JP2015523735A5 - - Google Patents

Download PDF

Info

Publication number
JP2015523735A5
JP2015523735A5 JP2015521750A JP2015521750A JP2015523735A5 JP 2015523735 A5 JP2015523735 A5 JP 2015523735A5 JP 2015521750 A JP2015521750 A JP 2015521750A JP 2015521750 A JP2015521750 A JP 2015521750A JP 2015523735 A5 JP2015523735 A5 JP 2015523735A5
Authority
JP
Japan
Prior art keywords
flow rate
adjusted
substrate
rpm
hydrogen peroxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015521750A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015523735A (ja
JP6088052B2 (ja
Filing date
Publication date
Priority claimed from US13/670,381 external-priority patent/US9875916B2/en
Application filed filed Critical
Publication of JP2015523735A publication Critical patent/JP2015523735A/ja
Publication of JP2015523735A5 publication Critical patent/JP2015523735A5/ja
Application granted granted Critical
Publication of JP6088052B2 publication Critical patent/JP6088052B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2015521750A 2012-07-09 2013-07-09 枚葉式基板システムでフォトレジストを剥離する方法 Active JP6088052B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261669663P 2012-07-09 2012-07-09
US61/669,663 2012-07-09
US13/670,381 US9875916B2 (en) 2012-07-09 2012-11-06 Method of stripping photoresist on a single substrate system
US13/670,381 2012-11-06
PCT/US2013/049760 WO2014011657A2 (en) 2012-07-09 2013-07-09 Method of stripping photoresist on a single substrate system

Publications (3)

Publication Number Publication Date
JP2015523735A JP2015523735A (ja) 2015-08-13
JP2015523735A5 true JP2015523735A5 (https=) 2016-04-14
JP6088052B2 JP6088052B2 (ja) 2017-03-01

Family

ID=48808543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015521750A Active JP6088052B2 (ja) 2012-07-09 2013-07-09 枚葉式基板システムでフォトレジストを剥離する方法

Country Status (4)

Country Link
US (1) US9875916B2 (https=)
JP (1) JP6088052B2 (https=)
KR (1) KR101695111B1 (https=)
WO (1) WO2014011657A2 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6222817B2 (ja) * 2013-09-10 2017-11-01 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
US10464107B2 (en) * 2013-10-24 2019-11-05 SCREEN Holdings Co., Ltd. Substrate processing method and substrate processing apparatus
EP3324663B1 (en) * 2015-08-24 2023-01-11 Huawei Technologies Co., Ltd. Device association method and related device
TWI629720B (zh) 2015-09-30 2018-07-11 Tokyo Electron Limited 用於濕蝕刻製程之溫度的動態控制之方法及設備
US9741585B1 (en) * 2016-04-12 2017-08-22 Taiwan Semiconductor Manufacturing Co., Ltd. Reactive radical treatment for polymer removal and workpiece cleaning
JP7421410B2 (ja) * 2020-04-30 2024-01-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、基板処理方法、学習用データの生成方法、学習方法、学習装置、学習済モデルの生成方法、および、学習済モデル

