 TeraDiode, Inc. System und Verfahren zur Wellenlängenstrahlkombination
WO2011109763A2 (en) * 2010-03-05 2011-09-09 TeraDiode, Inc. Selective repositioning and rotation wavelength beam combining system and method
JP2012013632A (ja) * 2010-07-05 2012-01-19 Sumco Corp 表面欠陥検査装置および表面欠陥検出方法
US8896827B2 (en) 2012-06-26 2014-11-25 Kla-Tencor Corporation Diode laser based broad band light sources for wafer inspection tools

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