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3900337A (en) * 1974-04-05 1975-08-19 Ibm Method for stripping layers of organic material
US5269850A (en) * 1989-12-20 1993-12-14 Hughes Aircraft Company Method of removing organic flux using peroxide composition
KR100434485B1 (ko) * 1999-10-08 2004-06-05 삼성전자주식회사 포토레지스트 스트립퍼 조성물 및 이를 이용한 포토레지스트 스트립 방법
JP2001118850A (ja) * 1999-10-18 2001-04-27 Nec Corp 半導体装置の製造方法
US6503693B1 (en) * 1999-12-02 2003-01-07 Axcelis Technologies, Inc. UV assisted chemical modification of photoresist
JP2001196348A (ja) * 2000-01-12 2001-07-19 Seiko Epson Corp 有機物の分解方法、および半導体素子の製造方法
US6524936B2 (en) 2000-12-22 2003-02-25 Axcelis Technologies, Inc. Process for removal of photoresist after post ion implantation
JP3914842B2 (ja) * 2001-10-23 2007-05-16 有限会社ユーエムエス 有機被膜の除去方法および除去装置
US7374696B2 (en) * 2003-02-14 2008-05-20 Applied Materials, Inc. Method and apparatus for removing a halogen-containing residue
US20040244818A1 (en) * 2003-05-13 2004-12-09 Fury Michael A. System and method for cleaning of workpieces using supercritical carbon dioxide
TWI377453B (en) * 2003-07-31 2012-11-21 Akrion Technologies Inc Process sequence for photoresist stripping and/or cleaning of photomasks for integrated circuit manufacturing
US8530359B2 (en) * 2003-10-20 2013-09-10 Novellus Systems, Inc. Modulated metal removal using localized wet etching
JP2005183937A (ja) 2003-11-25 2005-07-07 Nec Electronics Corp 半導体装置の製造方法およびレジスト除去用洗浄装置
JP4369325B2 (ja) * 2003-12-26 2009-11-18 東京エレクトロン株式会社 現像装置及び現像処理方法
JP4439956B2 (ja) * 2004-03-16 2010-03-24 ソニー株式会社 レジスト剥離方法およびレジスト剥離装置
US20110061679A1 (en) * 2004-06-17 2011-03-17 Uvtech Systems, Inc. Photoreactive Removal of Ion Implanted Resist
WO2006051585A1 (ja) * 2004-11-10 2006-05-18 Mimasu Semiconductor Industry Co., Ltd. 枚葉式ウェーハ処理装置
US7921859B2 (en) 2004-12-16 2011-04-12 Sematech, Inc. Method and apparatus for an in-situ ultraviolet cleaning tool
JP4761907B2 (ja) * 2005-09-28 2011-08-31 株式会社Sokudo 基板処理装置
CN101900956A (zh) 2005-11-23 2010-12-01 Fsi国际公司 从基材上除去材料的方法
DE102006062035B4 (de) 2006-12-29 2013-02-07 Advanced Micro Devices, Inc. Verfahren zum Entfernen von Lackmaterial nach einer Implantation mit hoher Dosis in einem Halbleiterbauelement
JP5014811B2 (ja) 2007-01-22 2012-08-29 東京エレクトロン株式会社 基板の処理方法
JP2009170554A (ja) 2008-01-11 2009-07-30 Panasonic Corp 半導体装置の製造方法
US20110226280A1 (en) 2008-11-21 2011-09-22 Axcelis Technologies, Inc. Plasma mediated ashing processes
KR20100067814A (ko) * 2008-12-12 2010-06-22 삼성전자주식회사 표시 기판 및 이의 제조 방법
US20100224215A1 (en) * 2009-03-06 2010-09-09 Imec Method for Reducing the Damage Induced by a Physical Force Assisted Cleaning
JP2011228438A (ja) * 2010-04-19 2011-11-10 Panasonic Corp 基板洗浄方法及び基板洗浄装置
KR101665036B1 (ko) * 2010-04-27 2016-10-24 티이엘 에프에스아이, 인코포레이티드 기판 표면 근방의 유체 혼합을 제어하는 마이크로전자 기판의 습식 처리
US8772170B2 (en) * 2010-09-01 2014-07-08 Arizona Board Of Regents On Behalf Of The University Of Arizona Enhanced stripping of implanted resists
US9257292B2 (en) 2011-03-30 2016-02-09 Tokyo Electron Limited Etch system and method for single substrate processing

Similar Documents

Publication Publication Date Title
JP2015523735A5 (https=)
JP2013522425A5 (https=)
JP2016125091A5 (https=)
MX2016004260A (es) Particula de suministro que contiene agente benefico con base en copolimero de estireno anhidrido maleico.
JP2014081108A5 (https=)
MY181266A (en) Use of compositions comprising a surfactant and a hydrophobizer for avoiding anti pattern collapse when treating patterned materials with line-space dimensions of 50 nm or below
JP2013150875A5 (https=)
JP2014513036A5 (https=)
WO2011158039A8 (en) Ureido-pyrazole derivatives for use in the treatment of respiratory syncitial virus (rsv) infection
JP2014503607A5 (https=)
JP2013234106A5 (https=)
WO2012163678A3 (de) Verfahren zur herstellung geschäumter tapeten
WO2013142471A3 (en) Cross linked silicone copolmyer networks in a thickened aqueous phase
EP3666076A3 (en) Agricultural pesticide compositions
JP2019046850A5 (https=)
MX367560B (es) Composicion cosmetica.
HK1215190A1 (zh) 载体连接型前列腺素类前药
WO2015173427A3 (fr) Composition a action rapide d'insuline comprenant un compose anionique substitue et un compose polyanionique
JP2013533867A5 (https=)
PH12017500150A1 (en) Coated rice seed and method for producing same
WO2015038689A3 (en) Cationic antiseptic compositions
JP2014518255A5 (https=)
PT2586888T (pt) Fonte de evaporação por arco tendo uma velocidade de formação de película elevada, dispositivo de formação de película e processo de fabrico de película de revestimento usando a fonte de evaporação por arco
WO2016050697A3 (en) Powdered heat activatable adhesives
WO2014043243A3 (en) Platinum compounds, compositions and methods for the treatment of cancer